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"I watched his countenance closely, to see if he was not deranged ... and I was assured by other senators after he left the room that they had no confidence in it."
U.S. Senator Smith of Indiana ; After seeing Samuel Morse demonstrate the telegraph.
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| Number | Title | Issue Date |
| 7901588 | MRAM wet etch method An etching process is employed to selectively pattern the top magnetic film layer, the tunnel barrier, and the pinned bottom magnetic layer of a magnetic thin film structure. The pinned bottom magnetic film layer has an antiferromagnetic layer or a Ru spacer formed ... | 03/08/2011 |
| 7887713 | Method for producing an electronic component A method includes forming a first electrode and a second electrode on a base body. The Method also includes chemically etching at least a portion of the base body to adjust a resistance of the base body measured between the first electrode and the second electrodes ... | 02/15/2011 |
| 7622052 | Methods for chemical mechanical planarization and for detecting endpoint of a CMP operation Methods are provided for chemical mechanical planarization of a layer and for determining the endpoint of a CMP operation. In accordance with one embodiment the method for determining an endpoint comprises making a plurality of eddy current thickness measurement of ... | 11/24/2009 |
| 7371686 | Method and apparatus for polishing a semiconductor device A method and an apparatus for polishing a semiconductor wafer are provided. An initial thickness of the semiconductor wafer is actually measured to obtain a measured initial thickness value. First and second inter-positions are then set or determined with reference ... | 05/13/2008 |
| 7357878 | Etchant, and method for fabricating a thin film transistor subtrate including conductive wires using the etchant and the resulting structure Provided are an etchant, a method for fabricating a wire using the etchant, and a method for fabricating a thin film transistor (TFT) substrate using the etchant. The etchant includes a material having the formula 1, ammonium acetic acid, and the remainder of deioni... | 04/15/2008 |
| 7358199 | Method of fabricating semiconductor integrated circuits A method of fabricating semiconductor integrated circuits includes (1) providing a spin-on tool comprising a rotatable platen for holding and spinning a wafer disposed thereon, a fluid supply system for providing spin-on solution onto the wafer, and a detector fixed... | 04/15/2008 |
| 7354861 | Polishing method and polishing liquid Disclosed is a method for polishing a surface of a substrate containing Ru or a Ru compound in a surface region, said method comprising a polishing step with a polishing liquid containing tetravalent cerium ions. The polishing liquid is prepared by adding a compound... | 04/08/2008 |
| 7323116 | Methods and apparatus for monitoring a process in a plasma processing system by measuring self-bias voltage A method for in-situ monitoring a process in a plasma processing system having a plasma processing chamber is disclosed. The method includes positioning a substrate in the plasma processing chamber. The method also includes striking a plasma within the plasma proces... | 01/29/2008 |
| 7283226 | Measurement system cluster Systems and methods are disclosed for measuring semiconductor wafers in a fabrication process using one or more of a plurality of measurement systems. A measurement system cluster is provided having a plurality of such measurement systems, along with a system for tr... | 10/16/2007 |
| 7276175 | Semiconductor device fabrication method A semiconductor device fabrication method comprises (1) forming a patterned mask layer on an oxide layer of a Mn-containing perovskite type oxide; (2) heat-treating the oxide layer; and (3) patterning the oxide layer with an etching solution containing at least one ... | 10/02/2007 |
| 7258595 | Polishing apparatus A polishing apparatus comprises a polishing table having a polishing surface and a top ring for holding a substrate to be polished, in which the substrate when held by the top ring is pressed against the polishing surface of the polishing table and thus polished. A ... | 08/21/2007 |
| 7254458 | Systems and methods for metrology recipe and model generation Systems and methodologies are disclosed for generating setup information for use measuring process parameters associated with semiconductor devices. A system comprises an off-line measurement instrument to measure an unpatterned wafer and a setup information generat... | 08/07/2007 |
| 7189139 | Polishing apparatus A polishing apparatus can detect completion of initialization of a polishing pad quantitatively. The polishing apparatus has a polishing table having a polishing pad attached thereto and a substrate holder configured to bring a surface of a substrate into contact wi... | 03/13/2007 |
| 7165560 | Etching method, etching apparatus, and method for manufacturing semiconductor device In order to reliably remove, by wet etching, a compound containing a metal and silicon, e.g., a silicate (101a) containing hafnium metal, the silicate (101a) is oxidized and then the oxidized silicate (101a) is wet-etched. | 01/23/2007 |
| 7134152 | Adaptable, low cost air gap and flow control A kitchen sink installation includes a plurality of adjacent kitchen sinks having drain tailpieces, a manifold pipe mounted substantially horizontally under the sinks and having a length and a plurality of discrete openings along its length, each of the openings fac... | 11/14/2006 |
| 7117718 | Device for ascertaining a particle concentration in an exhaust gas flow A device for ascertaining a particle concentration in an exhaust gas flow of a combustion device, particularly a diesel combustion device, is provided, which device ascertains very small particle concentrations in the exhaust gas of combustion devices, accompanied b... | 10/10/2006 |
| 7106433 | Measurement system cluster Systems and methods are disclosed for measuring semiconductor wafers in a fabrication process using one or more of a plurality of measurement systems. A measurement system cluster is provided having a plurality of such measurement systems, along with a system for tr... | 09/12/2006 |
| 7090965 | Method for enhancing adhesion between reworked photoresist and underlying oxynitride film A method for enhancing adhesion between a reworked photoresist and an underlying oxynitride film. A photoresist pattern layer is formed on an oxynitride layer overlying a substrate. The photoresist pattern layer is removed by acidic solution or oxygen-containing pla... | 08/15/2006 |
| 7091132 | Ultrasonic assisted etch using corrosive liquids An ultrasonic etching apparatus for chemically-etching a workpiece is disclosed. The apparatus includes an outer tank at least partially filled with an aqueous solution, an inner tank at least partially disposed within the outer tank and in contact with aqueous solu... | 08/15/2006 |
