Did You Know...
...that two musicians were responsible for the invention of color print film? Fascinated by photography, Leopold Godowsky and Leopold Mannes worked together to produce an easy-to-use, practical color film. They worked full time as music teachers and gave concerts while experimenting during their off hours in Mannes' kitchen. Their success earned them full-time, well-paying jobs at Kodak and their efforts resulted in Kodachrome film, which was introduced in 1935.
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| Number | Title | Issue Date |
| 7395933 | Carrier to hold semiconductor device using opposed rollers A carrier for a semiconductor device includes a body having an opening formed therein to receive the semiconductor device and a pair of rollers to hold the semiconductor device between the rollers in the opening. ... | 07/08/2008 |
| RE40383 | Stud and rider for use on matrix trays A carrier for articles has a main body (10) with one or more engagement means (28) for receiving one or more indicators (40, 60). The indicators (40, 60) have one or more contrasting colors compared to the color of the main body (10 | 06/17/2008 |
| 7364039 | Ink cartridge packaging member, ink cartridge package, and ink cartridge packaging and opening method In a packing member that packs an ink cartridge, the packing member is constituted as an adhesive label, a perforation is provided on a portion of the label, an ink cartridge is packed by adhering the label on the cartridge, and the ink cartridge is unpacked by peel... | 04/29/2008 |
| 7332712 | Camera module fabrication method including the step of removing a lens mount and window from the mold An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window s... | 02/19/2008 |
| 7238543 | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties A method used for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including backgrinding in particular. The present method comprises reducing the cros... | 07/03/2007 |
| 7199359 | Camera module fabrication method including singulating a substrate An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window s... | 04/03/2007 |
| 7189078 | See-saw interconnect assembly with dielectric carrier grid providing spring suspension An interconnect assembly includes a number of interconnects combined in a preferably planar dielectric carrier frame having resilient portions acting as spring members in conjunction with their respective interconnect's rotational displacement during operational con... | 03/13/2007 |
| 7163406 | Electrical connector assembly An electrical connector assembly (1) includes an insulative housing (20) receiving conductive terminals (26) therein, an integrated circuit package (30) mounted on the housing, a stiffener (40) surrounding the housing, a load plate... | 01/16/2007 |
| 7143895 | Methods of bonding metal surfaces, and components therefor A tray device that serves as a shipping tray and an assembly fixture to align a fabricated tape assembly in the bonding of steel locating hinge washers to a hinge assembly to facilitate doors-off/door-on processing through an automotive trim shop. The adhesive bondi... | 12/05/2006 |
| 7135703 | Test tray with carrier modules for a semiconductor device handler A carrier module for a semiconductor device handler, in which grooves for flow of cooling fluid are formed in a seating surface of the carrier module for the semiconductor device. The grooves improve cooling efficiency by forcing the cooling fluid sprayed from a tes... | 11/14/2006 |
| 7126111 | Camera module having a threaded lens barrel and a ball grid array connecting device An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window s... | 10/24/2006 |
| 7118385 | Apparatus for implementing a self-centering land grid array socket A self-aligning socket for an integrated circuit package includes an outer frame and an array of contacts configured for alignment with corresponding conductive pads on the bottom of the integrated circuit package. The outer frame further includes a first plurality ... | 10/10/2006 |
| 7094618 | Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape The present invention provides a method and apparatus for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including backgrinding in particular. The pr... | 08/22/2006 |
| 7091499 | Ultraviolet irradiating method and an apparatus using the same An ultraviolet irradiating apparatus for emitting ultraviolet light toward a work piece. The work piece, e.g. a semiconductor wafer, is held by a ring-shaped frame through an ultraviolet sensitive adhesive tape applied to the back surface of the wafer. The apparatus... | 08/15/2006 |
| 7083818 | Party tray A party tray includes a support tray and, on the support tray, a sealed package made up of transparent container body and a polymeric sealing sheet sealed to the rim of the container body. The sealed package contains foodstuffs, in particular respiring foodstuffs su... | 08/01/2006 |
| 7066314 | Modular belt carrier for electronic components Replaceable component carriers (40) are adapted to be freely floating in belt apertures (74) and have alignment features (160), such as conical holes (170), mated to features (162), such as tapered pins (184), in processing ... | 06/27/2006 |
| 7059476 | Tray for electronic parts A first construction of a tray for electronic parts according to the present invention is provided with an engaging cut-out corner portion which is formed by cutting a corner portion of a table-like flat portion which is arranged diagonally with respect to a-cut-out... | 06/13/2006 |
| 7059040 | Optical module with lens integral holder fabrication method A method of forming an optical module includes mounting an image sensor to a base of a substrate and bonding a lens housing to a sidewall of the substrate. A mounting surface of the lens housing includes a locking feature having a horizontal surface and a vertical s... | 06/13/2006 |
| 7004325 | Resin-molded package with cavity structure A package includes: a substrate having a ridged peripheral portion and a center portion defined by and lower in level than the ridged peripheral portion. A semiconductor chip is mounted on the center portion. A plurality of lead is electrically coupled to the semico... | 02/28/2006 |
