Did You Know...
...that the x-ray was discovered purely by accident? When German physicist Wilhelm Konrad von Roentgen was experimenting with cathode rays in 1895, he put an activated Crookes tube in a book and went out to lunch. When he returned, he discovered that a key that had also been placed in the book showed up as an image on the developed film!
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| Number | Title | Issue Date |
| 6131795 | Thermal compression bonding method of electronic part with solder bump A thermal compression bonding method of an electronic part with a solder bump comprises the steps of, pressing the electronic part with the solder bump to a circuit board by a thermal compression bonding tool vertically moving by vertical moving means and... | 10/17/2000 |
| 6128818 | Method for testing integrated circuits which are on printed circuit boards An integrated circuit (IC) device is mounted onto a printed circuit board (PCB) by inducing a magnetic field of a selected strength at the surface of the PCB to temporarily hold the IC device onto the PCB. The IC device is provided with magnetic material ... | 10/10/2000 |
| 6126061 | Element made of composite material including electrical continuity through the element The subject of the invention is an element made of composite material comprising an organic matrix which is reinforced with mineral or organic fibers, as well as at least one assembly with partial superposition of at least two electrically conductive elon... | 10/03/2000 |
| 6126060 | Soldering device A soldering device adaptable to dipping method for preventing neighboring leads (L) from being mixed in molten lead (Pb) even though spaces between leads (L) of parts mounted to a PCB substrate (P) are relatively narrow, the device having a lead tub where... | 10/03/2000 |
| 6125043 | Circuit board arrangement with accurately positioned components mounted thereon The circuit board (1) has a component (101) mounted on it by means of a soldering process which causes an automatic, passive alignment of the component (101) due to the surface tension in a melted piece of solder which electrically connects two pads (2, 1... | 09/26/2000 |
| 6119918 | Solder head control mechanism A solder head control mechanism which uses a movable small size and simply structured acoustic coil linear servomotor to directly drive a solder head to perform soldering operation. The solder head links with a position sensor, a controller and a current ... | 09/19/2000 |
| 6115912 | Apparatus and method for printed circuit board repair A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between ... | 09/12/2000 |
| 6115262 | Enhanced mounting pads for printed circuit boards There is disclosed herein a printed circuit board (PCB) having enhanced mounting pads useful for overprinting solder paste and for repair of the solder joints. The PCB comprises: a dielectric substrate 10 having at least one mounting pad 20 thereon, where... | 09/05/2000 |
| 6113053 | Electronic chip component for measurement and tape cartridge holding the same An electronic chip component for measurement formed by bending a plate material into a structure having an end face substantially in the shape of a square C comprises a cross-link section at the top portion thereof, leg sections formed individually on the... | 09/05/2000 |
| 6110815 | Electroplating fixture for high density substrates A method of electroplating a high density integrated circuit (IC) substrate using a conductive elastomer including the steps of providing an IC substrate made of nonconductive material having a plurality of conductive traces with conductive trace lands fo... | 08/29/2000 |
| 6107181 | Method of forming bumps and template used for forming bumps A method of manufacturing a template having through-holes for attracting and supporting electrically conductive balls by vacuum suction is disclosed. The through-holes are formed by etching and the side walls of the through-holes are smoothed by irradiati... | 08/22/2000 |
| 6101098 | Structure and method for mounting an electric part A structure in which an electronic part is mounted on a substrate via mount resin and has electrodes thereof connected to electrodes arranged on the substrate for wire bonding by conductors is disclosed. A frame for preventing the mount resin from flowing... | 08/08/2000 |
| 6100175 | Method and apparatus for aligning and attaching balls to a substrate A method for aligning and bonding balls to substrates, such as semiconductor wafers, dice and packages, is provided. The method employs a ball retaining plate having a pattern of micromachined cavities and vacuum conduits for retaining the balls. In addit... | 08/08/2000 |
| 6099935 | Apparatus for providing solder interconnections to semiconductor and electronic packaging devices An apparatus for use in manufacturing a semiconductor device having input-output (IO) lands arranged in an IO array on an IO face includes a body having a plurality of cavities extending from an operating face into the body; the cavities are arranged in a... | 08/08/2000 |
| 6097609 | Direct BGA socket An electronic packaging assembly is disclosed. An electronic component is disposed on a socketing substrate utilizing a ball grid array or land grid array. The socketing substrate contains a series of pins that are embedded within the thickness of the soc... | 08/01/2000 |
| 6095405 | Method for soldering integrated circuits Any one of at least two holding blocks loaded in a holding block storing portion is picked up and moved to cover an IC on a PCB of a PCB array. A light beam is applied to the whole surface of the PCB. The holding block is moved from the PCB to the holding... | 08/01/2000 |
| 6095404 | Method for assembling high temperature electronics A method for soldering electronic components capable of withstanding high temperature applications. A solder having a composition in the range between 83 and 87% lead, between 8.5 and 11.5% antimony, and the balance of tin provides superior results. The s... | 08/01/2000 |
| 6092713 | Automated stacking and soldering apparatus for three dimensional stack package devices and manufacturing method thereof An automated apparatus for three dimensional stack package devices provides mass production of J-lead type stack packages. The apparatus includes a package loader and a package loader/unloader for loading upper and lower individual packages and for unload... | 07/25/2000 |
| 6093630 | Semi-conductor personalization structure and method The preferred embodiment of the present invention provides a structure and method for personalizing a semiconductor device in the context of a bump array connection to packaging, substrates and such. The preferred embodiment method uses a plurality of con... | 07/25/2000 |
