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| Number | Title | Issue Date |
| 8113412 | Methods for detecting defect connections between metal bumps A method includes electrically grounding a first plurality of metal bumps on a first surface of an interconnection component to a common ground plate. A voltage contrast (VC) image of a second plurality of metal bumps of the interconnection component is generated. G... | 02/14/2012 |
| 8052029 | Method of calibrating a friction stir spot welding system A method of performing a plurality of friction stir spot welds with a friction stir spot welding (FSSW) system includes measuring a length of a pin of a weld tool of the FSSW system. The length is compared to a first limit to determine if the length is above or belo... | 11/08/2011 |
| 7896218 | Apparatus and method for conductive metal ball bonding with electrostatic discharge detection An apparatus for bonding a conductive lead to a conductive terminal of a device by the use of a conductive metal ball is disclosed and claimed. A ball-forming wire comprises a first conductive metal having a first melting temperature. A clamping surface has a closed... | 03/01/2011 |
| 7874470 | Method and apparatus for testing solderability of electrical components The described embodiments relate generally to methods and apparatus for use in determining solderability of an electrical component. One particular aspect relates to apparatus comprising a vacuum chamber, a load sensor, a platform and a control module. The load sens... | 01/25/2011 |
| 7870991 | Electronic component mounting system and electronic component mounting method In a mounting system having a height measuring instrument for measuring the height of solder paste printed on the electrodes and an electronic component placing apparatus, whether the height of solder paste is right or wrong is determined based on the measurement re... | 01/18/2011 |
| 7861910 | Method and apparatus for inspecting joined object formed by friction stir joining This invention provides a method for inspecting a joined region and joining strength of a joined object formed by a spot friction stir joining process. In this method, an ultrasonic wave is introduced into the joined object from a backing face 25 opposed to a... | 01/04/2011 |
| 7845543 | Apparatus and method for bonding multiple dice An apparatus for bonding dice onto one or more substrates placed on a base comprises a first bond head and a second bond head. Each bond head incorporates a bonding tool which is configured for holding a die and both bond heads are driven by at least one linear moti... | 12/07/2010 |
| 7823762 | Manufacturing method and manufacturing apparatus of printed wiring board A solder ball is loaded on a bump having a small height (FIG. 5(B)) and the height of the bump is intensified by melting the solder ball by heating with laser (FIG. 5(C)). Thus, the heights of the bumps are adjusted within a requested allowable range. ... | 11/02/2010 |
| 7766213 | Device and method for monitoring a welding area and an arrangement and a method for controlling a welding operation Method and device (2) for monitoring a welding area of an object (14) in connection with welding, which device includes arrangements (3) for reproduction of the welding area, at least one filter (4) arranged in front of or in the reproduc... | 08/03/2010 |
| 7735711 | Method of testing bonded connections, and a wire bonder A method of testing wire-bond connections between a bonding wire and a substrate surface. The wire-bond connections are produced by a bonding head with a bonding tool and a wire clamp associated with the bonding tool under pressure and the action of ultrasound and/o... | 06/15/2010 |
| 7712649 | Using a simultaneously tilting and moving bonding apparatus An electronic component mounting device according to the invention includes a bonding head for holding and pressure bonding an electronic component to a mounting substrate, a local stage provided with a support surface formed in an area which is almost equal to or s... | 05/11/2010 |
| 7686204 | Wire bonding apparatus, record medium storing bonding control program, and bonding method A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and w... | 03/30/2010 |
| 7681778 | Electronic assembly remanufacturing system and method A method for remanufacturing an electronic assembly includes removing a first portion of an assembly housing to expose an underside of an enclosed circuit assembly. One or more solder joints on the underside of the circuit assembly are associated with at least one c... | 03/23/2010 |
| 7654434 | Method, device and system for bonding a semiconductor element The invention relates to a method and also a device and a system for bonding a semiconductor element (4), in which various contact areas (8) of the semiconductor element (4) are successively connected to terminal areas (2, 3, 7) by means ... | 02/02/2010 |
| 7641099 | Solder joint determination method, solder inspection method, and solder inspection device A solder joint determination method is disclosed that is able to inspect a joint portion between an electrode and a soldered portion and determine a soldering condition of the joint portion reliably with high precision. The method includes the steps of: scanning a s... | 01/05/2010 |
| 7637413 | X-ray inspection device and X-ray inspection method A X-ray inspection device for inspecting a solder connection portion between a circuit device having a solder ball and a printed circuit board having a land includes: X-ray irradiating means for irradiating X-ray to the solder connection portion between the solder b... | 12/29/2009 |
| 7591409 | Semiconductor device bonding apparatus and method for bonding semiconductor device using the same The semiconductor device bonding apparatus 1 of the present invention includes: a pressing member 15 that presses the semiconductor device 10 toward the substrate 11 side in a state where a bump 14 is provided between the semicondu... | 09/22/2009 |
| 7591408 | Camera-assisted adjustment of bonding head elements The invention relates to a method which is used to carry out adjusting operations on a bond head, wherein a bond head element is positioned in relation to a reference element, especially an ultrasonic tool. According to the invention, at least the surrounding area o... | 09/22/2009 |
| 7581666 | Wire-bonding method for wire-bonding apparatus A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several first chips in a first region and several second chips in a second reg... | 09/01/2009 |
