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| Number | Title | Issue Date |
| 4115601 | Flexible circuit reflow soldering process and machine A process and machine are disclosed for reflowing solder plated continuous flexible circuit webs. During reflow in a vapor environment, the flexible web is maintained in a planar orientation to produce a relatively uniform distribution of solder. Virtuall... | 09/19/1978 |
| 4103814 | Chip bonding unit Disclosed herein is a chip bonding unit including a collet for holding a semiconductor chip, a table or bed for mounting the chips and a working table for holding a base plate to which the chip is to be attached, said collet being capable of relative move... | 08/01/1978 |
| 4079509 | Method of manufacturing semi-conductor devices Semiconductor devices are mounted on corresponding lead frames by being inserted into apertures of a masking member in a desired registration with the lead frame strip.... | 03/21/1978 |
| 4067039 | Ultrasonic bonding head A bonding head particularly suitable for ultrasonic bonding of larger dimensioned wires to electrically conductive metallic regions for the semiconductor field comprising a stepped impact surface for simultaneously effecting an ultrasonic bond between the... | 01/03/1978 |
| 4050618 | Flexible lead bonding apparatus An apparatus for bonding the flexible leads of a sprocketed lead frame tape to the terminals of an integrated circuit device is provided with a movable index station, movable bonding anvil means and a vertically moving bonding tool. The flexible leads on ... | 09/27/1977 |
| 4040169 | Method of fabricating an array of semiconductor devices A method for fabricating a semiconductor diode array, utilizing an alignment tool to precisely position a plurality of diodes so that they can be bonded into a precision array. The alignment tool and a method for fabricating the tool are also disclosed.... | 08/09/1977 |
| 4032058 | Beam-lead integrated circuit structure and method for making the same including automatic registration of beam-leads with corresponding dielectric substrate leads A beam-lead integrated circuit chip structure which comprises a semiconductor chip substrate having a passivated planar surface from which active and passive devices in the circuit extend into the substrate. A plurality of peripheral beam-leads interconne... | 06/28/1977 |
| 4012835 | Method of forming a dual in-line package A lead frame assembly of indefinite length having a pair of spaced parallel carrier strips, collapsible rungs extending between the strips at regular intervals along the length of the assembly and a number of leads extending inwardly from the opposed edge... | 03/22/1977 |
| 4004726 | Bonding of leads Leads are bonded to a substrate by interposing between the substrate and the leads a conductor portion having substantially the same thickness as the thickness of the leads. In the preferred embodiment, the conductor portion is an end portion of the lead ... | 01/25/1977 |
| 4000842 | Copper-to-gold thermal compression gang bonding of interconnect leads to semiconductive devices Gang bonding structures for connecting a semiconductive device to associated circuitry includes both copper and gold portions which are heated and pressed into thermal compression bonding relation. The resultant bond comprises a solid state interdiffusion... | 01/04/1977 |
| 3998377 | Method of and apparatus for bonding workpieces A method of and apparatus for bonding together a first and a second workpiece, which are bondable by applying energy thereto while they are urged together at a bonding site. First, the workpieces are urged together by moving into engagement with the first... | 12/21/1976 |
| 3982317 | Method for continuous assembly and batch molding of transistor packages A method is described for continuously assembling transistors to a lead frame, capable of high speed production by automatic machinery. A carrier ribbon bearing transistor chips is fed to a work station to which a lead frame is also fed at about right ang... | 09/28/1976 |
| 3982979 | Methods for mounting an article on an adherent site on a substrate A plurality of small articles, such as beam-lead semiconductor devices, are precisely positioned by placing them on the ends of tubular members which are centered in cavities having the form of inverted, truncated, pyramids. The smallest cross section of ... | 09/28/1976 |
| 3968563 | Precision registration system for leads Sets of finger-like leads for attachment to semiconductive devices which have a plurality of metallic electrical contacts are etched in a copper foil mounted on a temporary carrier strip simultaneously with indexing holes. The indexing holes are then used... | 07/13/1976 |
| 3967366 | Method of contacting contact points of a semiconductor body A method of contacting contact points of a semiconductor body comprises first attaching the semicoductor body to a heat conducting portion of a first frame with inwardly directed tongues directed towards the contact points, positioning a second frame with... | 07/06/1976 |
| 3958740 | Automatic component assembly machine and method relating thereto A programmable manipulation machine for picking up a succession of small components, such as semiconductor chips, and placing them precisely in predetermined positions on a work-piece, such as a substrate. The machine includes a vacuum chuck assembly whic... | 05/25/1976 |
| 3957185 | Methods of and apparatus for thermocompression bonding with a compensating system In making electronic components, it is often necessary to bond a lead frame to an insulating substrate. In carrying out the bonding, it is desirable to provide compensation to prevent cracking of the substrate. At the same time it is also desirable to pre... | 05/18/1976 |
| 3956821 | Method of attaching semiconductor die to package substrates A method of attaching semiconductor die to package substrates, which employs a zinc-aluminum alloy. The alloy is formed into the shape of a platelet. The platelet is melted on the die attach surface of a package substrate, and the semiconductor die is bon... | 05/18/1976 |
| 3949925 | Outer lead bonder Bonding apparatus bonds inner leads on a film carrier to outer leads. Outer lead frame stock and the film carrier bearing the inner leads and dies are fed to the bonding site. A set of inner leads and the die thereto bonded is punched from the film carrie... | 04/13/1976 |
| 3948429 | Apparatus for thermocompression bonding Leads are bonded to thin-film conductors on a substrate by the application of heat and pressure of a thermode. The thermode encloses a fusible material, adjacent its tip, which is heated and fused during the nonbonding portion of a bonding cycle. During t... | 04/06/1976 |
| 3946931 | Methods of and apparatus for bonding an article to a substrate A bonder for attaching in succession small articles such as electronic devices to substrates has eight stations located along the path of a rotary member. The rotary member supports eight holders for substrates which are moved in sequence from station to ... | 03/30/1976 |
| 3942245 | Related to the manufacture of lead frames and the mounting of semiconductor devices thereon A support for a semiconductor device comprises a lead frame having a matrix of cranked conductors, which may be on an insulating substrate, with a recess being defined within the lead frame, the arrangement being such that by merely placing a correctly or... | 03/09/1976 |
| 3941297 | Method and apparatus for simultaneously bonding a plurality of lead frames to a plurality of planar articles Method and apparatus are disclosed for concurrently thermocompression bonding a plurality of lead frames to a plurality of planar articles. In operation, a plurality of lead frames are referenced to a plurality of unheated bonding tips and to the associat... | 03/02/1976 |
| 3937386 | Flip chip cartridge loader A method and apparatus for positioning semiconductor flip chips onto one end of a transfer probe which automatically magnetically aligns the chips with an overlying lead frame structure for bonding thereto. The flip chips are placed into one end of an elo... | 02/10/1976 |
