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| Number | Title | Issue Date |
| 8106330 | Method for fabricating semiconductor film and semiconductor device and laser processing apparatus A technique to control segregation of impurities when reforming crystallinity and crystallization of a semiconductor film by using a laser beam irradiation is provided. The present invention is to irradiate the substrate with applying ultrasonic vibration while keep... | 01/31/2012 |
| 7897894 | Laser machining apparatus for sheet-like workpiece There is provided a laser machining apparatus for sheet-like workpieces that allows an installation area to be reduced and that may be readily controlled. The laser machining apparatus includes a Y-table movable in X- and Y-plane directions orthogonal to a laser bea... | 03/01/2011 |
| 7820942 | Automatic leveling fixture An automatic leveling fixture includes a base, at least one jaw slidably connected to the base, a base plate slidable relative to the base. The at least one jaw has a base plate camming surface engaging the base plate and causing the at least one jaw to move a prese... | 10/26/2010 |
| 7807946 | Workpiece cutting and free body scrap collection system A system (20) adapted for securing a hollow workpiece (22) in a fixed position, for cutting at least one portion of the workpiece (22) to produce a free body scrap (24), and for collecting and conveying the scrap (24) to a predeter... | 10/05/2010 |
| 7759608 | Slat for laser-cutting machine table The invention relates to the general field of cutting machines using a laser beam; it relates more particularly to a system of slats for a laser-cutting machine table. These slats (8) each consist of a trough (9) containing a plurality of juxtaposed in... | 07/20/2010 |
| 7728257 | Method of forming embrittled areas inside wafer for division A method of forming embrittled areas in multiple layers inside a wafer so as to enable the wafer to be divided correctly even at areas where embrittled areas intersect. In a first direction embrittling step an embrittled area is formed as a bottom layer, in a second... | 06/01/2010 |
| 7728256 | Silicon crystallization apparatus and silicon crystallization method thereof A novel silicon crystallization apparatus and a silicon crystallization method renders it is possible to form alignment key without additional photolithography, and to adjust a substrate to a correct position by sensing a deviation of the substrate when the substrat... | 06/01/2010 |
| 7649157 | Chuck table for use in a laser beam processing machine A chuck table for use in a laser beam processing machine, having a workpiece holding area for holding a workpiece, wherein the workpiece holding area is similar in shape to the workpiece and smaller in size than the workpiece, and a buffer groove is formed in such a... | 01/19/2010 |
| 7642485 | Laser beam processing machine A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, and a processing-feed means for moving the chuck table and the laser beam application... | 01/05/2010 |
| 7560661 | Laser beam machine A laser beam machine for processing an article to be processed with a laser beam from a processing scanner 1 comprised of an optical system employing a laser oscillator 10. Article position controllers 2a and 2b are controll... | 07/14/2009 |
| 7429034 | Apparatus and method for thermal cutting of a workpiece An apparatus for thermal cutting of workpieces includes a cutting means for separating a workpiece into a finished part and a residual part, a workpiece support, and support elements for supporting the workpiece. Separate first and second support elements are provid... | 09/30/2008 |
| 7426022 | Liquid crystal module brightness measurement apparatus and brightness measurement apparatus A brightness measurement apparatus which includes a placement unit on which an object to be measured is placed, a measurement unit for measuring brightness or chromaticity from an upper surface of the object placed on the placement unit, a placement unit moving mech... | 09/16/2008 |
| 7412762 | Method and device for introducing weakened lines into a component rigid per se For introducing a weakened line into a component 10, which is rigid per se and does not conform to a supporting mold or a receiving means in correspondence with the true shape, especially into an injection-molded part such as an instrument panel of an automob... | 08/19/2008 |
| 7385157 | Laser beam welding method and apparatus While steel sheets are positioned and held by a holding mechanism, a first laser beam is applied to a heating region of the steel sheet to space the steel sheet from the other steel sheet by a predetermined distance. A second laser beam is applied to a welding regio... | 06/10/2008 |
| 7368682 | Processing apparatus A processing apparatus contains a holding member for holding a workpiece, and a laser beam shining member for shining a laser beam at the workpiece held on the holding member. The holding member has a holding plate and the workpiece is placed on the holding plate. T... | 05/06/2008 |
| 7363102 | Method and apparatus for precise marking and placement of an object The present invention provides a precise marking apparatus for performing precise marking on an object and methods of using the same. The precise marking apparatus comprises an object input handler and an object output handler for handling the object; a transport sy... | 04/22/2008 |
| 7356240 | Processing method of polymer crystal, processing system of polymer crystal, and observation system of polymer crystal The ultraviolet short-pulse laser light emitted from the ultraviolet short-pulse laser light source 1 is focused on and caused to irradiate a macromolecular crystal 8 contained in a sample container 6 via a shutter 2, intensity adjusting ... | 04/08/2008 |
| 7332689 | Tacking method and apparatus An apparatus for tacking a multi-lumen tubular assembly together comprises a laser, an optical member and a placement tray for retaining the tubular assembly. A portion of the optical member defines a window that is substantially transparent to laser energy emitted ... | 02/19/2008 |
| 7329830 | High-rate laser marking machine A laser marking machine for objects, namely supports or cards carrying integrated circuits, has a laser chamber having two marking locations for receiving the objects to be marked on at least one face by at least one laser marker having optics for deflecting the las... | 02/12/2008 |
| 7326877 | Laser thermal processing chuck with a thermal compensating heater module Chuck methods and apparatus for supporting a semiconductor substrate and maintaining it at a substantially constant background temperature even when subject to a spatially and temporally varying thermal load. Chuck includes a thermal compensating heater module havin... | 02/05/2008 |
