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| Number | Title | Issue Date |
| 7407890 | Patterning sub-lithographic features with variable widths A method of processing a substrate of a device comprises the as following steps. Form a cap layer over the substrate. Form a dummy layer over the cap layer, the cap layer having a top surface. Etch the dummy layer forming patterned dummy elements of variable widths ... | 08/05/2008 |
| 7312159 | Compositions for dissolution of low-k dielectric films, and methods of use An improved composition and method for cleaning the surface of a semiconductor wafer are provided. The composition can be used to selectively remove a low-k dielectric material such as silicon dioxide, a photoresist layer overlying a low-k dielectric layer, or both ... | 12/25/2007 |
| 7273564 | Method and apparatus for fabricating flat panel display A method of fabricating a flat panel display device including: coating an etch-resist on a thin film; forming a soft mold having a groove and a protrusion for patterning the thin film; treating an end surface of the protrusion; applying the soft mold to the etch-res... | 09/25/2007 |
| 7060324 | Method of creating a dispersion of a liquid on a substrate The present invention includes a method of moving a liquid between a substrate extending in a first plane and a template extending in a second plane. More specifically, the method may include forming an oblique angle between the first plane and the second plane, red... | 06/13/2006 |
| 7033516 | Inexpensive fabrication of large-area pixel arrays for displays and sensors A method and system for fabricating an array of electronic devices, typically a display or sensor is described. In the method, a droplet source ejects droplets of a masking material for deposit on a thin film or substrate surface to mask an element of the array of e... | 04/25/2006 |
| 6984335 | Redundantly constrained laminar structure as weak-link mechanisms Redundantly constrained laminar structures as weak-link mechanisms and a novel method for manufacturing the redundantly constrained laminar structures as weak-link mechanisms are provided. The method for producing the redundantly constrained laminar structures as we... | 01/10/2006 |
| 6770188 | Part fabricating method A structural body material layer is formed directly on a base substrate or via a sacrificing layer or a peeling layer, a groove is fabricated electrochemically along an outer configuration shape of a part constituting an object at the structural body material layer ... | 08/03/2004 |
| 6698097 | Method for manufacturing a tool that is used to form dynamic pressure generating grooves in dynamic pressure bearing devices A method for manufacturing a tool to form a dynamic pressure bearing in which at least one of the bearing surfaces has a plurality of pressure generating grooves defined by projections and in which lubricating fluid is contained in the grooves to provide ... | 03/02/2004 |
| 6541149 | Article comprising micro fuel cell Improved micro fuel cells suitable for portable electrical devices are provided, and processes for forming such cells. In one embodiment of the invention, silicon substrates are used both as the gas delivery structure for the fuel and the oxidant, and as ... | 04/01/2003 |
| 6506315 | Method of reproducing colored images on a heat transferable decorative, at least partially metallized and/or 2 D or 3 D holographic film A method of producing indicia on a metallized and/or a holographic film comprising the steps of (a) printing, on an etchable surface of the film, a co-polymeric primer in a predetermined pattern, (b) depositing an activated etching substance on top of at ... | 01/14/2003 |
| 6473966 | Method of manufacturing ink-jet printer head A printer head substrate having a silicon substrate on which heat generating elements and partitions are formed and an orifice plate which adhered to the partitions is placed on a stage of a helicon-wave dry etching system. Helicon-wave dry etching is per... | 11/05/2002 |
| 6471882 | Process for producing head slider A process for producing a head slider wherein a floating surface is formed on a slider substrate by photolithography. The process for the production of a head slider has a step of forming, on a slider substrate by photolithography, a patterned floating su... | 10/29/2002 |
| 6436220 | Process for the collective removal of resist material and side wall protective film The present invention is intended to collectively remove unnecessary resist material and side wall protective film after dry etching by side wall protection process, making it possible to simplify the process for the preparation of semiconductors, etc. Th... | 08/20/2002 |
| 6387771 | Low temperature oxidation of conductive layers for semiconductor fabrication A method for forming a valve metal oxide for semiconductor fabrication in accordance with the present invention is disclosed and claimed. The method includes the steps of providing a semiconductor wafer, depositing a valve metal on the wafer, placing the ... | 05/14/2002 |
| 6387290 | Tangential flow planar microfabricated fluid filter A microfilter utilizing the principles of tangential flow to prevent clogging, and sloped channel sides to overcome surface tension effects is provided which has feed inlet and exit connected by a feed flow channel; a barrier channel parallel to the feed ... | 05/14/2002 |
| 6379573 | Self-limiting isotropic wet etching process During the formation of a spherical cavity in a substrate, self-limiting etching behavior of an isotropic etchant can be utilized when a tape is used as an etch mask. Such a self-limiting behavior is due to the presence of gas bubbles (consisted of SiF | 04/30/2002 |
| 6280555 | Method of forming a printed circuit board A printed circuit board can be formed by a method that includes the step of cutting a circuit pattern out of a low cost plastic sheet material, and transferring the pattern onto a tape. The tape, with the pattern adhesively attached, is transferred onto a... | 08/28/2001 |
| 6156485 | Film scheme to solve high aspect ratio metal etch masking layer selectivity and improve photo I-line PR resolution capability in quarter-micron technology A method of high aspect ratio etching (HARE) of metal layers in quarter micron technology is disclosed. High aspect ratio patterns are encountered because of the shrinking lateral dimensions over the constant remaining thickness of the features of ultra l... | 12/05/2000 |
| 6138349 | Protective coating for an electronic device A method for forming a protective coating on an exposed surface of an electronic device, including forming the protective coating on a conductive termination connected to a circuit element in the electronic device, and making a window in the protective co... | 10/31/2000 |
