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| Number | Title | Issue Date |
| 8092695 | Endpoint detection for photomask etching Apparatus and method for endpoint detection are provided for photomask etching. The apparatus provides a plasma etch chamber with a substrate support member. The substrate support member has at least two optical components disposed therein for use in endpoint detect... | 01/10/2012 |
| 7998355 | CPL mask and a method and program product for generating the same A method of generating a mask for printing a pattern including a plurality of features. The method includes the steps of depositing a layer of transmissive material having a predefined percentage transmission on a substrate; depositing a layer of opaque material on ... | 08/16/2011 |
| 7867403 | Temperature control method for photolithographic substrate The present invention provides a method for processing a photolithographic substrate, comprising the placement of the photolithographic substrate on a support member in a chamber wherein the photolithographic substrate has an initial temperature of about zero degree... | 01/11/2011 |
| 7803280 | Method for finishing surface of preliminary polished glass substrate The invention provides a method in which waviness generated on a glass substrate surface during pre-polishing is removed, thereby finishing the glass substrate to have a surface excellent in flatness. The method for finishing a pre-polished glass substrate uses ion ... | 09/28/2010 |
| 7615161 | Simplified way to manufacture a low cost cast type collimator assembly A method of fabricating a collimator assembly includes attaching a first layer to a second layer and forming channels through the attached first layer and second layer. Openings are disposed in the first and second layers before attaching the first and second layers... | 11/10/2009 |
| 7585418 | Lithographic mask and manufacturing method thereof Cleaning is carried out by using a sulfuric acid type detergent at a resist stripping and cleaning step (step 5) in a semitranslucent portion forming process and a resist stripping and cleaning step (step 10) in a shielding band forming process, and a ... | 09/08/2009 |
| 7575692 | Method for etching chromium thin film and method for producing photomask An object to be processed has a chromium-based thin film made of a material containing chromium. The thin film is etched using a resist pattern as a mask. The thin film is etched by the use of a chemical species produced by preparing a dry etching gas containing a h... | 08/18/2009 |
| 7569152 | Method for separating a useful layer and component obtained by said method A useful layer (1) is initially attached by a sacrificial layer (2) to a layer (3) forming a substrate. Before etching of the sacrificial layer (2), at least a part of the surface (4, 5) of at least one of the layers in contact wit... | 08/04/2009 |
| 7459095 | Opaque chrome coating suitable for etching A substrate includes an opaque chrome coating on a surface of the substrate dry-etched to form an aperture, wherein chrome in the aperture is below detectable limit. A method of forming an opaque chrome coating having at least two layers on a substrate includes depo... | 12/02/2008 |
| 7455785 | Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, electronic device substrate, mask blank, transfer mask, and polishing apparatus A flatness of a substrate is determined to achieve a desired flatness of a mask blank by predicting the variation in flatness resulting from a film stress of a thin film formed on the substrate. The flatness is adjusted by measuring the flatness of the substrate as ... | 11/25/2008 |
| 7425275 | Shadow mask and method of fabricating vertically tapered structure using the shadow mask A method of fabricating a vertically tapered structure. The method includes placing a spacer layer at a predetermined area on a wafer, placing a mask layer at a predetermined area on the spacer layer, and over-etching the spacer layer, by etching a certain area belo... | 09/16/2008 |
| 7407890 | Patterning sub-lithographic features with variable widths A method of processing a substrate of a device comprises the as following steps. Form a cap layer over the substrate. Form a dummy layer over the cap layer, the cap layer having a top surface. Etch the dummy layer forming patterned dummy elements of variable widths ... | 08/05/2008 |
| 7393457 | Method for making a shadow mask for an opposed discharge plasma display panel The present invention is to provide a method for making a shadow mask for an opposed discharge plasma display panel by etching one lateral surface of a metal slab to produce a plurality of parallel and equidistant barrier ribs along the vertical and horizontal direc... | 07/01/2008 |
