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| Number | Title | Issue Date |
| 7442900 | Chamber for uniform heating of large area substrates Embodiments of the present invention generally provide an apparatus for providing a uniform thermal profile to a plurality of large area substrates during thermal processing. In one embodiment, an apparatus for thermal processing large area substrates includes a cha... | 10/28/2008 |
| 7431585 | Apparatus and method for heating substrates An apparatus for processing substrates is disclosed. In one embodiment, the apparatus includes a housing and a plurality of stacked cell structures in the housing. An actuator is adapted to move the plurality of stacked cell structures inside of the housing while su... | 10/07/2008 |
| 7432475 | Vertical heat treatment device and method controlling the same A vertical heat processing apparatus includes a process chamber (5) defining a process field (A1) configured to accommodate a plurality of target substrates (W) supported at intervals in a vertical direction. The apparatus further includes a heating fu... | 10/07/2008 |
| 7429717 | Multizone heater for furnace The present invention relates to an apparatus and method for heating a semiconductor processing chamber. One embodiment of the present invention provides a furnace for heating a semiconductor processing chamber. The furnace comprises a heater surrounding side walls ... | 09/30/2008 |
| 7429718 | Heating and cooling of substrate support A substrate support assembly and method for controlling the temperature of a substrate within a process chamber are provided. A substrate support assembly includes an thermally conductive body comprising a stainless steel material, a substrate support surface on the... | 09/30/2008 |
| 7416405 | Vertical type of thermal processing apparatus and method of using the same A vertical type of thermal processing apparatus of the present invention includes a thermal processing furnace having a furnace opening at a lower portion thereof. A boat holding objects to be processed in a tier-like manner in a vertical direction is adapted to be ... | 08/26/2008 |
| 7415312 | Process module tuning A process module tuning method characterizes a process module by gathering data using a process condition measuring device to measure process outputs while inputs are excited. The data is used to identify a dynamic process model. The dynamic process model is then be... | 08/19/2008 |
| 7414224 | Backside rapid thermal processing of patterned wafers Apparatus and methods of thermally treating a wafer or other substrate, such as rapid thermal processing (RTP) apparatus and methods are disclosed. An array of radiant lamps directs radiation to the back side of a wafer to heat the wafer. In one or more embodiments,... | 08/19/2008 |
| 7387762 | Apparatus for sintering silver clay A sintering apparatus for silver clay wherein a silver clay composition can be readily and easily sintered by exposing a silver clay composition obtained by molding to a flame of a solid alcohol fuel. ... | 06/17/2008 |
| 7381928 | Thermal processing apparatus and thermal processing method A light source including a plurality of flash lamps emits flashes thereby flash-heating a semiconductor wafer held by a thermal diffuser and a hot plate. The current distance of irradiation between the thermal diffuser and the hot plate holding the semiconductor waf... | 06/03/2008 |
| 7378618 | Rapid conductive cooling using a secondary process plane A method and apparatus for thermally processing a substrate is described. The apparatus includes a substrate support configured to move linearly and/or rotationally by a magnetic drive. The substrate support is also configured to receive a radiant heat source to pro... | 05/27/2008 |
| 7371998 | Thermal wafer processor A thermal processor may include a cooling jacket positionable around a process chamber within a process vessel or jar. A heater can move into a position substantially between the process chamber vessel and the cooling jacket. A holder having multiple workpiece holdi... | 05/13/2008 |
| 7371997 | Thermal processing apparatus and thermal processing method In a thermal processing apparatus, using a lamp for heating a substrate, an opening is formed for a camera unit, which is used to image portions of an auxiliary ring supporting the substrate, to obtain the position of the center of the auxiliary ring. The camera fur... | 05/13/2008 |
| 7372152 | Copper interconnect systems An integrated circuit (IC) may include a substrate, a first dielectric layer adjacent the substrate, and at least one trench in the first dielectric layer. The IC may also include a metal liner within the at least one trench, and a first conductive region including ... | 05/13/2008 |
| 7371287 | Substrate handling system A substrate handling system and method in which an air chuck produces a film of air between the substrate and the air chuck, a magnetic chuck attracts the substrate to the air chuck, and an actuator subsystem moves the magnetic chuck closer to and away from the air ... | 05/13/2008 |
| 7368303 | Method for temperature control in a rapid thermal processing system A method is disclosed for a multi-zone interference correction processing for a rapid thermal processing (RTP) system. This processing allows for improved calibration/tuning of RTP systems by accounting for zone coupling. The disclosed method includes establishing b... | 05/06/2008 |
| 7364624 | Wafer handling apparatus and method of manufacturing thereof A wafer processing device or apparatus, i.e., a heater or an electrostatic chuck, comprises a planar support platen, a support shaft having centrally located bore, and a pair of electrical conductors located in the shaft. In one embodiment, the electrical conductors... | 04/29/2008 |
| 7361589 | Copper interconnect systems which use conductive, metal-based cap layers An integrated circuit (IC) may include a substrate, a first dielectric layer adjacent the substrate, and at least one trench in the first dielectric layer. The IC may also include a metal liner within the at least one trench, and a first conductive region including ... | 04/22/2008 |
| 7360366 | Cooling apparatus, exposure apparatus, and device fabrication method An apparatus for adjusting temperature of an object includes a heat radiation member, a deflection member to deflect heat radiation from the heat radiation member toward a region of the object, and an adjusting system to adjust temperature of the heat radiation memb... | 04/22/2008 |
| 7361230 | Substrate processing apparatus In the substrate processing apparatus, a ceramic module for mounting a substrate has a flat plate portion having an electric circuitry and a ceramic base body, and as at least a part of a surface of the flat plate portion other than the surface mounting the substrat... | 04/22/2008 |
