Quotables
"Radio has no future."
Lord Kelvin, British mathematician and physicist ; 1897
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8182709 | CMP system and method using individually controlled temperature zones By creating a temperature profile across a polishing pad, a respective temperature profile may be obtained in a substrate to be polished, which may result in a respective varying removal rate across the substrate for a chemically reactive slurry material or for an e... | 05/22/2012 |
| 8173037 | Wafer polish monitoring method and device A wafer polish monitoring method and device for detecting the end point of the polishing of a conductive film with high precision and accuracy by monitoring the variation of the film thickness of the conductive film without adverse influence of slurry or the like af... | 05/08/2012 |
| 8153017 | Substrate treating method A substrate treating apparatus for heating a treating solution formed of a chemical and a diluent, and immersing substrates in the treating solution for treatment. The apparatus includes a treating tank for storing the treating solution, a heater for heating the tre... | 04/10/2012 |
| 8088298 | Spectra based endpointing for chemical mechanical polishing Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting two or more reference spectra. Each reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than... | 01/03/2012 |
| 8066897 | Dynamic hard magnet thickness adjustment for reduced variation in free layer stabilization field in a magnetoresistive sensor A method for manufacturing a current perpendicular to plane magnetoresistive sensor that allows for dynamic adjustment of free layer biasing to compensate for variations in thickness of an electrically insulating layer that separates the hard bias layers from the fr... | 11/29/2011 |
| 7998358 | Peak-based endpointing for chemical mechanical polishing A polishing system receives one or more target parameters for a selected peak in a spectrum of light, polishes a substrate, measures a current spectrum of light reflected from the substrate while the substrate is being polished, identifies the selected peak in the c... | 08/16/2011 |
| 7981309 | Method for detecting polishing end in CMP polishing device, CMP polishing device, and semiconductor device manufacturing method The spectral reflectance spectrum of an object of polishing that has reached the polishing endpoint is found ahead of time, the spectral reflectance spectrum of the object of polishing is found during polishing, and the correlation coefficient of these is seen as pa... | 07/19/2011 |
| 7910014 | Method and system for improving wet chemical bath process stability and productivity in semiconductor manufacturing A chemical processing bath and system used in semiconductor manufacturing utilizes a dynamic spiking model that essentially constantly monitors chemical concentration in the processing bath and adds fresh chemical on a regular basis to maintain chemical concentratio... | 03/22/2011 |
| 7883635 | Substrate treating apparatus and method A substrate treating apparatus for treating substrates with a treating solution having a mixture of a chemical and a diluent. The apparatus includes a treating tank for storing the treating solution, a heating device for heating the treating solution, a supply pipe ... | 02/08/2011 |
| 7691279 | Method of producing a glass substrate for a mask blank and method of producing a mask blank A method of producing a glass substrate for a mask blank has the steps of measuring a convex/concave profile of a surface of the glass substrate, controlling a flatness of the surface of the glass substrate to a value not greater than a predetermined reference value... | 04/06/2010 |
| 7686973 | Silicon wafer etching method and apparatus, and impurity analysis method A wafer etching and impurity analysis method is presented in which a wafer is held in a vessel having gas introduction and exhaust ports, a solution including a mixture of hydrofluoric acid and nitric acid alone or together with sulfuric acid is bubbled with a carri... | 03/30/2010 |
| 7625495 | Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies Methods and devices for mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays and other microelectronic substrate assemblies. One method of planarizing a microelectronic substrate assembly in accordance with the inventi... | 12/01/2009 |
| 7517469 | Method and system to measure flow velocity and volume Systems, devices and methods of measuring a flow of a liquid stream for a semiconductor process are provided. The liquid stream is delivered through a liquid delivery nozzle. The nozzle is adapted to deliver the liquid stream for the semiconductor process. The free ... | 04/14/2009 |
| 7435355 | Liquid-based gravity-driven etching-stop technique for controlling structure dimension A liquid-based gravity-driven etching-stop technique for controlling structure dimension is provided, where opposite etching trenches in cooperation with an etching-stop solution are used for controlling the dimension of a microstructure on the wafer level. In an em... | 10/14/2008 |
| 7395611 | System processing a substrate using dynamic liquid meniscus A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parall... | 07/08/2008 |
| 7393790 | Method of manufacturing carrier wafer and resulting carrier wafer structures A method is disclosed for preparing carrier wafers for semiconductor device manufacture. The method includes the steps of sorting a plurality of standard carrier wafer blanks into batches by thickness to define a batch of starting carrier wafers that are within a pr... | 07/01/2008 |
| 7384569 | Imprint lithography mask trimming for imprint mask using etch Disclosed are photolithographic systems and methods, and more particularly systems and methodologies that enhance imprint mask feature resolution. An aspect generates feedback information that facilitates control of imprint mask feature size and resolution via emplo... | 06/10/2008 |
| 7371686 | Method and apparatus for polishing a semiconductor device A method and an apparatus for polishing a semiconductor wafer are provided. An initial thickness of the semiconductor wafer is actually measured to obtain a measured initial thickness value. First and second inter-positions are then set or determined with reference ... | 05/13/2008 |
| 7361610 | Method of etching a glass substrate The present invention discloses an etching apparatus comprising an etching bath having an etchant; an etchant recycling part in the etching bath; a DI and undiluted etchant supply part for supplying a DI water and a undiluted etchant; an etchant mixing part for mixi... | 04/22/2008 |
| 7361286 | Method of detecting etching end-point A method of detecting an etching end-point includes the steps of: forming a mask on a pattern area of an etching object; forming an etching indicator on an etching area of the etching object, which is not covered by the mask; etching the etching object using the mas... | 04/22/2008 |
