Felix Hoffmann, a German chemist, was searching for something to relieve his father's arthritis. In doing so, he "rediscovered" acetylsalicylic acid and in 1900, patented a stable process for developing it. Hence, we have aspirin.
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| Number | Title | Issue Date |
| 6885815 | Thermal processing apparatus performing irradiating a substrate with light A plurality of flash lamps are covered with a reflector. Optical fiber members are attached to the reflector on portions located immediately above the flash lamps. When the flash lamps emit flash light toward a semiconductor wafer, the optical fiber members partiall... | 04/26/2005 |
| 6879779 | Annealing oven with heat transfer plate A vacuum oven with heat transfer fluid conduits. The oven of the invention generally includes a shell into which a removable rack may be placed. The rack has at least one plate which may be heated or cooled by a plate fluid conduit in contact with the plate and thro... | 04/12/2005 |
| 6879778 | Batch furnace A system and method for isothermally distributing a temperature across a semiconductor device. A furnace assembly is provided, which includes a processing tube configured to removably receive a wafer carrier having a full compliment of semiconductor wafers. A heatin... | 04/12/2005 |
| 6879777 | Localized heating of substrates using optics An apparatus for processing a semiconductor substrate, including a process chamber having a plurality of walls and a substrate support to support the substrate within the process chamber. A radiative heat source is positioned outside the process chamber to heat the ... | 04/12/2005 |
| 6876816 | Heating device, heat treatment apparatus having the heating device and method for controlling heat treatment A heat treatment apparatus achieves a uniform and rapid temperature rise of an object to be processed. A plurality of double-end lamps heat the object to be processed so as to apply a heat treatment process to the object. A plurality of reflectors reflect radiation ... | 04/05/2005 |
| 6872908 | Susceptor with built-in electrode and manufacturing method therefor There is provided a susceptor with a built-in electrode and a manufacturing method therefor, in which there is no danger of corrosive gas or plasma or the like penetrating to the inside of the substrate, which has excellent corrosion resistance and plasma resistance... | 03/29/2005 |
| 6864466 | System and method to control radial delta temperature A system and method of minimizing stress related to the ramp rate of a variable by limiting the ramp rate as a function of the current value of the variable is provided. More specifically, the present invention provides a system and method of maintaining the radial ... | 03/08/2005 |
| 6864463 | Substrate processing apparatus and semiconductor device producing method Emissivity of a substrate is measured at least before the substrate is heated, heating operation of the substrate is controlled under a heating condition corresponding to the emissivity, and the substrate is processed. ... | 03/08/2005 |
| 6862404 | Focused photon energy heating chamber An apparatus and method for heating substrates, such as semiconductor wafers. A radiation energy source is arranged proximate to a reflector to direct radiation towards a window providing optical access to a processing chamber. A lens positioned outside of the windo... | 03/01/2005 |
| 6859616 | Apparatus for and method of heat treatment by light irradiation A semiconductor wafer is held by support pins horizontally. A susceptor and a heating plate are moved upwardly so that the semiconductor wafer is transferred from the support pins to the susceptor. At this time, a gas layer is sandwiched between the upper surface of... | 02/22/2005 |
| 6856762 | Light irradiation type thermal processing apparatus In a light diffuser, a strong light diffusion processing is performed to a lamp corresponding part located in a vertical immediate downward direction of each of a plurality of flash lamps, and a weak light diffusion processing is performed to an inter-lamp correspon... | 02/15/2005 |
| 6855916 | Wafer temperature trajectory control method for high temperature ramp rate applications using dynamic predictive thermal modeling A method for thermally processing a substrate provides a target substrate temperature and generates a move profile of the substrate within a thermal processing system. An amount of heat is provided to the substrate, and one or more temperatures associated with one o... | 02/15/2005 |
| 6853802 | Heat treatment for edges of multilayer semiconductor wafers A method for heat treating a multilayer semiconductor wafer having a central region and a peripheral edge each having a surface. The method includes thermally treating selected portions of the peripheral edge to compensate for local differences in heat absorption. T... | 02/08/2005 |