| 7369225 | Device and method for inspecting surfaces in the interior of holes A device and method for checking surfaces in the interior of holes, depressions, or the like. The device and method are developed in such a manner that a multicolor light beam can be produced with a light source, wherein a light beam, due to the chromatic aberration... | 05/06/2008 |
| 7368151 | Antiscattering grid and a method of manufacturing such a grid An antiscattering grid for an X-ray imaging apparatus of the type comprising a substrate having a plurality of metallized partitions that together define a plurality of cells distributed over the substrate. The partitions allow passage of the X-rays emitted from a s... | 05/06/2008 |
| 7361608 | Method and system for forming a feature in a high-k layer A method for plasma processing a high-k layer includes providing a substrate having a high-k layer formed thereon, on a substrate holder in a process chamber, and creating a plasma in the process chamber to thereby expose the high-k layer to the plasma. RF power is ... | 04/22/2008 |
| 7348216 | Rework process for removing residual UV adhesive from C4 wafer surfaces A method for the removal of residual UV radiation-sensitive adhesive from the surfaces of semiconductor wafers, remaining thereon from protective UV radiation-sensitive tapes which were stripped from the semiconductor wafers. Moreover, provided is an arrangement for... | 03/25/2008 |
| 7344908 | Atomic force microscope cantilever including field effect transistor and method for manufacturing the same The present invention relates to an AFM (atomic force microscope) cantilever including a field effect transistor (FET) and a method for manufacturing the same; and, more particularly, to a method for manufacturing an AFM cantilever including an FET formed by a photo... | 03/18/2008 |
| 7338609 | Partial edge bead removal to allow improved grounding during e-beam mask writing A method to provide a ground point for second, or subsequent, e-beam mask-writing steps by selectively removing the photoresist edge bead of a photomask substrate to expose the underlying chrome layer. The selective removal leaves at least one tab of photoresist edg... | 03/04/2008 |
| 7338736 | Method of fabricating a phase shift mask A phase shift mask includes a first non-phase shift region, a first phase shift region adjacent the first non-phase shift region, a second non-phase shift region, a second phase shift region adjacent the second non-phase shift region, and an opaque region interposed... | 03/04/2008 |
| 7332098 | Phase shift mask and fabricating method thereof The present invention provides a phase shift mask and fabricating method thereof, by which a critical dimension of a semiconductor pattern can be accurately formed in a manner of compensating a boundary step difference between an active area and an insulating layer.... | 02/19/2008 |
| 7329588 | Forming a reticle for extreme ultraviolet radiation and structures formed thereby Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a plurality of openings in a portion of a first side of a substrate, bonding a first silicon layer of a silicon on insulator wafer to the first side of the sub... | 02/12/2008 |
| 7327013 | Stencil mask with charge-up prevention and method of manufacturing the same A drive unit is described for switching circuit breakers on and off, in particular disconnecting switches and/or grounding switches of medium-voltage switchgear. The drive unit includes a reversible d.c. motor and a switching device containing two separately drivabl... | 02/05/2008 |
| 7309652 | Method for removing photoresist layer and method for forming metal line in semiconductor device using the same Disclosed are a method for removing a photoresist layer and a method for forming a metal line using the same. The method for removing a photoresist pattern, including the steps of: forming a bottom layer on a substrate by using the photoresist pattern as a mask; and... | 12/18/2007 |
| 7306742 | Patterning method, patterning apparatus, patterning template, and method for manufacturing the patterning template A template 1 is brought close to or in contact with a surface to be patterned 111 and patterns are formed with liquid 62 on the surface 111. This method comprises the steps of: bringing the template 1 close to or essentially in con... | 12/11/2007 |
| RE39913 | Method to control gate CD The invention is a process for reducing variations in CD from wafer to wafer. It begins by increasing all line widths in the original pattern data file by a fixed amount that is sufficient to ensure that all lines will be wider than the lowest acceptable CD value. U... | 11/06/2007 |
| 7287468 | Nickel alloy plated structure A structure and associated methods of formation. The structure includes a layered configuration comprising a copper layer, a first layer, and a second layer. The copper layer consists essentially of copper. The first and second layers are disposed on opposite sides ... | 10/30/2007 |
