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| Number | Title | Issue Date |
| 5825629 | Print circuit board product with stencil controlled fine pitch solder formation for fine and coarse pitch component attachment A product created through the reflow of low melting point solder on select contacts of a printed circuit board. In one form, the printed circuit board has fine pitch devices, including flip-chip integrated circuits, connected to a board having conventiona... | 10/20/1998 |
| 5809642 | Method for detecting deterioration of solder paste printing A method for detecting deterioration of solder paste printing includes defining a check pattern region on a portion of the printed circuit board PC separated from the electrical circuit, forming fine pitch check through-holes 8a in the metal mask 7 with a... | 09/22/1998 |
| 5806179 | Method for connecting a cable to a printed circuit board A cable header assembly for mounting a cable in an electronic device, the assembly including a connecting member fixedly connected to a plurality of wires of the cable such that the wires are maintained at a predetermined spacing. The connecting member in... | 09/15/1998 |
| 5807626 | Ceramic circuit board A ceramic circuit board is characterized by being constituted by bonding a ceramic substrate 2 and a metal circuit plate 3 to each other through a silver-copper-based brazing material layer 5 containing at least one active metal selected from Ti, Zr, Hf, ... | 09/15/1998 |
| 5803343 | Solder process for enhancing reliability of multilayer hybrid circuits A thick film hybrid multilayer circuit characterized by circuit components that are electrically interconnected with a multilayer structure composed of multiple layers of conductors interlaid with layers of a dielectric material in order to achieve high c... | 09/08/1998 |
| 5796590 | Assembly aid for mounting packaged integrated circuit devices to printed circuit boards An apparatus and method for surface-mounting ball grid array integrated circuit (IC) devices to printed circuit boards. A thin single- or multi-layer sheet of nonconductive material having a plurality of apertures corresponding to the leads of the IC devi... | 08/18/1998 |
| 5787580 | Method for making radio-frequency module by ball grid array package A method for making a RF module by a ball grid array package includes: perforating a feed-through hole which penetrates top and bottom surfaces of a terminal position of a chip populated on a substrate; forming a conductive line connecting top and bottom ... | 08/04/1998 |
| 5784779 | Method for joining an electrical connection of a non-packaged IC component with a conductive strip on a substrate A method for joining an electrical connection (10) of a non-packaged IC component (15) with a conductive strip (35) on a substrate (30). An easy to metallize layer (20) preferably is applied to the surface of an electrical connection (10) that is to be co... | 07/28/1998 |
| 5768776 | Method for forming a controlled impedance flex circuit A system and method for providing a controlled impedance flex circuit includes providing an insulative flexible substrate having opposed first and second surfaces and having through holes extending from the first surface to the second surface. A pattern o... | 06/23/1998 |
| 5766674 | Method of producing a printed wiring board In a method of producing a printed wiring board, solder layers are formed on pads beforehand. After the solder layers have been covered with a solder resist, the solder layers are caused to flow so as to render only the portion of the solder resist overly... | 06/16/1998 |
| 5764485 | Multi-layer PCB blockade-via pad-connection A special so called BLOCKADE-Via™ apparatus and technique for more efficient circuiting and assembly of electronic components on a multilayer parallel-conductivity "printed-circuit board" employing high-density conductor-pins and solder-ball constructio... | 06/09/1998 |
| 5743459 | Method for fabricating semiconductor device with step of bonding lead frame leads to chip pads The method for fabricating a semiconductor device disclosed is to bond an inner lead and a pad of a semiconductor chip together using a bonding tool. The bonding tool has a bottom peripheral end being formed in either a circular arc shape with a curvature... | 04/28/1998 |
| 5743457 | Controlled zone solder dispensing A solder dispensing apparatus for depositing fluid solder into and around a pin-in-through-hole joining zone of an electronic circuit board which comprises: a valve assembly defining a valve chamber with an inlet and an outlet, and having the valve member... | 04/28/1998 |
| 5742483 | Method for producing circuit board assemblies using surface mount components with finely spaced leads Where an electrical connection is needed between an electric circuit on a substrate and a component with very finely spaced leads, pads are formed on the substrate at points where such connections to the circuit are to be made. A solder paste is deposited... | 04/21/1998 |
| 5731960 | Low inductance decoupling capacitor arrangement A noise suppression apparatus for a printed circuit board (PCB) having two PCB pad regions, each containing a boundary pad region and a mounting pad region, wherein both boundary pad regions contain via connections. A decoupling capacitor is coupled to bo... | 03/24/1998 |
| 5730932 | Lead-free, tin-based multi-component solder alloys The present invention provides a solder alloy having from about 80-81% tin, from about 2-4% silver, from about 5-6% indium, and from about 10-12% bismuth by weight, and microelectric circuits soldered by this alloy.... | 03/24/1998 |
| 5731066 | Electronic circuit device In an electronic circuit device having an input/output pin junction electrode, in order to remarkably improve the junction characteristics such as wettability and junction strength and to drastically simplify the production process, in forming an electron... | 03/24/1998 |
| 5722160 | Packaging method of BGA type electronic component A packaging method of an electronic component for packaging the electronic component to a packaging substrate comprises the steps of: forming a predetermined quantity of solder bumps at connection portions of the electronic component; forming through-hole... | 03/03/1998 |
| 5699611 | Method of hermetically self-sealing a flip chip A package containing an integrated circuit has all of its I/O contacts on one of the package faces. The periphery of that face is processed to be wettable with solder. The substrate to which the package is to be attached has corresponding contacts and has... | 12/23/1997 |
| 5699610 | Process for connecting electronic devices In a first step, a first substrate is prepared. The first substrate has a first surface, a second surface, and a through-hole therebetween. In a second step, a second substrate is prepared. The second substrate has a first surface, a second surface, and a... | 12/23/1997 |