| 6849831 | Pulsed processing semiconductor heating methods using combinations of heating sources Pulsed processing methods and systems for heating objects such as semiconductor substrates feature process control for multi-pulse processing of a single substrate, or single or multi-pulse processing of different substrates having different physical properties. Hea... | 02/01/2005 |
| 6847012 | Apparatus and method for measuring the temperature of substrates The invention relates to a device for measuring the temperature of substrates, notably semiconductor wafers. The device comprises at least one radiation sensor for measuring the radiation emitted by the substrate and an element (19) which restricts the field ... | 01/25/2005 |
| 6844527 | Multi-thermal zone shielding apparatus A multi-thermal zone shielding apparatus provides a multi-zone temperature profile for the shield while shielding a portion of a hot workpiece in a high temperature processing system. The apparatus keeps the workpiece temperature hot at the shielded area and maintai... | 01/18/2005 |
| 6844528 | Hot wall rapid thermal processor An apparatus for heat treatment of a wafer. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is configured to move between the cooling chamber... | 01/18/2005 |
| 6843201 | Temperature control for single substrate semiconductor processing reactor A reactor for heat treatment of a substrate having a process chamber within a substrate enclosing structure, and a support structure configured to position a substrate at a predetermined spacing between the upper part and the bottom part within the process chamber d... | 01/18/2005 |
| 6842582 | Light heating apparatus and method therefor In a light heating apparatus having a flash lamp in which noble gas is enclosed, a casing surrounding the flash lamp, a stage where a silicon wafer on which light from the flash lamp is emitted is placed, and a power feeding apparatus for controlling light emission ... | 01/11/2005 |
| 6839507 | Black reflector plate In a system for thermal processing of a semiconductor substrate, an RTP system employs a reflector plate which is highly reflective of radiation in a target wavelength range, and less reflective of radiation outside that target wavelength range. In one embodiment, t... | 01/04/2005 |
| 6838643 | Method and apparatus for performing baking treatment to semiconductor wafer An apparatus for baking a semiconductor wafer having a resist pattern thereon includes a baking oven in which the semiconductor wafer is placed and heated, and a first hot plate which is provided in the baking oven to heat an entire bottom surface of the semiconduct... | 01/04/2005 |
| 6835914 | Apparatus and method for reducing stray light in substrate processing chambers A method and apparatus for heating semiconductor wafers in thermal processing chambers. The apparatus includes a non-contact temperature measurement system that utilizes radiation sensing devices, such as pyrometers, to determine the temperature of the wafer during ... | 12/28/2004 |
| 6834158 | Pinhole defect repair by resist flow According to one aspect of the present invention, pinhole defects in resist coatings are repaired by heating the resist briefly to induce the resist to flow and fill pinholes. The resist is brought to a temperature at or above that at which the resist flows for long... | 12/21/2004 |
| 6825447 | Apparatus and method for uniform substrate heating and contaminate collection Embodiments of the invention generally provides an apparatus and method for heating substrates, comprising a heater disposed within a chamber, a plurality of heated supports movably disposed within the chamber to support at least two substrates thereon and a contami... | 11/30/2004 |
| 6818864 | LED heat lamp arrays for CVD heating A reactor chamber is positioned between a top array of LED heat lamps and a bottom array of LED heat lamps. The LED heat lamps forming the top and bottom arrays are individually or controllable in groups such that power output along each array of LED heat lamps can ... | 11/16/2004 |
| 6815645 | Heat reflecting material and heating device using the material A heating apparatus 20 comprises a container 2 having a work housing space 1 formed therein, and a heat source 3 for heating a work W in the work housing space 1. The apparatus further comprises a heat ray reflecting member 10 | 11/09/2004 |
| 6809296 | Electrical energy conserving kiln method and apparatus This is an electrically heated ceramic kiln and a method for varying the size of the kiln chamber by moveable top and/or bottom walls which can be moved vertically within the kiln chamber, together with a new method of insulating the kiln and providing captive air c... | 10/26/2004 |
