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| Number | Title | Issue Date |
| 6590186 | Heat treatment apparatus and method A baking unit of the present invention comprises: a hot plate on which the substrate is placed; a casing; a gas supply tubes; a baffle ring which surrounds the wafer and is provided with a plurality of gas blowing apertures; and a rotation motor. An inert... | 07/08/2003 |
| 6576873 | Semiconductor manufacturing apparatus for photolithographic process A semiconductor manufacturing apparatus for a photolithographic process having a coating process and a developing process is described, which includes a first port, a second port, a coating member, and a developing member. The first port and second port h... | 06/10/2003 |
| 6573480 | Use of thermal flow to remove side lobes In invention provides a system for reducing or eliminating side lobes in patterned resist coatings. The system heats the resist briefly to induce the resist to flow. The system allows the resist to flow long enough for the side lobes to level, but not so ... | 06/03/2003 |
| 6570137 | System and method for lamp split zone control An operating voltage is supplied to first and second groups in accordance with a recipe for thermally processing a semiconductor wafer. It is then determined that the operating voltage is an undesired voltage in a range of voltages between a predetermined... | 05/27/2003 |
| 6570134 | Heat treatment device of the light irradiation type and heat treatment process of the irradiation type To enable uniform heating of the wafer and to carry out heating of the guard ring with high efficiency using lamps of a light source part formed of wafer heating lamps and guard ring heating lamps, the distance between the guard ring heating lamps and the... | 05/27/2003 |
| 6566630 | Thermal processing apparatus for introducing gas between a target object and a cooling unit for cooling the target object A thermal processing apparatus capable of rapidly increasing and decreasing a temperature of a target object in a process chamber being thermally treated. A heat source heats the target object and a cooling arrangement including a bottom part of the proce... | 05/20/2003 |
| 6566255 | SOI annealing method and SOI manufacturing method The HF defect density in an SOI is reduced. An SOI having a thickness of 200 nm or less is annealed in an inert atmosphere at a temperature between the eutectic temperature (e.g., 966° C.) of a semiconductor metal compound (e.g., nickel silicide) formed ... | 05/20/2003 |
| 6559424 | Windows used in thermal processing chambers An apparatus for heat treating semiconductor wafers in a thermal processing chamber using light energy is provided. In one embodiment, the apparatus contains a window located between the semiconductor wafer and the energy source. The window contains a mem... | 05/06/2003 |
| 6555790 | Semiconductor manufacturing apparatus, method for cleaning the semiconductor manufacturing apparatus, and light source unit There is described a semiconductor manufacturing apparatus for coating the surface of a semiconductor wafer with an organic coating, such as anti-reflective coating, which shortens a down time required in association with removal of compounds that tend to... | 04/29/2003 |
| 6538237 | Apparatus for holding a quartz furnace An apparatus for fixing the position of a quartz furnace tube in a semiconductor processing furnace is described. The furnace is of the type that has a cylindrical body possessing an open end through which the tube may be withdrawn, and a base postioned o... | 03/25/2003 |
| 6536649 | Method of preventing residue contamination of semiconductor devices during furnace processing Residue contaminates semiconductor devices during processing in a furnace. Residue contamination is prevented by removing the residue before it builds up to a point where it can contaminate semiconductor devices. Residue build-up is monitored using a resi... | 03/25/2003 |
| 6534749 | Thermal process apparatus for measuring accurate temperature by a radiation thermometer A heat treatment apparatus applies an accurate heat treatment to a wafer by performing an accurate measurement of a temperature of a wafer by a radiation thermometer. Halogen lamps heat the wafer by irradiating a light on a front surface of the wafer. A g... | 03/18/2003 |
| 6534748 | Semiconductor purification apparatus and method A method for protecting at least one wafer from contamination, the method including the steps of heating the wafer in an apparatus for semiconductor processing having a reaction core (102), providing a first voltage level to a wafer transfer device (108),... | 03/18/2003 |
| 6527164 | Removing flux residue from reflow furnace using active gaseous solvent A method of cleaning residue on surfaces in a reflow furnace includes introducing a solvent into the furnace chamber; reacting the solvent with the residue to form a product; and, removing the product from the furnace chamber. The solvent is gaseous, such... | 03/04/2003 |
| 6528767 | Pre-heating and load lock pedestal material for high temperature CVD liquid crystal and flat panel display applications An apparatus for supporting a glass substrate is provided. In one embodiment, a substrate support is provided having a base structural member and an upper top portion having a surface thereon adapted to minimize friction and/or chemical reactions between ... | 03/04/2003 |
| 6529686 | Heating member for combination heating and chilling apparatus, and methods Described are heating members and related methods, the heating members being usefully for processing substrates such as microelectronic devices, the heating members optionally and preferably comprising a thermal conductive layer prepared to a superior fla... | 03/04/2003 |
| 6519417 | Semiconductor wafer baking apparatus The present invention discloses a semiconductor wafer baking apparatus comprising a heating plate, a wafer guide, and an exhaust heat compensator. The heating plate is loaded with a wafer and the wafer guide arranges the wafer on the heating plate. The ex... | 02/11/2003 |
| 6518547 | Heat treatment apparatus A substrate heat treatment apparatus irradiating a substrate such as a semiconductor wafer with light and performing heat treatment is provided. 19 lamps 82 are arranged on a plane in the form of a honeycomb to form a lamp group 81. The lamp group 81 has ... | 02/11/2003 |
| 6515261 | Enhanced lift pin An apparatus and method for thermally processing a substrate employs lift pin for supporting or contacting the substrate while conveying radiation from the substrate to a detector and/or processor through a hollow member. The lift pin comprises a contact ... | 02/04/2003 |