| 5700987 | Alignment and bonding techniques A method for aligning and soldering a first device (11) to a substrate (16) comprises the steps of providing a plurality of solder elements (17) between the first device and the substrate, aligning the first device, and then reflowing and cooling the sold... | 12/23/1997 |
| 5698068 | Thermocompression bonding equipment This invention provides a thermocompression bonding equipment which, when the material to be bonded is to be changed, allows easy replacement and preparation of a compression bonding head, reduction of working time required for replacement and preparation... | 12/16/1997 |
| 5692669 | Printed circuit board A printed circuit board comprising a plurality of lands onto which a plurality of leads of an electronic component are soldered. These lands are arrayed in parallel one another. Each of these lands includes a narrow portion basically extending in a longit... | 12/02/1997 |
| 5687475 | Process for determining the position and/or checking the separation and/or checking the coplanarity of the leads of components In order to determine the position and/or to check the separation of the leads (A) of components (B), a direct shadow of the region of the leads at one side of the component is generated on the photosensitive surface of a local resolution optoelectronic t... | 11/18/1997 |
| 5682675 | Apparatus and method of mounting electronic components A PC board is placed at a specified position by means of a positioning device, and an electronic component to be affixed to a side of the PC board is supplied to a parts holding device by means of a carrying head. The parts holding device holds the electr... | 11/04/1997 |
| 5683788 | Apparatus for multi-component PCB mounting A printed circuit board includes a multi-component mounting footprint for mounting one of several possible differently sized discrete component packages on the circuit board. The multi-component mounting footprint includes a first mounting pad which has t... | 11/04/1997 |
| 5678304 | Method for manufacturing double-sided circuit assemblies A method for manufacturing double-sided circuit assemblies by a surface mount process includes the steps of: arranging the circuit assemblies in arrays so that two or more circuit assemblies, at least one top side up and at least one bottom side up, are p... | 10/21/1997 |
| 5675889 | Solder ball connections and assembly process Two substrates are produced each with a planar, mirror-image matrix of metal contacts in a surface wiring layer. The substrates are positioned with the matrices in parallel confrontation which defines pairs of confronting contacts. A metal ball is positio... | 10/14/1997 |
| 5669137 | Method of making electronic package assembly with protective encapsulant material An electronic package assembly wherein a low profile package is soldered to an organic (e.g., epoxy resin) substrate (e.g., printed circuit board). The assembly's projecting conductive leads are soldered. An encapsulant material (e.g., polymer resin) is u... | 09/23/1997 |
| 5666721 | Method of soldering an electronic connector on a printed circuit board A lead 20 protrudes from a main body 19a of a connector 18. A connector electrode 13 extends along a surface 10a of a printed circuit board 10. A solder paste 26, applied onto the connector electrode 13, is offset a predetermined distance inward from the ... | 09/16/1997 |
| 5659947 | Device for automatically populating a top and a bottom side of printed-circuit boards with SMD components A device is described for automatically populating the top and bottom side of printed-circuit boards with SMD components, synchronously controllable switching points being arranged in the entry and outlet of the SMD (surface mounted device) insertion devi... | 08/26/1997 |
| 5653017 | Method of mechanical and electrical substrate connection The disclosure describes a method of attaching and electrically connecting first and second planar substrates, wherein the first and second substrates have inwardly-facing surfaces with matching patterns of bond pads. The method includes adjusting a wire ... | 08/05/1997 |
| 5647124 | Method of attachment of a semiconductor slotted lead to a substrate A lead (10) for a semiconductor device (12) comprising a strip portion (14) comprising a first substantially horizontal portion (18) connected to the semiconductor device (12), a substantially vertical portion (20) connected to the first substantially hor... | 07/15/1997 |
| 5639013 | Optimally shaped solder joints for improved reliability and space savings A method for improving the reliability of solder joints is disclosed for use in reflow soldering. In the method, a predetermined amount of solder is applied to at least two solder pads on a circuit board and a component having at least two terminals is fi... | 06/17/1997 |
| 5639011 | Attaching components and reworking circuit boards In one aspect, a device for attaching a component to a circuit board is provided, comprising a circuit board held in a holder and a contact heater that heats the component on the circuit board by contact and by conducting heat through the component. In a ... | 06/17/1997 |
| 5639323 | Method for aligning miniature device components A method and structure for affixing a component to a structure in an aligned position facilitates fabrication of diminutive assemblies, such as integrated circuits. The component is placed upon a support structure. The component has an alignment marking. ... | 06/17/1997 |
| 5631447 | Uses of uniaxially electrically conductive articles Polymer (preferably polyimide) sheets (10) with laser ablated through-holes plated with metal (20) are used for making electrical conections to specified microcircuits, especially unbumped microchips and Tape Automated Bonding (TAB) articles. Bonding with... | 05/20/1997 |
| 5631806 | Lead with slits for reducing solder overflow and eliminating air gaps in the execution of solder joints The portion of the lead which is soldered between electrical components in a circuit module includes one or more radially extending slits. Once heated, the fluid solder is drawn into the slits by capillary action. Trapped air escapes, eliminating air pock... | 05/20/1997 |
| 5630270 | Circuit board identification method A circuit board having at least one operational characteristic. The circuit board includes a surface and a plurality of conductive pads accessible from the surface and for electrically coupling electrical components to one another. Further, the circuit bo... | 05/20/1997 |
| 5626280 | Infrared transparent soldering tool and infrared soldering method A soldering tool that comprises a selected salt, including Group I and II halides such as potassium chloride, for example, that is transparent to infrared energy. A selected salt is formed into a tool having a specific shape for placement during soldering... | 05/06/1997 |
