Bizarre Patents
Cloaking System Using Optoelectronically Controlled Camouflage
A Cloaking System designed to operate in the visible light spectrum, utilizes optoelectronics and/or photonic components to conceal an object within it.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8092697 | Molecular characterization with carbon nanotube control In a method for fabricating a molecule characterization device, there is formed an aperture in a support structure, and electrical contact pads are formed on a selected surface of the support structure for connection to molecular analysis circuitry. Then at the aper... | 01/10/2012 |
| 8062536 | High density plasma chemical vapor deposition process A method for depositing dielectric material into gaps between wiring lines in the formation of a semiconductor device includes the formation of a cap layer and the formation of gaps into which high density plasma chemical vapor deposition (HDPCVD) dielectric materia... | 11/22/2011 |
| 7931818 | Process of embedded circuit structure A process of an embedded circuit structure is provided. A complex metal layer, a prepreg, a supporting board, another prepreg and another complex metal layer are laminated together, wherein each of the complex metal layers has an inner metal layer and an outer metal... | 04/26/2011 |
| 7718079 | High density plasma chemical vapor deposition process A method for depositing dielectric material into gaps between wiring lines in the formation of a semiconductor device includes the formation of a cap layer and the formation of gaps into which high density plasma chemical vapor deposition (HDPCVD) dielectric materia... | 05/18/2010 |
| 7691276 | Method for manufacturing an electrical connecting element, and a connecting element The method according to the invention is essentially characterised in that a resistance material (5)—for example nickel or a nickel alloy—is attached on a first structured conductor layer (2)—it may be of copper or a copper alloy. Subsequently, t... | 04/06/2010 |
| 7514014 | High density plasma chemical vapor deposition process A method for depositing dielectric material into gaps between wiring lines in the formation of a semiconductor device includes the formation of a cap layer and the formation of gaps into which high density plasma chemical vapor deposition (HDPCVD) dielectric materia... | 04/07/2009 |
| 7422696 | Multicomponent nanorods Multicomponent nanorods having segments with differing electronic and/or chemical properties are disclosed. The nanorods can be tailored with high precision to create controlled gaps within the nanorods or to produce diodes or resistors, based upon the identities of... | 09/09/2008 |
| 7407596 | Fluxgate sensor integrated in printed circuit board and method for manufacturing the same A fluxgate sensor is integrated in a printed circuit board. The fluxgate sensor has two bar-type (or rectangular-ring shaped) soft magnetic cores to form a closed magnetic path on a printed circuit board and an excitation coil in the form of a metal film is wound ar... | 08/05/2008 |
| 7396475 | Method of forming stepped structures employing imprint lithography The present invention provides a method for forming a stepped structure on a substrate that features transferring, into the substrate, an inverse shape of the stepped structure disposed on the substrate. ... | 07/08/2008 |
| 7371452 | Conductive patterned sheet utilizing multi-layered conductive conduit channels Disclosed is an article comprising a polymer layer containing a plurality of integral polymer conduit channels that contain at least two layers with at least one comprising a conductive material and the other serving a function beyond protection. ... | 05/13/2008 |
| 7304373 | Power distribution within a folded flex package method and apparatus A device includes a folded flex substrate. A memory die is connected to a first side of the folded flex substrate. A logic die is connected to a second side of the folded flex substrate. A trace routing pattern of source voltage signals is identical to a trace routi... | 12/04/2007 |
| 7294902 | Trench isolation having a self-adjusting surface seal and method for producing one such trench isolation The invention relates to a trench isolation with a self-aligning surface sealing and a fabrication method for said surface sealing. In this case, the surface sealing may have an overlap region of the substrate surface or a receded region into which extends an electr... | 11/13/2007 |
| 7279110 | Method and apparatus for creating a phase step in mirrors used in spatial light modulator arrays A method and apparatus for patterning an array of SLM mirrors with a phase step is disclosed. Additional embodiments of the present invention describe a method for processing a substrate, wherein the processed substrate is used in the apparatus for patterning an arr... | 10/09/2007 |
| 7220612 | Liquid crystal display device and fabricating method thereof A thin film transistor substrate and a fabricating method thereof for simplifying a process are disclosed. In a liquid crystal display device according to the present invention, a gate line is provided on a substrate. A data line crosses the gate line with having a ... | 05/22/2007 |
| 7218527 | Apparatuses and methods for forming smart labels Apparatuses and methods for forming displays are claimed. This invention relates to a display which may be conformal and which can receive information in order to alter or configure the display. In one embodiment, a flexible layer may be made to receive an array of ... | 05/15/2007 |
| 7213334 | Method for manufacturing double-sided flexible printed board A double-sided flexible printed board is manufactured by: (a) forming a polyimide precursor layer on a metal layer; (b) forming an upper circuit layer on the polyimide precursor layer by a semi-additive technique; and (c) imidating the polyimide precursor layer to f... | 05/08/2007 |
| 7204933 | Method of forming pillars in a fully integrated thermal inkjet printhead Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched... | 04/17/2007 |
| 7195714 | Method and device for producing a system having a component applied to a predetermined location of a surface of a substrate A method for producing a system with a substrate with a surface and a component applied to a predetermined location of the surface of the substrate includes a step of generating a liquid volume containing the component and a step of applying the liquid volume contai... | 03/27/2007 |
| 7179738 | Semiconductor assembly having substrate with electroplated contact pads An apparatus comprising an insulating substrate (101) having first and second surfaces (101a, 101b) and a plurality of metal-filled vias (102) extending from the first to the second surface. The first and second surfaces hav... | 02/20/2007 |