| 7066800 | Conductive polishing article for electrochemical mechanical polishing An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adap... | 06/27/2006 |
| 7040954 | Methods of and apparatus for controlling polishing surface characteristics for chemical mechanical polishing Apparatus and methods control CMP to uniformly polish a series of wafers. Average motor current I(avg) drawn by, and related average work W(avg) performed by, motors during CMP on the wafers reliably indicate quality of a roughness polishing characteristic of a poli... | 05/09/2006 |
| 7014732 | Etching apparatus Disclosed is an etching apparatus enabling to increase productivity of etching glass substrates. The present invention includes an etching bath having an etchant, a plurality of sensors inside the etching bath detecting a level of the etchant, and a deionized water ... | 03/21/2006 |
| 7011762 | Metal bridging monitor for etch and CMP endpoint detection One aspect of the present invention relates to a wafer containing a semiconductor substrate, at least one metal layer formed over the semiconductor substrate, and at least one electrical sensor embedded at least one of on and in the wafer to facilitate real time mon... | 03/14/2006 |
| 7005383 | Apparatus and methods of chemical mechanical polishing Disclosed are apparatus and methods of chemical mechanical polishing a semiconductor wafer to minimize formation of scratches on a surface of a wafer. According to one example, a method of planarizing a pattern of a wafer by rotating the wafer that is fixed to a car... | 02/28/2006 |
| 6999164 | Measurement system cluster Systems and methods are disclosed for measuring semiconductor wafers in a fabrication process using one or more of a plurality of measurement systems. A measurement system cluster is provided having a plurality of such measurement systems, along with a system for tr... | 02/14/2006 |
| 6995091 | Process for chemically mechanically polishing wafers The invention relates to a process for chemically mechanically polishing and grinding wafers. The CMP slurry that is used for grinding is analyzed using slurry atomic absorption spectroscopy. This allows rapid and sensitive analysis of the slurry constituents, in pa... | 02/07/2006 |
| 6979248 | Conductive polishing article for electrochemical mechanical polishing An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coat... | 12/27/2005 |
| 6951624 | Method and apparatus of arrayed sensors for metrological control A system for processing a wafer is provided. The system includes a chemical mechanical planarization (CMP) tool. The CMP tool includes a wafer carrier defined within a housing. A carrier film is affixed to the bottom surface and supports a wafer. A sensor embedded i... | 10/04/2005 |
| 6952014 | End-point detection for FIB circuit modification A Focused Ion Beam (FIB) milling end-point detection system uses a constant current power supply to energize an Integrated Circuit (IC) that is to be modified. The FIB is cycled over a conductive trace that is to be accessed during the milling process. The input pow... | 10/04/2005 |
| 6858538 | Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies Methods and devices for mechanical and/or chemical-mechanical polarization of semiconductor wafers, field emission displays and other microelectronic substrate assemblies. One method of plagiarizing a micro electronic substrate assembly in accordance with the invent... | 02/22/2005 |
| 6843927 | Method and apparatus for endpoint detection in electron beam assisted etching Techniques for detecting endpoints during semiconductor dry-etching processes are described. The dry-etching process of the present invention involves using a combination of a reactive material and a charged particle beam, such as an electron beam. In another embodi... | 01/18/2005 |
| 6750152 | Method and apparatus for electrically testing and characterizing formation of microelectric features A semiconductor wafer is etched to create an array of MEMS devices and at the same time, test sites having geometry which represent critical geometry of the MEMS devices. Probe contacts are provided in the test sites to permit measurement of resistance and capacitan... | 06/15/2004 |
| 6727107 | Method of testing the processing of a semiconductor wafer on a CMP apparatus A method of testing the processing of a wafer on a CMP apparatus includes processing a control wafer with the CMP apparatus with a predetermined control consumable combination under a predetermined set of control conditions and generating a control data set which de... | 04/27/2004 |
| 6720266 | Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies Methods and devices for mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays and other microelectronic substrate assemblies. One method of planarizing a microelectronic substrate assembly in accordance with the inventi... | 04/13/2004 |
| 6699791 | Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies Methods and devices for mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays and other microelectronic substrate assemblies. One method of planarizing a microelectronic substrate assembly in accordance with ... | 03/02/2004 |
| 6666980 | Method for manufacturing a resistor A method for manufacturing a resistor function in an electric conductor on the surface of a carrier, preferably a conductor on printed circuit boards, substrates and chips. By etching using an anisotropic etching technique, the conductor is provided with ... | 12/23/2003 |
| 6599759 | Method for detecting end point in plasma etching by impedance change A method for detecting end-point in a plasma etching process by monitoring plasma impedance changes on a time scale is disclosed. In the method, a plasma etching process is first conducted in a process chamber, while changes in a parameter of plasma imped... | 07/29/2003 |
| 6585909 | Method of manufacturing oxide thin film for bolometer An oxide for use in a bolometer with an oxide thin-film formed is manufactured on an insulating substrate. Metal organic compound is dissolved in solvent to form solution during manufacturing the oxide thin-film. The solution is applied on the insulating ... | 07/01/2003 |
| 6562254 | Etching method A method of reducing the thickness t of a layer of material on a substrate when the substrate is exposed to an etchant for a span of time sufficient to reduce t to a value to, at which point exposure to the etchant is interrupted, includes the ... | 05/13/2003 |
| 6492273 | Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies Methods and devices for mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays and other microelectronic substrate assemblies. One method of planarizing a microelectronic substrate assembly in accordance with ... | 12/10/2002 |