| 7358462 | Apparatus and method for reducing stray light in substrate processing chambers A method and apparatus for heating semiconductor wafers in thermal processing chambers is disclosed. The apparatus includes a non-contact temperature measurement system that utilizes radiation sensing devices, such as pyrometers, to determine the temperature of the ... | 04/15/2008 |
| 7357632 | Automated wood-fired pottery kiln A kiln and method of firing a kiln are provided for use in connection with the firing of small-scale pottery firing. The kiln includes a kiln wall that defines a main kiln volume that is no larger than 60 cubic feet and is less than 10 cubic feet in one embodiment. ... | 04/15/2008 |
| 7358200 | Gas-assisted rapid thermal processing A system, method and apparatus for processing a semiconductor device including a processing chamber and a heating assembly positioned within the processing chamber. The heating assembly including at least a plate defining an internal cavity configured to receive gas... | 04/15/2008 |
| 7358666 | System and method for sealing high intensity discharge lamps In accordance with certain embodiments, the present technique includes a system for sealing a lamp including a thermal shield and a thermally susceptible enclosure disposed adjacent the thermal shield. The thermal shield has a first receptacle adapted to receive a f... | 04/15/2008 |
| 7351655 | Copper interconnect systems which use conductive, metal-based cap layers An integrated circuit (IC) may include a substrate, a first dielectric layer adjacent the substrate, and at least one trench in the first dielectric layer. The IC may also include a metal liner within the at least one trench, and a first conductive region including ... | 04/01/2008 |
| 7351936 | Method and apparatus for preventing baking chamber exhaust line clog A method and apparatus involve providing a supply of nitrogen gas, heating the supply of nitrogen gas to a temperature, and ejecting the heated nitrogen gas through the exhaust line of the baking chamber on a periodic basis. The temperature is between a temperature ... | 04/01/2008 |
| 7347901 | Thermally zoned substrate holder assembly A thermally zoned substrate holder including a substantially cylindrical base having top and bottom surfaces configured to support a substrate. A plurality of temperature control elements are disposed within the base. An insulator thermally separates the temperature... | 03/25/2008 |
| 7347314 | Movable walkways and escalators The invention provides a movable walkway installation (10), such as an escalator or a travelator, which installation (10) includes a movable support member (18) for transporting persons supported thereon, a movable handrail (16) for gripp... | 03/25/2008 |
| 7334690 | Substrate supporting rod and substrate cassette using the same A substrate-supporting rod (4) includes a resin body (41) and a metal rod (43). The resin body (41) includes a body portion (411) being cylinder-shaped and having a first through hole (413) in a direction of the axis thereof... | 02/26/2008 |
| 7332691 | Cooling plate, bake unit, and substrate treating apparatus A bake unit includes a cooling plate for cooling a substrate and a lift pin assembly for loading a substrate on the cooling plate. When a wafer is cooled on the cooling plate, a guide groove is formed at the cooling plate to allow a space between the wafer and the c... | 02/19/2008 |
| 7332695 | Carbon heating element and method of producing same A carbon heating element having an arbitrary specific resistance and an arbitrary shape which are arbitrary necessary as a heating element, and a method of producing the same. The carbon heating element is obtained by uniformly dispersing one or at least two metal o... | 02/19/2008 |
| RE40052 | Heat treatment apparatus A heat treatment table is divided into two or more regions, a heater is disposed for each region. On a predetermined portion of the heat treatment table, a plurality of sensors are disposed separately each other. A relation between temperatures of the respective por... | 02/12/2008 |
| 7326877 | Laser thermal processing chuck with a thermal compensating heater module Chuck methods and apparatus for supporting a semiconductor substrate and maintaining it at a substantially constant background temperature even when subject to a spatially and temporally varying thermal load. Chuck includes a thermal compensating heater module havin... | 02/05/2008 |
| 7327948 | Cast pedestal with heating element and coaxial heat exchanger The present invention provides a heat transfer assembly that, when coupled to an object, is capable of keeping the object at a uniform elevated temperature while removing large amounts of heat from an external source. The assembly may be contained in a pedestal for ... | 02/05/2008 |
| 7323661 | Heat treatment apparatus using a lamp for rapidly and uniformly heating a wafer A heat treatment apparatus enables a rapid temperature rise of an object to be processed while giving an excellent economical efficiency. A heating unit heats an object to be heated by irradiating a light onto the object. A plurality of lamps are provided in a lamp ... | 01/29/2008 |
| 7318869 | Variable gas conductance control for a process chamber A deposition system in accordance with one embodiment of the present invention includes a process chamber, a stationary pedestal for supporting a substrate in the process chamber, and a moveable shield forming at least a portion of an enclosure defining the process ... | 01/15/2008 |
| 7316721 | Ceramic foam insulator with thermal expansion joint A canister for maintaining entrained particles in a gas stream passing there through. The canister has an outer annular member and an inner porous annular member. The inner porous annular member has rings with at least one expansion zone in each ring. An annular int... | 01/08/2008 |
| 7317175 | User interface for configuring and controlling an array of heater elements An oven control system and user interface are provided for setting a target temperature for different zones within an oven. A thermocouple is provided in each zone within the oven to monitor the realized temperature within the specific zone of the oven. A plurality ... | 01/08/2008 |
| 7317172 | Bake system Provided is a bake system. The bake system includes a heating plate having a heating plate having a substrate on an upper surface. A case is disposed below the heating plate to support the heating plate; a first cover is disposed above the heating plate and coupled ... | 01/08/2008 |
| 7317870 | Pulsed processing semiconductor heating methods using combinations of heating sources Pulsed processing methods and systems for heating objects such as semiconductor substrates feature process control for multi-pulse processing of a single substrate, or single or multi-pulse processing of different substrates having different physical properties. Hea... | 01/08/2008 |
