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Apparatus for Simulating a High Five
A self-righting hand-arm configuration which is adapted to pivot when struck by a user, thereby simulating a "high five."
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| Number | Title | Issue Date |
| 8091764 | Joining method and device produced by this method and joining unit A practical bonding technique is provided for solid-phase room-temperature bonding which does not require a profile irregularity of the order of several nanometers, in which a high-vacuum energy wave treatment and continuous high-vacuum bonding are not required.... | 01/10/2012 |
| 8074868 | Fabrication method of semiconductor integrated circuit device Productivity is to be improved in assembling a semiconductor integrated circuit device. A matrix substrate is provided and semiconductor chips are disposed on a first heating stage, then the matrix substrate is disposed above the semiconductor chips on the first hea... | 12/13/2011 |
| 8070046 | Amine flux composition and method of soldering An amine flux composition is provided, comprising, as an initial component: an amine fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected f... | 12/06/2011 |
| 8070047 | Flux composition and method of soldering A flux composition is provided, comprising, as an initial component: a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen... | 12/06/2011 |
| 8070043 | Curable flux composition and method of soldering A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a fluxing agent represented by formula I: wherein R1, R2, R... | 12/06/2011 |
| 8070045 | Curable amine flux composition and method of soldering A curable amine flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; an amine fluxing agent represented by formula I: wherein R1, R | 12/06/2011 |
| 8070044 | Polyamine flux composition and method of soldering A polyamine flux composition is provided, comprising, as an initial component: a polyamine fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently sele... | 12/06/2011 |
| 8047421 | Elliptic C4 with optimal orientation for enhanced reliability in electronic packages An arrangement for the equipping of electronic packages with elliptical C4 connects possessing optimal orientation for enhanced reliability. Furthermore, disclosed is a method providing elliptical C4 connects which possesses optimal orientation for enhanced reliabil... | 11/01/2011 |
| 8011561 | Method of mounting electronic components on printed circuit boards A method of mounting electronic components on a PCB, includes following steps. The PCB is placed with a first side of the PCB facing upwards. A plurality of solder is applied on bonding pads of the first side. A plurality of electronic components is stuck on the bon... | 09/06/2011 |
| 7967184 | Padless substrate for surface mounted components A semiconductor package having a low profile is disclosed. In embodiments, a surface mounted component may be mounted directly to the core of the semiconductor package substrate, so that there is no conductive layer, plating layers or solder paste between the compon... | 06/28/2011 |
| 7926696 | Composition A composition for controlling a temperature elevation of an electronic component when soldering the electronic component on a substrate, includes a first resin for providing the composition with adhesion to the electronic component, a curing agent for curing the fir... | 04/19/2011 |
| 7861912 | Fabrication method of semiconductor integrated circuit device Productivity is to be improved in assembling a semiconductor integrated circuit device. A matrix substrate is provided and semiconductor chips are disposed on a first heating stage, then the matrix substrate is disposed above the semiconductor chips on the first hea... | 01/04/2011 |
| 7854365 | Direct die attach utilizing heated bond head A method is provided for bonding a die comprising a solder layer which has a melting point Tm. A bond head is heated to a bond head setting temperature T1, which is higher than Tm, and a substrate is heated to a substrate setting temperature T2, which ... | 12/21/2010 |
| 7841508 | Elliptic C4 with optimal orientation for enhanced reliability in electronic packages A method providing elliptical C4 connects which possesses optimal orientation for enhanced reliability, as implemented in connection with their installation in electronic packages. Employed are essentially elliptical solder pads or elliptical C4 pad configurations a... | 11/30/2010 |
| 7832618 | Termination bonding Disclosed are methodologies for producing lead type electrical components. Components are placed in a lead frame with termination paste applied to selected portions of the component. Upon firing of the assembled lead frame and electrical components, the electrical c... | 11/16/2010 |
| 7757929 | Methods for manufacturing optical modules having an optical sub-assembly Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards are disclosed. The lead frame connector includes an electrically insulating case having a first part separated from a secon... | 07/20/2010 |
| 7757930 | Fabrication method of semiconductor integrated circuit device Productivity is to be improved in assembling a semiconductor integrated circuit device. A matrix substrate is provided and semiconductor chips are disposed on a first heating stage, then the matrix substrate is disposed above the semiconductor chips on the first hea... | 07/20/2010 |
| 7735715 | Dispensing solder for mounting semiconductor chips A method for mounting a semiconductor chip onto a substrate comprises the steps of positioning a solder dispenser over the substrate and passing a length of solder wire through the solder dispenser to the substrate. The feeding of the wire to the substrate in a feed... | 06/15/2010 |
| 7731076 | Laser trimming problem suppressing semiconductor device manufacturing apparatus and method A semiconductor device manufacturing apparatus includes a substrate holding section that holds a semiconductor wafer substrate, a discharge mechanism that discharges liquid drops of metal paste from a discharge nozzle toward a surface of the semiconductor wafer subs... | 06/08/2010 |
| 7703662 | Conductive ball mounting apparatus and conductive ball mounting method In a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of pads which are provided on a substrate and on which an adhesive is formed, the conductive ball mounting apparatus includes: a conductive ball container for containing ... | 04/27/2010 |
