Did You Know...
...that Thomas Edison's patent application on his phonograph was approved by the Patent Office in just seven weeks? In contrast, it took Gordon Gould, the inventor of the laser, 30 years to obtain his patent -- finally awarded in 1988!
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| Number | Title | Issue Date |
| 7344060 | Apparatus and method for aligning solder pads during head gimbal assembly soldering A device for orienting an integrated lead suspension tail during a head gimbal assembly soldering operation of a head stack assembly process is disclosed. The device includes a body portion and at least one pin extending from the body portion. The pin(s) is configur... | 03/18/2008 |
| 7342409 | System for testing semiconductor components A system for testing semiconductor components includes an interconnect, an alignment system for aligning a substrate to the interconnect, a bonding system for bonding the component to the interconnect, and a heating system for heating the component and the interconn... | 03/11/2008 |
| 7337534 | SMD chip handling apparatus The apparatus is for securely fetching and positioning an SMD chip on a printed circuit board and soldering the same to the board. Two spring plates form the clasping fingers which are wedged apart to a width larger than the width of the SMD chip by an expander form... | 03/04/2008 |
| 7332424 | Fluxless solder transfer and reflow process Disclosed is a new process that permits the transfer and reflow of solder features produced by Injection Molded Solder (IMS) from a mold plate to a solder receiving substrate without the use of flux. Several embodiments produce solder transfer and reflow separately ... | 02/19/2008 |
| 7331500 | Solder bumps formation using solder paste with shape retaining attribute Method of forming solder bumps of an integrated circuit package is described. A solder paste is formed from a material having a characteristic that the deposited instances thereof substantially retain their geometric shape upon exposure to electromagnetic radiation.... | 02/19/2008 |
| 7332411 | Systems and methods for wafer bonding by localized induction heating A system and method bond wafers using localized induction heating. One or more induction micro-heaters are formed with a first substrate to be bonded. A second substrate is positioned in intimate contact with the induction micro-heaters. An alternating magnetic fiel... | 02/19/2008 |
| 7328830 | Structure and method for bonding to copper interconnect structures An integrated circuit structure and a method for fabricating the structure. The method comprises forming a copper bond pad for attaching the integrated circuit to a package. Copper oxide is removed from the pad by reduction in a hydrogen ion atmosphere. For attachin... | 02/12/2008 |
| 7325716 | Dense intermetallic compound layer Apparatus and methods of fabricating a bump limiting metallization structure including a two-step bump reflow process that reduces intermetallic compound porosity, increases bump strength, improve die yield, and device reliability. The first step comprises annealing... | 02/05/2008 |
| 7322511 | Apparatus and method for printing micro metal structures A method and device for printing liquid material such as liquid solder is provided. C4 structures as small as 10 microns in diameter can be produced using devices and methods described above. Further, devices and methods provided are able to operate at temperatures ... | 01/29/2008 |
| 7320426 | Cover for ball-grid array connector A presently-preferred embodiment of a cover for a ball-grid array connector comprises a top member and a first and a second side member adjoining opposing ends of the top member. The first and the second side members each have a mating feature formed thereon for eng... | 01/22/2008 |
| 7316062 | Solder extraction tool and method Methods and apparatus are provided for removing plating from a device. The method and apparatus may be used for preparing an electrical connector for connecting at least one wire or other terminus thereto where the electrical connector has at least one electrical co... | 01/08/2008 |
| 7317165 | Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate An intermediate substrate comprising: an intermediate substrate body containing an insulating material, and having a first face to be mounted with an semiconductor element and a second face opposing to said first face; and a semiconductor element mounting area inclu... | 01/08/2008 |
| 7301103 | Printed-wiring board, printed-circuit board and electronic apparatus A printed-wiring board having a multiplayer structure including a plurality of insulating layers and a plurality of conducting layers includes a signal pattern provided in at least one of outermost layers of the conducting layers which includes a plurality of pad po... | 11/27/2007 |
| 7291549 | Method and structure to reduce risk of gold embrittlement in solder joints A method for reducing gold embrittlement in solder joints, and a copper-bearing solder according to the method, are disclosed. Embodiments of the invention comprise adding copper to non-copper based solder, such as tin-lead solder. The embodiments may further compri... | 11/06/2007 |
| 7288845 | Fabrication of wire bond pads over underlying active devices, passive devices and/or dielectric layers in integrated circuits A wire connection structure for an integrated circuit (IC) die includes a semiconductor wafer with an active device and/or a passive device. One or more dielectric layers are arranged adjacent to the active and/or passive device. One or more metal interconnect layer... | 10/30/2007 |
| 7288742 | Method and device for heating a strip-shaped carrier According to a method and a device for heating a strip-shaped carrier in an oven, a carrier is passed through the oven in a direction of conveyance. The carrier is supported by a heatable plate, which together with the carrier is moved through the oven stepwise with... | 10/30/2007 |
| 7285018 | Electrical connector incorporating passive circuit elements An electrical connector that electrically connects a first printed circuit board and a second printed circuit board is disclosed, where the electrical connector in the preferred embodiment includes: (a) an insulative housing; (b) a plurality of signal conductors, wi... | 10/23/2007 |
| 7284941 | Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape A method and apparatus for picking up a semiconductor chip, a method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape are provided. Air may be blown through air holes in a dicing tape to at least pa... | 10/23/2007 |