| 6803546 | Thermally processing a substrate A thermal processing method is described in which a temperature response of a substrate may be controlled during a heat-up phase or a cool-down phase, or during both phases. This reduces the thermal budget of the substrate and improves the quality and performance of... | 10/12/2004 |
| 6800833 | Electromagnetically levitated substrate support An apparatus for supporting a substrate and a method for positioning a substrate include a substrate support, a stator circumscribing the substrate support, and an actuator. The actuator is coupled to the stator and adapted to change the elevation of the stator and/... | 10/05/2004 |
| 6796795 | Method and apparatus for loading substrate in semiconductor manufacturing apparatus A method and apparatus for loading a substrate is applied to a semiconductor manufacturing apparatus in which a substrate is carried in a vacuum-processing chamber, and loaded on a heated processing table, and further is applied with predetermined processing in a co... | 09/28/2004 |
| 6794615 | Semiconductor wafer tray positioning Semiconductor wafer tray positioning, such as can be used in rapid thermal processing (RTP), rapid thermal annealing (RTA), and other semiconductor fabrication processes, is disclosed. A housing, such as a quartz tube, to receive a wafer tray includes at least four ... | 09/21/2004 |
| 6778762 | Sloped chamber top for substrate processing A processing chamber top is provided. The chamber top includes a top surface and a bottom surface having an inner and an outer edge. The bottom surface is sloped downward from the inner edge to the outer edge. A central opening extends through the chamber top. In on... | 08/17/2004 |
| 6775471 | Method and device for thermally treating objects The invention relates to a method and to a device for thermally treating objects. The aim of the invention is to facilitate a better control of the temperature profile of an object to be thermally treated. To this end, the invention provides a method and a device fo... | 08/10/2004 |
| 6770852 | Critical dimension variation compensation across a wafer by means of local wafer temperature control A wafer etching system has a measuring device, an etching chamber, and a controller. The measuring device measures the critical dimension test feature (CD) along the profile of the wafer at a number of preset locations. The etching chamber receives the wafer from th... | 08/03/2004 |
| 6770851 | Method and apparatus for the treatment of substrates In a method and apparatus for the thermal treatment of semiconductor substrates, such as a wafer, a wafer is brought into a heat treatment apparatus wherein the heat treatment apparatus comprises two substantially flat parts parallel to the introduction position of ... | 08/03/2004 |
| 6768084 | Advanced rapid thermal processing (RTP) using a linearly-moving heating assembly with an axisymmetric and radially-tunable thermal radiation profile A system and a method for thermally processing a semiconductor substrate are disclosed which provide a heater chamber and a process chamber environmentally isolated from one another by a thermally-transparent plate. A heater assembly situated within the heater chamb... | 07/27/2004 |
| 6768083 | Reflow soldering apparatus and method for selective infrared heating A reflow soldering apparatus and method are provided for reflow soldering electrical and electronic components to circuit boards. The reflow soldering apparatus and method use selective infrared (IR) heating alone or in combination with convection heating to achieve... | 07/27/2004 |
| 6765178 | Chamber for uniform substrate heating Embodiments of the invention generally provide an apparatus and a method for providing a uniform thermal profile to a plurality of substrates during heat processing. In one embodiment, a cassette containing one or more heated substrate supports is moveably disposed ... | 07/20/2004 |
| 6759633 | Heat treating device A heat treatment system for controlling the temperature in a processing vessel. The system includes a cylindrical processing vessel; a supporting table, raised by a support from the bottom portion of the processing vessel, for mounting thereon an object to be proces... | 07/06/2004 |
| 6759632 | Device for fast and uniform heating substrate with infrared radiation A heating device infrared radiation lamps 24, 26 designed to perform rapid thermal processing of the substrate 12 inside a reaction chamber 14 with a transparent window 34. The infrared lamps 24, 26 are arranged in two superposed s... | 07/06/2004 |