| 7699210 | Soldering an electronics package to a motherboard In some example embodiments, a method includes engaging a first contact on a motherboard with a second contact on an electronic package. A portion of one of the first and second contacts is covered with an interlayer that has a lower melting temperature than both of... | 04/20/2010 |
| 7669752 | Flux for soldering and circuit board A flux contains resin having film forming ability, activator, solvent and at least one complex selected from silver complex and copper complex. The flux is used when soldering is performed onto a circuit having electroless nickel plating or further having gold plati... | 03/02/2010 |
| 7581668 | Method and device for reflow soldering with volume flow control According to one aspect of the invention it is possible to rapidly heat a soldering item by reducing an initially larger volume flow at a constant or increasing temperature, effectively preventing small components from overheating. By using the volume flow of a conv... | 09/01/2009 |
| 7556190 | Method and device for mounting electric component A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive ... | 07/07/2009 |
| 7467742 | Electrically conducting adhesives for via fill applications Electrically conducting adhesives having a broader selectable range of properties are provided by having random sizes of micrometer diameter range particles coated with a low melting temperature metal. The coated particles are suspended in a vehicle of a mixture of ... | 12/23/2008 |
| 7419084 | Mounting method for surface-mount components on a printed circuit board A method for surface mount solder of a comparatively large component is provided wherein a first intermediate component is soldered to a printed wring board and a larger second component is positioned and soldered to the printed wiring board using the intermediate c... | 09/02/2008 |
| 7416106 | Techniques for creating optimized pad geometries for soldering A technique for processing a circuit board involves placing a mask layer on the circuit board, where the mask layer defines a set of pad profiles for a component mounting location. Each pad profile has a set of rounded corners. The technique further involves forming... | 08/26/2008 |
| 7407084 | Method for mounting a semiconductor chip onto a substrate A method for mounting a semiconductor chip onto a substrate the side of which facing towards the substrate is coated with an adhesive layer is characterised by the following steps: (1) Lowering the semiconductor chip until the semiconductor chip touches... | 08/05/2008 |
| 7383977 | Method for attaching a shield can to a PCB and a shield can therefor A method for providing a PCB (printed circuit board) with a shield can (1) comprising a metal shell with a free rim (5). The method prescribes that the rim (5) of the shield can (1) is provided with an extra amount of solder (8) be... | 06/10/2008 |
| 7378297 | Methods of bonding two semiconductor devices A device and a method for bonding elements are described. A first solder ball is produced on a main surface of a first element. A second solder ball is produced on a main surface of a second element. Contact is provided between the first solder ball and the second s... | 05/27/2008 |
| 7360307 | Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors A circuit board module has an IC device, discrete components, and a circuit board structure in electrical communication with the IC device and the discrete component. The circuit board structure includes non-conductive material defining a top surface of the circuit ... | 04/22/2008 |
| 7362562 | Electronic unit of radio system and method of producing the same The invention relates to a method of producing an electronic unit of a radio system automatically, an electronic unit of a radio system and an electronic component. The method of producing an electronic unit of a radio system automatically comprises mounting (802... | 04/22/2008 |
| 7357293 | Soldering an electronics package to a motherboard In some example embodiments, a method includes engaging a first contact on a motherboard with a second contact on an electronic package. A portion of one of the first and second contacts is covered with an interlayer that has a lower melting temperature than both of... | 04/15/2008 |
| 7357288 | Component connecting apparatus When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection material for connecting the electrode of the board with the connection... | 04/15/2008 |
| 7358445 | Circuit substrate and apparatus including the circuit substrate The present invention provides a circuit substrate which has a substrate including a first surface and a second surface opposite to the first surface. A first and a second conductor patterns are formed on the first and the second surface respectively. The second sur... | 04/15/2008 |
| 7357294 | Method for mounting a semiconductor package onto PCB A method for mounting a semiconductor package onto PCB includes a semiconductor package comprising a plurality of outer terminals exposed out of an encapsulant. A PCB having a surface with a plurality of contact pads is provided. Each contact pad has a first exposed... | 04/15/2008 |
| 7351072 | Memory module, memory extension memory module, memory module system, and method for manufacturing a memory module A memory extension memory module, a memory module system, and a memory module is disclosed. The memory module including at least one memory device and a connector for connecting the memory module to a computer system, wherein the memory module additionally includes ... | 04/01/2008 |
| 7351361 | Conductive particles, conductive composition, electronic device, and electronic device manufacturing method A conductive composition layer, conductive particles as a raw material, a conductive composition therefor, a manufacturing method of the conductive composition layer, etc. are provided wherewith heat conductance can be accelerated between electronic devices or elect... | 04/01/2008 |
| 7347354 | Metallic solder thermal interface material layer and application of the same A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert c... | 03/25/2008 |
| 7347349 | Apparatus and method for printing micro metal structures A method and device for printing liquid material such as liquid solder is provided. C4 structures as small as 10 microns in diameter can be produced using devices and methods described above. Further, devices and methods provided are able to operate at temperatures ... | 03/25/2008 |