| 7148150 | Method of forming metal line layer in semiconductor device The present invention relates to a method of forming a metal line layer in a semiconductor device comprising step of depositing a metal line layer on a semiconductor structure; forming an insulating film and a photoresist material on the metal line layer in a sequen... | 12/12/2006 |
| 7141176 | Methods and apparatuses for assembling elements onto a substrate Methods and apparatuses for assembling elements onto a substrate. The surfaces of the elements and/or the substrate are treated and the elements are dispensed over the substrate in a slurry. In one example of the invention, the substrate is exposed to a surface trea... | 11/28/2006 |
| 7138170 | Terminated conductive patterned sheet utilizing conductive conduits Disclosed is an article comprising a polymer sheet containing a plurality of integral polymer conduit channels containing a transparent conductive material in which two or more such channels terminate. ... | 11/21/2006 |
| 7135405 | Method to form an interconnect Embodiments of methods, apparatuses, devices, and/or systems for forming an interconnect are described. ... | 11/14/2006 |
| 7128844 | Metal/ceramic circuit board and method for producing same A metal layer 12 of aluminum or an aluminum alloy is formed on at least one side of a ceramic substrate 10, and a resist 14 having a predetermined shape is formed on the metal layer 12. Then, an etchant of a mixed solution prepared by mix... | 10/31/2006 |
| 7112285 | Conductive core substrate fabrication Methods are provided for fabricating plated through hole conductive core substrate which eliminate the secondary step of producing a through hole in the dielectric material plugging the core through hole. In one embodiment of the method in accordance with the invent... | 09/26/2006 |
| 7109068 | Through-substrate interconnect fabrication methods A method for forming a conductive via or through-wafer interconnect (TWI) in a semiconductive substrate for use as a contact card, test connector, semiconductor package interposer, or die interconnect includes the acts of (a) forming an oxide or nitride layer on bot... | 09/19/2006 |
| 7101502 | Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings Methods for forming openings having predetermined shapes in a substrate and apparatuses with these openings. The methods may be used to form assemblies which include the substrate with its openings and elements which are disposed in the openings. In one example of a... | 09/05/2006 |
| 7076870 | Manufacturing process for a surface-mount metal-cavity package for an oscillator crystal blank A surface-mount package for an oscillator crystal blank is made from a metal sheet substrate. Half-etched cavities are formed on one side of the sheet. The half-etched cavities are filled in with an insulator. The center of the insulator is drilled until metal is re... | 07/18/2006 |
| 7052619 | Method for manufacturing printed circuit boards from an extruded polymer Manufacturing process for manufacturing printed circuit boards from an extruded polymer, comprising the steps:-preparing an electro-conductive plate (10) and form embossments (11) by means of selective engraving on a first side (10a), cor... | 05/30/2006 |
| 7049223 | Paste including a mixture of powders, connection plug, burying method, and semiconductor device manufacturing method Form a trench in a major surface of a semiconductor substrate, then bury a paste in the trench. The paste contains solids having a conductive substance and a resin, and solvent for dissolving the resin. The solids content of the paste is not less than 60 vol % and a... | 05/23/2006 |
| 7030031 | Method for forming damascene structure utilizing planarizing material coupled with diffusion barrier material This invention relates to the manufacture of dual damascene interconnect structures in integrated circuit devices. Specifically, a method is disclosed for forming a single or dual damascene structure in a low-k dielectric thin film utilizing a planarizing material a... | 04/18/2006 |
| 7025892 | Method for creating gated filament structures for field emission displays A method is provided for creating gated filament structures for a field emission display. A multi-layer structure is provided that includes a substrate, an insulating layer and a metal gate layer positioned on at least a portion of a top surface of the insulating la... | 04/11/2006 |
| 7022609 | Manufacturing method of a semiconductor substrate provided with a through hole electrode A manufacturing method of a semiconductor substrate provided with a through hole electrode is proposed. In accordance with the methods, it is possible to effectively form a through hole electrode in a semiconductor substrate in which a device and a wiring pattern ha... | 04/04/2006 |
| 7001847 | Micro pattern forming method and semiconductor device manufacturing method A first antireflection film is formed on the surface of an underlying substrate, the first antireflection film suppressing reflection in an absorption mode. A second antireflection film is formed on the first antireflection film, the second antireflection film suppr... | 02/21/2006 |
| 7001658 | Heat selective electrically conductive polymer sheet Disclosed is an article comprising first areas of electrically conductive material and second areas of electrically conductive material raised relative to the first areas and substantially electrically isolated from the first areas, said conductive materials exhibit... | 02/21/2006 |
| 6908361 | Method of planarization of semiconductor devices A method of planarizing a semiconductor device includes the steps of providing a semiconductor substrate, forming a semiconductor component over the semiconductor substrate, depositing a doped silicate glass layer over the semiconductor component using a high densit... | 06/21/2005 |
| 6878297 | Method of producing organic light-emissive devices A method for forming a patterned layer of a light-emissive material on a substrate, comprising the steps of providing a holed layer on the surface of the substrate, the holed layer being permanently attached to the substrate and defining a plurality of holes through... | 04/12/2005 |
| 6783689 | Method of forming pillars in a fully integrated thermal inkjet printhead Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched... | 08/31/2004 |
| 6764747 | Circuit board and method of producing the same A circuit board comprising a resin molded article which includes a metal powder coated by an insulation film and a metal conductor which is formed by metal deposition over a circuit pattern drawn by laser beam irradiation on the surface of the resin molded article t... | 07/20/2004 |
| 6759112 | Exposed and embedded overlay structure The present invention describes a structure for and a method of forming a first set and a second set of features in a substrate; covering the first and second set of features with a material; forming a third set of features in the material and removing the material ... | 07/06/2004 |