| 7001319 | Candy box construction and method A method of making a candy box by forming a side element and placing inside it a closure element, depositing a single glue fillet or a plurality of spaced-apart glue fillets in the interior corner defined by them. ... | 02/21/2006 |
| 6997323 | Packaging system for a component including a compressive and shock-absorbent packing insert A packaging system for a component is disclosed. The packaging system comprises a box and a compressible and shock-absorbent packing insert. The packing insert is placed in the box after nesting a component within the insert. The insert comprises a main panel, a fir... | 02/14/2006 |
| 6956201 | Image sensor package fabrication method An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window s... | 10/18/2005 |
| 6946316 | Method of fabricating and using an image sensor package An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the moldin... | 09/20/2005 |
| 6946178 | Lamination and delamination technique for thin film processing This invention discloses a releasable adhesion layer having good adhesion during high temperature fabrication process in the absence of light, and delaminating at a lower temperature in the presence of light. One embodiment of this invention is a film of polymer who... | 09/20/2005 |
| 6923327 | Injection molded container An integrally injection molded container for merchandise, preferably bottles. The container has two shaped halves that are connected to each other by a living hinge. A closure fastener is disposed at an end of each half that is opposite the living hinge. The closure... | 08/02/2005 |
| 6907993 | Connector package with supporting walls A package (1) for receiving a plurality of electrical socket connectors (4) comprises an elongate housing (2). The housing includes a set of first supporting portions (21) in each of opposite ends thereof, and an intermediate set of secon... | 06/21/2005 |
| 6889841 | Interface apparatus for reception and delivery of an integrated circuit package from one location to another An interface apparatus for reception and delivery of a package from a first location to a second location. The apparatus comprises a nest assembly having an interior defining a nest for receiving a package. The nest is formed by a plurality of sidewalls each having ... | 05/10/2005 |
| 6882408 | Reticle transferring support and transferring method thereof A reticle transferring support. The reticle transferring support has a supporting basefor containing a reticle, a plurality of braces for supporting the reticle, and a plurality of holders for fixing the position of the reticle. The braces are spheroids composed of ... | 04/19/2005 |
| 6787695 | Ergonomic shield for assembly to and disassembly from a substrate A shield (100) having an outer surface (104) and a plurality of sidewalls (106) is disclosed. The plurality of sidewalls (106) extends from the outer surface (104). At least a portion of the plurality of sidewalls (106) are ... | 09/07/2004 |
| 6688472 | Container for electric device A container for receiving an electric device in a recess. The container includes a pair of projections for restraining a movement of the electric device in a first direction perpendicular to a second direction and directed from a top opening area of the r... | 02/10/2004 |
| 6644982 | Method and apparatus for the transport and tracking of an electronic component An apparatus for use in manipulating one or more IC die through testing after they have been cut from the original wafer. A carrier supports the die during the transport, testing, and/or final application. The die is placed into the carrier through an ope... | 11/11/2003 |
| 6505741 | Tray for receiving semiconductor devices A tray for receiving semiconductor devices is formed of a main portion having supporting surfaces, and a plurality of columnar bosses formed on the top and bottom supporting surfaces of the main portion to surround and couple with outer perimeters of semi... | 01/14/2003 |
| 6349832 | Stud and ride for use on matrix trays A carrier for articles has a main body (10) with one or more engagement means (28) for receiving one or more indicators (40, 60). The indicators (40, 60) have one or more contrasting colors compared to the color of the main body (10). The color or shape o... | 02/26/2002 |
| 6343707 | Memory card casing A memory card casing includes a plastic framework, and upper and lower metal covers that could be conveniently assembled to two sides of the plastic framework. The metal covers are fastened to each other via fastening means spaced on perpendicular wall po... | 02/05/2002 |
| 6321430 | Workpiece carrying system A system for holding or transporting engraveable workpieces of different configurations is provided. The system includes a first workpiece carrier that has an internal relief configured to receive a first workpiece having a first configuration. The system... | 11/27/2001 |
| 6234316 | Wafer protective container The invention describes a wafer protective container for holding integrated circuit (IC) wafers. The wafer protective container comprises a container body, a locking device, a container cover, and a plurality of fasteners assembled together to prevent mov... | 05/22/2001 |
| 6215669 | Discrete component in-mold mounting A holder for holding a leadless circuit element includes opposing flanges which can be bent downwardly for bending the flanges into hands and fingers for holding the leadless circuit element within a plastic mold. In still further accord with the device, ... | 04/10/2001 |
| 6182829 | I.C. carrier insert An insert for use within integrated circuit (IC) chip carriers to provide universality across device types and applications at a low design and fabrication cost. The present invention functions as a generic carrier floor and/or adaptor insert which enable... | 02/06/2001 |
| 6164454 | Apparatus and method for storing semiconductor objects A storage container for semiconductor objects is disclosed. The invention has a mounting structure having an inner frame, a temperature sensitive adherent film and an outer frame. Semiconductor objects are placed on the temperature sensitive adherent and ... | 12/26/2000 |
| 6107680 | Packaging for bare dice employing EMR-sensitive adhesives A structure and method for protecting semiconductor integrated microcircuit dice during shipping. The structure secures the position of the die or dice atop an EMR-penetrable element using an adhesive layer, the stickiness, adhesiveness or coefficient of ... | 08/22/2000 |