| 6515260 | Method and apparatus for rapid heating of NMR samples An NMR sample, frozen in a tube and having achieved a specified higher degree of polarization for an NMR experiment, is rapidly heated and melted before it loses a significant portion of the achieved polarization and still retains 10% or more. The heating... | 02/04/2003 |
| 6512206 | Continuous process furnace The present invention provides a furnace which heat treats substrates. The furnace includes a heating section and working components. The heating section includes heating coils having spacers disposed within the heating coils where a mass of the heating c... | 01/28/2003 |
| 6512207 | Apparatus and method for the treatment of substrates A device and method for thermally treating substrates. A substrate is heated by a heating plate to improve thermal homogeneity. The heating plate is heated using a number of separately controlled heating elements. The temperature of the heating elements i... | 01/28/2003 |
| 6506994 | Low profile thick film heaters in multi-slot bake chamber A heating chamber assembly for heating or maintaining the temperature of at least one wafer, employs thick film heater plates stacked at an appropriate distance to form a slot between each pair of adjacent heater plate surfaces. The heating chamber assemb... | 01/14/2003 |
| 6501191 | Heat treatment apparatus and method A heat treatment apparatus for applying a predetermined heat treatment to a substrate includes: for example, a dielectric low oxygen controlled cure unit (DLC unit) for forming an interlayer insulating film on a semiconductor wafer W; a hot plate for supp... | 12/31/2002 |
| 6496648 | Apparatus and method for rapid thermal processing An apparatus for rapid thermal processing is described and includes a cylindrical lamp array structure (13) surrounding a cylindrical process tube (16). The cylindrical process tube (16) has a lengthwise central axis (22). The cylindrical lamp array struc... | 12/17/2002 |
| 6495802 | Temperature-controlled chuck and method for controlling the temperature of a substantially flat object The present invention generally relates to a method for controlling the temperature of a substantially flat object and to a temperature-controlled chuck comprising a chuck body (20) having an object support side (21) and a back side (22). Said object supp... | 12/17/2002 |
| 6492621 | Hot wall rapid thermal processor An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is configured to move bet... | 12/10/2002 |
| 6491757 | Wafer support system An apparatus for processing a substrate comprises a susceptor for supporting the substrate, an upper heat source spaced above the susceptor, a lower heat source spaced below the susceptor, and a controller. The controller provides power to the heat source... | 12/10/2002 |
| 6486444 | Load-lock with external staging area The present invention generally provides a vacuum system having a small-volume load-lock chamber for supporting a substrate set of only two rows of substrates, which provides for quick evacuation and venting of the load-lock chamber to provide a continuou... | 11/26/2002 |
| 6483082 | Heater lift lead screw for vertical furnaces A heater lift mechanism with a ball screw linear actuator provides a relatively maintenance free lift mechanism with low starting torque and high positional accuracy. The heater lift mechanism can also be used to move wafer boats in a vertical furnace. Th... | 11/19/2002 |
| 6483068 | Apparatus for hard baking photoresist pattern A hard baking apparatus which is capable of evenly heating a semiconductor substrate when a photoresist pattern of the semiconductor substrate is hard baked. The apparatus for hard baking a photoresist pattern including: a chamber; a chuck installed at a ... | 11/19/2002 |
| 6483081 | In-line cure furnace and method for using the same A system and method for thermal curing of substrates are provided. In one example, a pair of vertical furnace tubes are configured with a hot plate positioned between the lower regions of the furnace tubes and connected to each tube by a passageway. A coo... | 11/19/2002 |
| 6483083 | Heat treatment method and a heat treatment apparatus for controlling the temperature of a substrate surface A substrate to be processed on which a thin film is formed is supported by a support member. The substrate to be processed is heated by a heating section. The surface temperature is measured by a radiation thermometer, and the heating temperature of the h... | 11/19/2002 |
| 6483989 | Substrate processing apparatus and semiconductor device producing method A substrate processing apparatus is disclosed for heating a substrate by a heater through a susceptor in a state in which the substrate is placed on the susceptor, to process the substrate. The heater is divided into a plurality of respectively controlled... | 11/19/2002 |
| 6476362 | Lamp array for thermal processing chamber A lamp array for a thermal processing chamber. The lamp array includes a plurality of lamps arranged in a generally circular array. The plurality of lamps can be arranged in one or more concentric rings to form a generally circular array. Additional lamp ... | 11/05/2002 |
| 6472639 | Heat treatment method and heat treatment apparatus Uniformity of temperature is established within a wafer, and a higher throughput is achieved while the wafer heating time is dramatically reduced by combining lamp heating with hot-wall heating. Lamps 10 are provided outside the furnace body 3 of a hot-wa... | 10/29/2002 |
| 6465761 | Heat lamps for zone heating A reactor chamber is positioned between a top array of heat lamps and a bottom array of heat lamps. At least one of the heat lamps forming the top and bottom arrays features a segmented filament such that power output along the length of the heat lamp dif... | 10/15/2002 |
| 6461036 | System and method for determining stray light in a thermal processing system A system and method for determining the stray radiation within a heating chamber of a thermal processing apparatus. The stray radiation is determined by moving a generally unheated wafer vertically through the heating chamber, and measuring with a detecto... | 10/08/2002 |
| 6462315 | Optical radiation measurement apparatus An optical radiation measurement apparatus is provided. The apparatus has at least one radiation detector for measuring electromagnetic radiation emitted from at least two radiation sources. Separate radiation channels are provided in a channel member in ... | 10/08/2002 |
| 6462310 | Hot wall rapid thermal processor An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is. configured to move be... | 10/08/2002 |