| 7543732 | Evaluation method and evaluation apparatus for spot welded portion A technique for evaluation of the strength of a spot welded portion of a panel is provided. A stress value at the welded portion of the panel is calculated by a stress analysis according to a FEM using the elements, and then the strength of the welded portion is eva... | 06/09/2009 |
| 7478741 | Solder interconnect integrity monitor An apparatus and method for non-destructive solder interconnect integrity monitoring that can detect existing fracture damage, identify new or incipient fractures, and be implemented across multiple component configurations. Said components can be implemented to det... | 01/20/2009 |
| 7427517 | Stacking apparatus and method for stacking integrated circuit elements A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move arbitrarily, on which the chip assemblies are placed; a storage unit th... | 09/23/2008 |
| 7419085 | Optical processing apparatus The invention presents a optical processing apparatus capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire sol... | 09/02/2008 |
| 7416104 | Rotational fill techniques for injection molding of solder A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavitie... | 08/26/2008 |
| 7413106 | Method for fixing a miniaturized component to a carrier plate The invention relates to a method, a device and a system for fixing a miniaturized component—especially carrying or containing at least one optical element—to a carrier plate in a highly-precise manner, by means of a soldered joint, a welded joint or an adhesive... | 08/19/2008 |
| 7392924 | Automated ball mounting process and system with solder ball testing An automated ball mounting system is disclosed In which solder balls are tested by heating the solder balls to a temperature between the eutectic temperature of lead-tin and the melting temperature of a lead free solder ball. If the heated solder balls melt they are... | 07/01/2008 |
| 7392927 | Combinatorial production of material compositions from a single sample A combinatorial process for production of material libraries from a single sample, comprising forming a diffusion multiple in the single sample, wherein the diffusion multiple comprises a plurality of interdiffusion regions at interfacial locations of dissimilar met... | 07/01/2008 |
| 7389698 | Nutplate bond strength tester unit A bond strength tester unit is provided for testing adhesive bond strength of a nutplate or the like attached to a substrate, such as by adhesive bonded attachment to a blind side of the substrate in substantial alignment with a substrate opening. The nutplate may b... | 06/24/2008 |
| 7380697 | Welding condition monitoring device A welding condition monitoring device for monitoring the welding state of a welding work portion by taking an image thereof by an image sensor having a wide dynamic range and capable of taking an image covering a very bright welding portion and relatively dark porti... | 06/03/2008 |
| 7375304 | System and method providing automated welding notification The present invention relates to a system and method that provide for automated notification to entities (e.g., individuals, groups of individuals, computers, systems . . . ) of welding system related information. The invention provides for determination of events a... | 05/20/2008 |
| 7371663 | Three dimensional IC device and alignment methods of IC device substrates Alignment methods of IC device substrates. A first IC device substrate has a first front side for defining a plurality of first IC features, a first backside opposite the first front side, and a first alignment pattern formed on the first front side or the first bac... | 05/13/2008 |
| 7370786 | Bonding method and bonding apparatus Disclosed are a bonding method for a semiconductor chip, which employs an ultrasonic bonding scheme that prevents wear-out of the top surface of a mount tool and ensures both high reliability and high productivity, and a bonding apparatus which is used to carry out ... | 05/13/2008 |
| 7370785 | Wire bonding method and apparatus A wire bonding apparatus and method involving a computer 41 that has a height position counter 44 that produces height position signals for a capillary 5 by processing signals from a position sensor 29 that detects the position of the bonding arm 20 in the vertical ... | 05/13/2008 |
| 7369334 | Optical device with alignment compensation An optical device is provided which includes a plurality of optical modules and an alignment compensation module. Each optical module includes an optical component fixedly coupled to a relative reference mount. The relative reference mount is configured to attach to... | 05/06/2008 |
| 7364622 | Method and apparatus for fabricating a device, and the device and an electronic equipment The invention provides an apparatus for fabricating a device, in which a high operation efficiency is maintained in a drying treatment for a multilayer-interconnection device. The device can also be fabricated inexpensively. An apparatus for fabricating a device has... | 04/29/2008 |
| 7348217 | Method and structure for interfacing electronic devices Method and structure for optimizing and controlling diffusional creep at metal contact interfaces are disclosed. Embodiments of the invention accommodate height variations in adjacent contacts, decrease planarization uniformity requirements, and facilitate contact b... | 03/25/2008 |
| 7347347 | Head assembly, disk unit, and bonding method and apparatus A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated c... | 03/25/2008 |
| 7337939 | Bonding apparatus A bonding apparatus is constituted by a bonding tool, a substrate stage, a moving mechanism for moving the bonding tool and the substrate stage, an up-and-down mechanism for moving up and down said bonding tool, and a chip recognition camera. The bonding apparatus i... | 03/04/2008 |
| 7330582 | Bonding program With an assumption that the three data of the position (X1, Y1) of the first positioning pattern 202 and position (X2, Y2) of the second positioning pattern 212 of the reference chip 200, and the posit... | 02/12/2008 |
| 7324683 | Bonding pattern discrimination device Determination of inclination of positioning patterns used in bonding being made by: imaging a positioning pattern of reference chip and taking such image as reference-image; specifying a polar coordinate conversion origin for the reference-image; imaging an object (... | 01/29/2008 |