| 5972234 | Debris-free wafer marking method The present invention discloses a method for marking an electronic substrate without the splatter or debris defect which can be carried out by first providing a tape, then creating a cavity or a mark through the tape by a high-intensity energy beam or any... | 10/26/1999 |
| 5882536 | Method and etchant to join ag-clad BSSCO superconducting tape A method of removing a silver cladding from high temperature superconducting material clad in silver (HTS) is disclosed. The silver clad HTS is contacted with an aqueous solution of HNO3 followed by an aqueous solution of NH4 OH and ... | 03/16/1999 |
| 5770721 | Method of manufacturing a matrix for the detection of mismatches This method for preparing micromatrices consists in applying a specially-patterned intermediate layer of laser-absorbing substance on a solid support. The configuration of the sublayer fully corresponds to the topology of the manufactured matrix. The inte... | 06/23/1998 |
| 5714079 | Method for making a thin gauge metallic article with electrical insulation on one side A metallic sheet (10) is laminated between a pair of photoresist layers (26, 30) having different properties which permit one photoresist (26) to be stripped from the metallic sheet, substantially without effecting the other photoresist (30). A thin gauge... | 02/03/1998 |
| 5681485 | Method of producing multilayer circuit boards A method of producing multilayer circuit boardschar comprising repeating a procedure comprising the steps of (1) laminating a photosensitive film composition shaped in a film form onto an insulating material carrying a conductor pattern formed thereon, (2... | 10/28/1997 |
| 5670062 | Method for producing tapered lines In accordance with the invention a metal film structure having tapered sidewalls is made by the steps of applying a first layer of metal on a substrate, applying a second layer of a different material over the first layer, forming a pattern of resist on t... | 09/23/1997 |
| 5647999 | Method for fine patterning of a polymeric film A unique method is proposed for fine patterning of a polymeric resin film on a substrate surface or fine patterning of the substrate surface with the patterned resin film as the resist. The method comprises the steps of: (a) forming a thin film of the res... | 07/15/1997 |
| 5641541 | Process to apply photoresist printer to a wafer An improved method for applying a primer to a wafer surface prior to coating the wafer with photoresist is provided. The method comprises priming a wafer with HMDS, removing the wafer from the priming chamber, and closing the chamber. Next, the chamber, p... | 06/24/1997 |
| 5501350 | Process for producing printed wiring board A process for producing a printed wiring board, comprising the steps of forming a photosensitive resist layer on a copper layer provided on an insulating substrate, patterning the photosensitive resist layer, and etching the copper layer made bare from th... | 03/26/1996 |
| 5368683 | Method of fabricating ink jet printheads A plurality of ink jet printheads are produced from two aligned and bonded substrates by an improved fabrication method. The confronting surface of one of the substrates contains a plurality of linear arrays of heating elements and driver circuitry, and t... | 11/29/1994 |
| 4983252 | Process for producing printed circuit board In a process for fabricating a printed circuit board, a positive resist layer is electrodeposited on a copper clad laminate to ensure that the walls of through-holes in the substrate are completely coated with the resist, or alternatively, a film having a... | 01/08/1991 |
| 4983246 | Hot stamping decal resist This present invention is directed to a new technique for supplying and applying resist to copper and other substrate material. In accordance with the present invention, a hot stamping resist decal comprises a release sheet bearing a pattern of the dried ... | 01/08/1991 |
| 4726877 | Methods of using photosensitive compositions containing microgels A solid photopolymerizable composition, contains addition polymerizable ethylenically unsaturated monomer, initiating system, polymer binder and a microgel wherein preferably the binder and microgel form substantially a single phase and have a similar gla... | 02/23/1988 |
| 4710262 | Photopolymerizable composition containing carboxy benzotriazole Improved adhesion to a substrate is obtained employing a photopolymerizable composition containing a carboxy benzotriazole.... | 12/01/1987 |
| 4572764 | Preparation of photoformed plastic multistrate by via formation first Process for preparing multilayer printed circuits comprising laminating to a substrate bearing a circuit pattern or electrically conductive surface a photosensitive layer which is tacky or becomes tacky upon exposure; exposing the laminate to actinic radi... | 02/25/1986 |
| 4512848 | Procedure for fabrication of microstructures over large areas using physical replication The present invention is an improved replication process which copies a master pattern onto an intermediate transfer mask which is then used to form a lithographic mask on the surface of a substrate. A pattern derived from the original master pattern is t... | 04/23/1985 |
| 4470872 | Preventing side-etching by adhering an overhang mask to the sidewall with adhesive A metal member to be etched is subjected to chemical etching through a mask having a predetermined pattern whereafter that portion of the mask overhanging a side-etched portion resulting from the etching is bent down to be joined by an adhesive binder to ... | 09/11/1984 |
| 4323423 | Decorative glass chipping method The invention relates to a method of making a chipped glass panel having a decorative design or pattern which involves spreading a layer of glue on a glass panel. After the layer of glue dries its adhesion to the glass and its tensile strength cause teari... | 04/06/1982 |
| 4247361 | Method of etching a surface of a body A method of etching a surface of a body including the steps of applying a suitable modified epoxy thermo-setting adhesive coating to an etchant resisting masking film; punching the masking film in a predetermined pattern corresponding to the pattern to be... | 01/27/1981 |
| 4155801 | Process for masking sheet metal for chemical milling This process comprises the steps of depositing a suitable maskant which is resistant to the chemicals used in chem-milling on a back-up sheet such as thin plastic, punching or cutting the desired pattern to be removed from the sheet metal through the mask... | 05/22/1979 |
| 4127436 | Vacuum laminating process A process is described for applying, under vacuum, a photoresist-forming layer to a surface, such as a printed circuit board, whereby a laminate without entrapped air bubbles is obtained. The surface to which the photoresist-forming layer is applied has r... | 11/28/1978 |