| 7285229 | Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same An etchant of the present invention includes an aqueous solution containing hydrochloric acid, nitric acid, and a cupric ion source. An etching method of the present invention includes bringing the etchant into contact with at least one metal selected from nickel, c... | 10/23/2007 |
| 7261919 | Silicon carbide and other films and method of deposition A method of depositing a ceramic film, particularly a silicon carbide film, on a substrate is disclosed in which the residual stress, residual stress gradient, and resistivity are controlled. Also disclosed are substrates having a deposited film with these controlle... | 08/28/2007 |
| 7258953 | Multi-layer registration and dimensional test mark for scatterometrical measurement A layered test pattern for measuring registration and critical dimension (CD) for multi-layer semiconductor integrated circuits is disclosed. A first layer includes a first pattern having vertical and horizontal portions. A second layer is formed over the first laye... | 08/21/2007 |
| 7241693 | Processing method for protection of backside of a wafer A temporal protection layer is employed to a wafer backside for use of micro-electro-mechanical systems (MEMS). The formation of the temporal protection layer prevents the wafer backside from scratch in process of transferring system for IC manufacturers. With regar... | 07/10/2007 |
| 7223696 | Methods for maskless lithography General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor ... | 05/29/2007 |
| 7214324 | Technique for manufacturing micro-electro mechanical structures A technique for manufacturing a micro-electro mechanical structure includes a number of steps. Initially, a cavity is formed into a first side of a handling wafer, with a sidewall of the cavity forming a first angle greater than about 54.7 degrees with respect to a ... | 05/08/2007 |
| 7185419 | Method of manufacturing a mask for evaporation A mask frame assembly for evaporation includes a mask and a frame which supports the mask. The mask includes a metal layer having a predetermined pattern, and a coating layer which is formed on a surface of the metal layer so as to increase a precision of the predet... | 03/06/2007 |
| 7183214 | High-density plasma (HDP) chemical vapor deposition (CVD) methods and methods of fabricating semiconductor devices employing the same In one embodiment, a semiconductor substrate is placed into a process chamber. A gas mixture including a silicon-containing gas, a fluorine-containing gas, an inert gas, and an oxygen gas is introduced into the chamber at a pressure range of from about 30 mTorr to a... | 02/27/2007 |
| 7179570 | Chromeless phase shift lithography (CPL) masks having features to pattern large area line/space geometries A chromeless phase shift lithography (CPL) mask is described herein. The CPL mask includes a reticle having a phase-shifting feature pattern to produce a projected aerial image for patterning one or more large resist areas on a semiconductor substrate. The phase-shi... | 02/20/2007 |
| 7179335 | In situ adaptive masks A variable adaptive mask is provided that can be dynamically modified in situ in a physical vapor deposition process. The mask comprises a fixed mask portion, a plurality of channels extending through the fixed mask portion, a control mechanism for controlling throu... | 02/20/2007 |
| 7153613 | Process for the fabrication of a phase mask for optical fiber processing, optical fiber-processing phase mask, optical fiber with a Bragg grating, and dispersion compensating device using the optical fiber The invention relates to a process for the fabrication of an optical fiber-processing phase mask that is reduced in terms of pitch variations on the mask and stitching errors, and provides a process for the fabrication of a chirped type optical fiber-processing phas... | 12/26/2006 |
| 7153780 | Method and apparatus for self-aligned MOS patterning A method of forming a thin film stack on a substrate, wherein the thin film stack includes at least a polysilicon layer and an oxide layer; forming a hardmask layer on the thin film stack; forming an anti-reflective coating (ARC) layer on the hardmask layer; pattern... | 12/26/2006 |
| 7138724 | Thick solder mask for confining encapsulant material over selected locations of a substrate and assemblies including the solder mask A solder mask includes an opening through which intermediate conductive elements may be positioned to connect bond pads of a semiconductor die exposed through an aligned opening in a carrier substrate to which the solder mask is secured with corresponding contact ar... | 11/21/2006 |
