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An armor with rollers is provided that enables a user to move in all positions by rolling on a hard and smooth surface while constantly varying his bearing points on the ground.
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| Number | Title | Issue Date |
| 8096462 | Method of reworking electrical short in ultra sonic bonder A modified ultrasonic bonding machine and process uses a sharpened bonding wedge to perform cutting of short material. The sharpened wedge is controlled by the same position control device control used to position the bonding wedge for bonding. The software is modif... | 01/17/2012 |
| 8091762 | Wedge bonding method incorporating remote pattern recognition system A wire is bonded to a target surface using a rotary bond head by positioning a wedge bonding tool of the bond head over the target surface. A camera system is tilted at an oblique angle relative to an arrangement of the bond head to conduct pattern recognition of bo... | 01/10/2012 |
| 8091761 | Bonding apparatus and bonding method A bonding apparatus provided with a control unit capable of controlling the position of the central axis of a bonding tool in the X direction and the Y direction based on an image of a pad acquired with a camera and an offset amount, the apparatus including: an outl... | 01/10/2012 |
| 8070041 | Direct application of pressure for bonding porous coatings to substrate materials used in orthopaedic implants A method for constantly controlling a direct application of pressure for bonding porous coatings to substrate materials used in orthopaedic implants. The direct pressure is applied to an interface between the porous coating and the substrate material via a pressure ... | 12/06/2011 |
| 8002165 | Method and welding device for connecting sheets of material The invention relates to a method for connecting material webs disposed with overlapping edges, wherein an automatic welding machine having a driven chassis and a drive unit disposed thereon and a welding unit is guided along the overlap zone of the material webs to... | 08/23/2011 |
| 7992761 | Process control system for friction stir welding A process control system for a friction stir welding machine employs a master set of parameters and subroutines to control multiple machine processes, including welding, drilling, milling and probing. Sub-sets of the master set comprising command parameters, limits ... | 08/09/2011 |
| 7861909 | Replenished lead-free solder and a control method for copper density and nickel density in a solder dipping bath Lead-free solder is replenished to a solder bath to receive a work having copper, the work to be processed subsequent to a soldering process using an air knife or a die. The replenished lead-free solder includes Sn as a major composition and at least 0.01 to 0.5 mas... | 01/04/2011 |
| 7857190 | Wire bonding apparatus, record medium storing bonding control program, and bonding method A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and w... | 12/28/2010 |
| 7845542 | Monitoring deformation and time to logically constrain a bonding process A process control procedure for a bonding process includes predetermining a deformation limit and a deforming time limit is for deforming a bonding precursor member. The bonding precursor member is deformed while monitoring instantaneous deformation values and insta... | 12/07/2010 |
| 7837084 | Multi-angle, articulated-jig-supported, beam-end component welding Adjustable, elongate, beam-offset jig structure for assisting in welding a pair of beam-end, column-interface components to the opposite ends of an elongate beam. The jig structure includes spaced, adjustable head-stock and tail-stock structures, each capable of hol... | 11/23/2010 |
| 7810699 | Method and system for optimized vibration welding A method of minimizing mechanical resonance in an assembly during formation of a vibration-welded joint therein includes positioning work pieces such that they are directly adjacent to each other, and generating a set of control signals that cause one or more sonotr... | 10/12/2010 |
| 7810698 | Vision system for positioning a bonding tool An apparatus for correcting a positional offset of a bonding tool during bonding operations comprises a first fiducial mark and a second fiducial mark spaced from the first fiducial mark located on the bonding tool. A first imaging path emanates from the first fiduc... | 10/12/2010 |
| 7793817 | Electronic component placing apparatus and electronic component mounting method To provide an electronic component placing apparatus and an electronic component mounting method that can prevent a cold joint from occurring when an electronic component likely to cause warp deformation is mounted by means of soldering. In the electronic component ... | 09/14/2010 |
| 7789285 | Solder printing process to reduce void formation in a microvia In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the seco... | 09/07/2010 |
| 7780060 | Methods and apparatus for efficiently generating profiles for circuit board work/rework Methods and articles for receiving times and temperatures for stages of a profile including solder heating stages to rework a populated printed circuit board (PCB), the rework including removing a first integrated circuit (IC) from the PCB, focusing heat on the firs... | 08/24/2010 |
| 7699209 | Wire bonding apparatus, record medium storing bonding control program, and bonding method A bonding method involving detection of non-bonding of a bonding wire to a first bonding point, the method including an electrical non-bonding detection step and an optical non-bonding detection step, wherein data on whether the respective first bonding points are p... | 04/20/2010 |
| 7669749 | Method for squeezing off and sealing a tube A procedure for squeezing off and sealing a tube, in which the tube is positioned between a sonotrode and an associated anvil, counter electrode, of an ultrasonic device, and the sonotrode is activated and displaced relative to the counter electrode for squeezing of... | 03/02/2010 |
| 7665650 | Friction stir joining method In the friction stir joining apparatus of the present invention, a rotation control unit variably controls a rotational speed of a rotor; and a straight movement control unit controls a straight movement of the rotor so as to control a pressure applied by the rotor ... | 02/23/2010 |
| 7628308 | Method of replenishing an oxidation suppressing element in a solder bath The rate of decrease of an oxidation suppressing element in a solder bath is measured during a soldering operation. Soldering is then carried out while replenishing the solder bath is then replenished during soldering so as to maintain the surface level of molten so... | 12/08/2009 |