| 7312418 | Semiconductor thin film forming system In a semiconductor thin film forming system for modifying a predetermined region of a semiconductor thin film by exposing the semiconductor thin film to a projected light patterned through a pattern formed on a photo mask, the system includes a mechanism (opt20 | 12/25/2007 |
| 7282665 | Method and apparatus for processing articles with a laser beam A method for joining workpieces by welding with laser light, in which a plurality of workpieces are arranged between a lower pressure plate and a translucent upper pressure plate on a multiplicity of supporting segments movable in a vertical direction, whereby the w... | 10/16/2007 |
| 7283892 | Hybrid compact sensing apparatus for adaptive robotic processes A hybrid compact sensing apparatus for generating signals usable for guiding a process robot as a function of an object detected in a scene. The apparatus comprises a laser light generator, two optical sensors, one or more ultrasound sensors, and a control unit, all... | 10/16/2007 |
| 7271364 | Laser welding fixture and method A laser welding fixture for holding a workpiece includes a base, a processing head adapted to magnetically couple to the base, and a collet. The processing head has at least one collet holder assembly and at least one stop. The collet is removably coupled to the hol... | 09/18/2007 |
| 7257879 | Combination apparatus for machining material with a milling cutter and a laser The invention is directed to an apparatus for cutting material by means of a milling cutter and laser radiation. The apparatus comprises a milling unit, a work spindle, a milling cutter, a laser, deflecting elements, focusing optics, and a work table. According to t... | 08/21/2007 |
| 7238543 | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties A method used for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including backgrinding in particular. The present method comprises reducing the cros... | 07/03/2007 |
| 7237309 | Milling machine for longitudinal profiled elements The present invention relates to a machine intended for the machining of profiled elements (10), of the type comprising a longitudinal frame (1) provided with holding dollies (11, 13) for holding the profiled element to be machined (10). ... | 07/03/2007 |
| 7216512 | Method of making an optical fiber by laser cleaving A field-installable connector includes a connector housing and a ferrule having front and rear opposed faces and at least one fiber bore defined longitudinally therethrough. A laser processed stub optical fiber is disposed within the one fiber bore of the ferrule an... | 05/15/2007 |
| 7187507 | Optical component and laser irradiation apparatus The present invention provides an optical component for fixing a lens comprising a base, a holder, and a fastener. The base has a concave side surface and at least one first hole. The holder has a cylindrical shape and has a second hole penetrating through a center ... | 03/06/2007 |
| 7172376 | Workpiece positioner A workpiece positioner includes a workpiece holder that is mounted to a chassis for rotation about a central axis, and further includes a first set of workpiece supports for retaining and supporting a first workpiece between a drive end and an idler end, and a secon... | 02/06/2007 |
| 7170029 | Method and apparatus for deflashing of integrated circuit packages This invention relates to a method and apparatus for deflashing integrated circuit (IC) packages by laser irradiation. The method and apparatus include two lasers scanning flash area for performing deflashing operation. CO2 laser is used to remove top lay... | 01/30/2007 |
| 7161114 | Laser cutting installation with parts unloading unit A machine tool installation for laser cutting of sheet metal workpieces includes a workpiece support having a multiplicity of parallel spaced grid elements providing the upper surface thereof, and a machine frame having a generally vertical rear wall and an arm exte... | 01/09/2007 |
| 7157038 | Ultraviolet laser ablative patterning of microstructures in semiconductors Patterns with feature sizes of less than 50 microns are rapidly formed directly in semiconductors, particularly silicon, GaAs, indium phosphide, or single crystalline sapphire, using ultraviolet laser ablation. These patterns include very high aspect ratio cylindric... | 01/02/2007 |
| 7141758 | Laser processing installation with readily accessible cutting unit A machine tool installation for laser cutting of sheet workpieces has a workpiece support, an elongated machine frame of generally C-shaped configuration providing an arm extending over the workpiece support, a pair of tracks on the arm and extending longitudinally ... | 11/28/2006 |
| 7135389 | Irradiation method of laser beam A laser irradiation method using a laser crystallization method which can heighten an efficiency of substrate processing as compared to a conventional one and also heighten mobility of a semiconductor film is provided. It is an irradiation method of a laser beam in ... | 11/14/2006 |
| 7132622 | Laser machining apparatus and laser machining method There is provided a laser machining apparatus, and a laser machining method using the same. The laser machining apparatus has a body portion having a plurality of laser irradiating sections and work mounting sections, a supplying stocker for supplying workpieces, an... | 11/07/2006 |
| 7108012 | Fluid control valve A fluid control valve for the mixing of hot and cold water and delivery at a selected flow rate is described wherein an upper housing and lower housing are clamped together by a snap-fit connection thereby enclosing other fluid control valve component parts. A ball ... | 09/19/2006 |
| 7109436 | Laser shock peening target A laser target includes a shank having a first wedge converging from a step to a distal end of the wedge. A complementary second wedge is mounted on the step and converges with the first wedge. The two wedges have respective target apertures aligned with each other ... | 09/19/2006 |
| 7105377 | Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process A method and system for universal packaging in conjunction with an automated in-line back-end IC manufacturing process. In one method embodiment, the present invention processes a die-strip through a number of integrated in-line processes that function independently... | 09/12/2006 |
| 7098423 | Laser machining apparatus There is provided a printed board machining apparatus having fewer restrictions in terms of the length of printed boards to be machined, that can be readily controlled in positioning a sheet-like workpiece and that is capable of improving the machining efficiency. P... | 08/29/2006 |