| 7271497 | Dual metal stud bumping for flip chip applications A method for forming a stud bumped semiconductor die is disclosed. The method includes forming a ball at the tip of a coated wire passing through a hole in a capillary, where the coated wire has a core and an oxidation-resistant coating. The formed ball is pressed t... | 09/18/2007 |
| 7267558 | Electrical connector with contact An electrical connector includes an insulative housing adapted to engage a conductive contact (20). The conductive contact has a tail end, wherein the tail end (22) is angled and has a generally dished shape such that at least a portion of the tail end... | 09/11/2007 |
| 7263769 | Multi-layered flexible print circuit board and manufacturing method thereof A multi-layered flexible print circuit board comprising an insulating layer, a circuit layer formed on the front and back surfaces of the insulating layer and a hole connecting between the circuit layers via the insulating layer, wherein there is provided an electri... | 09/04/2007 |
| 7264482 | Anisotropic conductive sheet An anisotropic conductive sheet capable of transmitting high-speed digital signals reliably is provided. The anisotropic conductive sheet has a conductive property in a thickness direction thereof under a predetermined condition, and includes: insulative matrix memb... | 09/04/2007 |
| 7260890 | Methods for fabricating three-dimensional all organic interconnect structures The present invention includes methods for making liquid crystalline polymer (LCP) interconnect structures using a high temperature and low temperature single sided liquid crystalline polymer LCP where both the high and low temperature LCP are drilled to form a z-ax... | 08/28/2007 |
| 7262495 | 3D interconnect with protruding contacts This invention relates to a semiconductor having protruding contacts comprising, a first semiconductor substrate having at least one interconnect located substantially within the first substrate, and a second semiconductor substrate having at least one protruding co... | 08/28/2007 |
| 7257887 | Die holding apparatus for bonding systems A die holding apparatus to form electrical contacts on individual dies is described. In one embodiment, a semiconductor device holder is used to hold individual dies for processing and reprocessing. The semiconductor device holder holds each individual die in a sepa... | 08/21/2007 |
| 7258264 | Methods for manufacturing optical modules using lead frame connectors Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards are disclosed. The lead frame connector includes an electrically insulating case having a first part separated from a secon... | 08/21/2007 |
| 7251880 | Method and structure for identifying lead-free solder A method and apparatus are provided for determining whether solder used during assembly of a printed circuit board is lead-free or not. This may include providing a pad on the printed circuit board and placing solder on the pad in a predetermined pattern. The solder... | 08/07/2007 |
| 7249411 | Methods for mounting surface-mounted electrical components Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component retentive pins and retentive through holes, during a reflow process. E... | 07/31/2007 |
| 7245022 | Semiconductor module with improved interposer structure and method for forming the same Under the present invention, a semiconductor chip is electrically connected to a substrate (e.g., organic, ceramic, etc.) by an interposer structure. The interposer structure comprises an elastomeric, compliant material that includes metallurgic through connections ... | 07/17/2007 |
| 7238543 | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties A method used for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including backgrinding in particular. The present method comprises reducing the cros... | 07/03/2007 |
| 7237331 | Electronic part manufacturing method and electronic part Provided is a method of manufacturing an electronic part having a plurality of wiring patterns and an insulating layer interposed between the wiring patterns and serving to establish electrical connection between the wiring patterns through an interlayer connecting ... | 07/03/2007 |
| 7235871 | Stacked microelectronic dies An assembly of microelectronic devices and method for forming an assembly of microelectronic devices. In one embodiment, the method includes positioning a first packaged microelectronic device adjacent to a support member having support member circuitry, with the fi... | 06/26/2007 |
| 7235886 | Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby A chip-join process to reduce elongation mismatch between the adherents involves thermally expanding each of a coefficient of thermal expansion mismatched semiconductor chip and substrate a substantially equal amount from their room temperature state in a direction ... | 06/26/2007 |
| 7226298 | Electrical connector with segmented housing Preferred embodiments of electrical connectors include a plurality of electrically-conductive contacts each having a lead portion, a plurality of solder balls each attached to the lead portion of a respective one of the contacts, and a housing having plurality of pe... | 06/05/2007 |
| 7222776 | Printed wiring board and manufacturing method therefor A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating te... | 05/29/2007 |
| 7216792 | Self assembled nano-devices using DNA An article of manufacture including an organic structure and inorganic atoms bonded to specific locations on the organic structure. ... | 05/15/2007 |
| 7211901 | Self-coplanarity bumping shape for flip chip A stud bump structure for electrical interconnection between a pair of members includes a base portion, and a stem portion. The base portion is affixed to a pad or trace in one of the pair of members to be interconnected (such as an integrated circuit chip), and the... | 05/01/2007 |
| 7208830 | Interconnect shunt used for current distribution and reliability redundancy In one embodiment of the invention, an integrated circuit package includes an integrated circuit, a package substrate, a first bump, a second bump and a shunt to provide for current distribution and reliability redundancy. The first and second bumps provide a first ... | 04/24/2007 |
| 7205177 | Methods of bonding two semiconductor devices A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main su... | 04/17/2007 |
| 7199342 | Self-aligned mechanical joint between die and substrate exposed to mixed microwave energy The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowin... | 04/03/2007 |