| 6084782 | Electronic device having self-aligning solder pad design A substrate (200) to which a component (210) is mounted includes at least two mounting pads (215, 220) formed thereon for electrically coupling to a single terminal of the component (210) and for aligning the component (210) on the substrate (200) during ... | 07/04/2000 |
| 6080936 | Connecting board with oval-shaped protrusions A connecting board is provided for disposition between a base plate such as a LGA base plate and a mounting board such as a printed circuit board. The connecting board has a substrate having a plurality of through holes. Each through hole extends between ... | 06/27/2000 |
| 6078505 | Circuit board assembly method A method is disclosed for attaching a device package to a circuit board with a chip mount area that has a set of elongated pads located near the perimeter of a chip mount area. In accordance with this method, a mask is formed on the circuit board. A plura... | 06/20/2000 |
| 6076723 | Metal jet deposition system A metal jet, metal deposition system has metal jets disposed in an oxygen-free chamber. The metal jets eject droplets of a wetting metal onto conductors on an electrical substrate followed by solder metal. Banks of metal jets can be used to print conducto... | 06/20/2000 |
| 6073829 | Method and arrangement for attaching a component The invention is related to a method of fabricating an attachment bump of a component (11). In accordance with the invention, a flexible preform (13a) is fabricated, which is plated with materials (13b) appropriate for metallurgical bonding. The invention... | 06/13/2000 |
| 6068175 | System for replacing a first area array component connected to an interconnect board Apparatus for connecting a first area array component to a substrate with a joining material. The apparatus has a nozzle directing heat toward both the first area array component and the portion of the substrate beneath the first area array component to m... | 05/30/2000 |
| 6065666 | Device for soldering a series of connectors and a method of use A soldering member includes an elongated heating element for soldering a series of connectors. The elongated heating element of the soldering member is flexibly supported via a rigid base for adjusting the orientation of the heating element to align with ... | 05/23/2000 |
| 6056191 | Method and apparatus for forming solder bumps The present invention discloses a method and apparatus for forming solder bumps by a molten solder screening technique in which a flexible die head constructed of a metal sheet is utilized for maintaining an intimate contact between the die head and a sol... | 05/02/2000 |
| 6057222 | Method for the production of flip-chip mounting-ready contacts of electrical components Contacts of SAW components are produced which are suitable for flip-chip mounting. Electrically conductive structures on a substrate are tightly encapsulated within a cover and contact pads of the electrically conductive structures are exposed in a window... | 05/02/2000 |
| 6045032 | Method of preventing solder reflow of electrical components during wave soldering A method of preventing solder reflow of a SMT component (14) attached with solder (22) to a circuit board (10) that subsequently undergoes a wave soldering operation. The method generally entails the use of a thermal shield (18, 28) that is either part of... | 04/04/2000 |
| 6039238 | Electrical connection method A method of making an electrical connection stable over a wide temperature range between terminals on a metal or ceramic substrate comprising applying pressure to the connection and ultrasonically welding the terminals together.... | 03/21/2000 |
| 6033787 | Ceramic circuit board with heat sink A ceramic circuit board with a heat sink which has a long life under heat cycles. First and second aluminum plates are laminated and bonded onto both sides of a ceramic substrate through Al--Si-based brazing solders, respectively. A heat sink formed of an... | 03/07/2000 |
| 6031728 | Device and method for interconnection between two electronic devices The present invention relates to the interconnection of two electronic devices (2 and 3) by means of an interconnection device (1). According to the invention, the interconnection device (1) has metallized grooves (17, 18) in its edge, each in electrical conne... | 02/29/2000 |
| 6019274 | Semiconductor device and mounting method therefor A reflow mounting method and a semiconductor device for efficient manufacture of TCPs superior in reliability by preventing the deformation of leads and ensuring a dependable contact between the bonding pads on a circuit board and the leads, wherein metal... | 02/01/2000 |
| 6016947 | Non-destructive low melt test for off-composition solder A non-destructive method for identifying off-composition solder columns of for example, a ceramic column grid array. The method is performed at the ceramic module level prior to card assembly to avoid costly loss or rework post card assembly. The assembly... | 01/25/2000 |
| 6016949 | Integrated placement and soldering pickup head and method of using A pickup head adapted to pick up an electronic component from a supply source, support the component during transport from the supply source to a substrate, and position the electronic component at a site on the substrate has a means for heating the elect... | 01/25/2000 |
| 6012225 | Method of making surface mount pads An apparatus and method for establishing a reliable compressive electrical connection between an electronic package and surface mount pads (6) of the printed circuit board (4) are disclosed. Contact pads (2) are solderable to pads (6) of the printed circu... | 01/11/2000 |
| 6010060 | Lead-free solder process A high solidus temperature, high service temperature, high strength ternary solder alloy, solder paste and method. The alloy contains a major proportion of tin of at least about 70% by weight, a selectively limited amount of silver from about 6.5 to about... | 01/04/2000 |
| 6010056 | Gimbal horn pressure head with shape of pivot rod bearing corresponding to shape of contact surface A pressure head (10) for contacting a contact area of workpiece (230) through relative movement in the vertical Z-direction includes a frame (20), a horn (100) for contacting the workpiece (230) and a gimbal (40) connected to the frame (20). The gimbal (4... | 01/04/2000 |
| 6010061 | Reflow soldering method With the present invention, a reflow soldering method is provided for soldering a nonvertically approaching lead, which is part of a nonvertically approaching device (e.g, an edge connector), to a corresponding soldering surface (e.g., a pad on a circuit ... | 01/04/2000 |
| 6006980 | Method and apparatus for mounting connector to circuit board A surface mount electrical connector incorporating features to facilitate alignment of contact tails to contact pads on a printed circuit board. The contact tails are held together with a tie bar. Tabs on the tie bar are shaped to engage features on a bla... | 12/28/1999 |