| 7361600 | Semiconductor manufacturing apparatus having a built-in inspection apparatus and a device manufacturing method using said manufacturing apparatus According to the present invention, a chemical and mechanical polishing apparatus (100) for a sample such as a wafer includes a built-in inspection apparatus (25) incorporated therein. The polishing apparatus (100) further comprises a load unit ... | 04/22/2008 |
| 7354733 | Method for sorting and separating living cells We disclose methods of sorting or separating mixtures of living cells (e.g., eukaryotic, prokaryotic, mammalian, pathogenic, bacterial, viral, etc.). We perform our methods by activating cell-selective photophoric labels, which photosensitize and chemically reduce a... | 04/08/2008 |
| 7340372 | Apparatus and method for investigating parameters of layers deposited on semiconductor wafers In order to determine the dielectric constant of a layer deposited on a semiconductor wafer (2), the density of the layer is obtained. To obtain that density, the wafer (2) without the layer is weighed in a weighing chamber (4) in which a weighi... | 03/04/2008 |
| 7332054 | Etch apparatus In a process using a hot phosphoric acid etchant (12) to etch silicon nitride on a semiconductor wafer (15) submerged in a tank (11) of the etchant (12), a recirculating path is established for the etchant (12). A porous filter ( | 02/19/2008 |
| 7332197 | Methods of fabricating microneedle arrays using sacrificial molds, and microneedle arrays fabricated thereby Microneedle arrays are fabricated by providing a sacrificial mold including a substrate and an array of posts, preferably solid posts, projecting therefrom. A first material is coated on the sacrificial mold including on the substrate and on the array of posts. The ... | 02/19/2008 |
| 7312154 | Method of polishing a semiconductor-on-insulator structure A method of polishing a semiconductor layer formed on a transparent substrate is described, the method including measuring the thickness of the semiconductor from the substrate side of the semiconductor layer simultaneously with the polishing, and using the thicknes... | 12/25/2007 |
| 7300598 | Substrate processing method and apparatus The invention relates to a process including a chemical liquid treatment and a rinse liquid treatment on a substrate, more particularly to a technique for reducing consumption of a chemical liquid while achieving uniform process and preventing particle generation. I... | 11/27/2007 |
| 7294044 | Slurry composition and method for polishing organic polymer-based ophthalmic substrates The present invention provides a slurry composition and method for polishing organic polymer-based ophthalmic substrates. The slurry composition according to the invention includes an aqueous dispersion of abrasive particles and a pyrrolidone compound. The abrasive ... | 11/13/2007 |
| 7291282 | Method of fabricating a mold for imprinting a structure The present invention provides a method of fabricating an imprint mold for molding a structure. The method includes directing a first and a second flux for forming a first material and a second material, respectively, to a substrate to form a layered structure havin... | 11/06/2007 |
| 7291565 | Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid A method and system is described for treating a substrate with a high pressure fluid, such as carbon dioxide in a supercritical state. A process chemistry is introduced to the high pressure fluid for treating the substrate surface. The process chemistry comprises fl... | 11/06/2007 |
| 7270762 | Polishing compositions for noble metals The polishing composition of this invention is useful for chemical-mechanical polishing of substrates containing noble metals such as platinum and comprises up to about 50% by weight of a adjuvant wherein said adjuvant is s elected from a group consisting of a metal... | 09/18/2007 |
| 7261832 | Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies Methods and devices for mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays and other microelectronic substrate assemblies. One method of planarizing a microelectronic substrate assembly in accordance with the inventi... | 08/28/2007 |
| 7258703 | Apparatus and method for aligning devices on carriers An apparatus and method are provided for aligning a plurality of semiconductor devices placed on a carrier. Alignment guides are located adjacent to each device in use, and arranged such that they correspond to a desired alignment of each semiconductor device. For a... | 08/21/2007 |
| 7252778 | Etching method and etching device An etching method and etching device are provided, enabling uniform rendering of the thickness of a film for processing on a wafer regardless of the film thickness profile thereof, and thereby enabling global planarizing of the wafer surface. In an etching method, t... | 08/07/2007 |
| 7246423 | System and method for in-line production of insulated glass units for custom windows A system and a method for in-line production of insulated glass units (IGU) for custom windows. The system and method schedule IGU production based on the order in which the cut glass is available, or broken out, from a glass cutting station. Once the IGUs are assem... | 07/24/2007 |
| 7242828 | Optical circuit in which fabrication is easy In a method for fabricating an optical circuit, a mirror element with a protection film formed within a die of a semiconductor is connected to a substrate at a predetermined position. The mirror element with the protection film connected to the substrate is peeled f... | 07/10/2007 |
| 7211121 | Polishing composition The present invention relates to a polishing composition more suitable for use in polishing synthetic resin products or metal products. The polishing composition includes a reaction product produced by a reaction between a polyalkylene oxide and a compound having a ... | 05/01/2007 |
| 7199053 | Method for detecting end-point of chemical mechanical polishing process Disclosed is a method for detecting an end-point of a CMP process of a semiconductor device. More specifically, when all polishing processes are performed using a nitride film as a polishing barrier film, a buffer layer including nitrogen is formed on the nitride fi... | 04/03/2007 |
| 7165560 | Etching method, etching apparatus, and method for manufacturing semiconductor device In order to reliably remove, by wet etching, a compound containing a metal and silicon, e.g., a silicate (101a) containing hafnium metal, the silicate (101a) is oxidized and then the oxidized silicate (101a) is wet-etched. | 01/23/2007 |
| 7160739 | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles A method of controlling surface non-uniformity of a wafer in a polishing operation includes (a) providing a model for a wafer polishing that defines a plurality of regions on a wafer and identifies a wafer material removal rate in a polishing step of a polishing pro... | 01/09/2007 |