| 7549566 | Method, apparatus and program of thermal analysis, heat controller and heating furnace using the method A heating characteristic value at any measuring point of an object at any measuring location of a heating furnace is determined as a single invariable by using temperature (Tint and Ts) measured at the measuring point of the object and heating temperature (Ta) and h... | 06/23/2009 |
| 7464851 | Wire bonding method and apparatus therefor Methods and apparatus for detecting the welding state in each bonding section and the application of ultrasonic vibration and pressing force is stopped promptly when completion of welding is determined. This permits bonding to be finished, corresponding to each wire... | 12/16/2008 |
| 7441688 | Methods and device for controlling pressure in reactive multilayer joining and resulting product The invention includes a method of joining two components. The method includes providing at least two components to be joined, a reactive multilayer foil, and a compliant element, placing the reactive multilayer foil between the at least two components, applying pre... | 10/28/2008 |
| 7428843 | Multi-function digital pressure measuring device A multi-function digital pressure measuring device and welding torch having an outlet nozzle with first and second gas inlets with valves. The pressure measuring device having a body with a first gas chamber and a first inlet and a first outlet where the first inlet... | 09/30/2008 |
| 7380697 | Welding condition monitoring device A welding condition monitoring device for monitoring the welding state of a welding work portion by taking an image thereof by an image sensor having a wide dynamic range and capable of taking an image covering a very bright welding portion and relatively dark porti... | 06/03/2008 |
| 7372056 | LPP EUV plasma source material target delivery system An EUV light generation system and method is disclosed that may comprise a droplet generator producing plasma source material target droplets traveling toward the vicinity of a plasma source material target irradiation site; a drive laser; a drive laser focusing opt... | 05/13/2008 |
| 7370785 | Wire bonding method and apparatus A wire bonding apparatus and method involving a computer 41 that has a height position counter 44 that produces height position signals for a capillary 5 by processing signals from a position sensor 29 that detects the position of the bonding arm 20 in the vertical ... | 05/13/2008 |
| 7367489 | Method and apparatus for flip chip attachment by post collapse re-melt and re-solidification of bumps A solder bump reflow process includes raising the temperature of an aligned die-substrate assembly to a temperature and for a time sufficient to cause a first reflow; allowing the temperature of the assembly to fall to a first cooling temperature and for a time suff... | 05/06/2008 |
| 7360675 | Wire bonder for ball bonding insulated wire and method of using same An electrical contact device is provided for electrically grounding an uninsulated end-portion of insulated wire stored on a spool driven by a device comprises the following. An electrical connector fixes to the spool and is configured to receive an electrical conne... | 04/22/2008 |
| 7357290 | Workpiece support structures and system for controlling same In accordance with one aspect of the present exemplary embodiment, set forth is a welding system including a plurality of adjustable welding support structures positioned in relationship to each other to permit welding of a workpiece held by a plurality of adjustabl... | 04/15/2008 |
| 7355386 | Method of automatically carrying IC-chips, on a planar array of vacuum nozzles, to a variable target in a chip tester A method of automatically carrying IC-chips, on a planar array of vacuum nozzles, to a variable target in a chip tester uses a set of laser distance sensors to align the vacuum nozzles with the target. Alignment occurs when certain combinations of distance and dista... | 04/08/2008 |
| 7353976 | Wire bonder A Wire Bonder contains a bondhead and a rocker arranged on the bondhead that is rotatable on a horizontal axis. A horn with a flange is attached to the rocker in which a capillary is clamped. At least one sensor is attached to the bondhead that detects vibrations of... | 04/08/2008 |
| 7353983 | Vertical removal of excess solder from a circuit substrate A method for vertical removal of excess solder from a circuit substrate includes the use of a sacrificial circuit substrate with a plurality of pads and vias that are solder-wettable. The pads and vias of the sacrificial circuit substrate are placed in vertical prox... | 04/08/2008 |
| 7350684 | Apparatus and method for forming bump A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal... | 04/01/2008 |
| 7347350 | Welding workpiece support structures In accordance with one embodiment of the present application, provided is a welding support structure arrangement to support an elongated assembled weldment preparatory to positional welding. The arrangement includes at least one support structure having a support b... | 03/25/2008 |
| 7337939 | Bonding apparatus A bonding apparatus is constituted by a bonding tool, a substrate stage, a moving mechanism for moving the bonding tool and the substrate stage, an up-and-down mechanism for moving up and down said bonding tool, and a chip recognition camera. The bonding apparatus i... | 03/04/2008 |
| 7319265 | Semiconductor chip assembly with precision-formed metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The metal ... | 01/15/2008 |
| 7318011 | Facial characteristic based generation of fillet weld bead representation A computing environment is provided with the ability to contribute to generate a representation for a fillet weld bead to be used to fillet weld a number components of an article of manufacture together at one or more faces of the components in the manufacturing of ... | 01/08/2008 |
| 7314157 | Wire bond with improved shear strength A wire bonding method and a wire bond formed from the method are provided to improve shear strength of a wire that is connected to a bonding surface. The wire bond includes a bonded wire having a base in contact with the bonding surface, a recessed portion formed su... | 01/01/2008 |
| 7311239 | Probe attach tool A tool for attaching fine preformed probes to a substrate for use with a vacuum source is disclosed. The apparatus comprises a body portion; a tip portion disposed at one end of the body portion; a first orifice extending from a first end of the body portion to the ... | 12/25/2007 |
| 7312541 | Actuator and bonding apparatus In an actuator of a bonding apparatus, a rotating body 16 that has a bonding head is rotatably supported on a supporting carrier having the same shape as magnetic path members 32L and 32R, and coil portions 40 and 42 are disposed o... | 12/25/2007 |
