Quotables
"What, sir, would you make a ship sail against the wind and currents by lighting a bonfire under her deck? I pray you, excuse me, I have not the time to listen to such nonsense."
Napoleon Bonaparte ; When told of the Robert Fulton steamboat
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| Number | Title | Issue Date |
| 7399657 | Ball grid array packages with thermally conductive containers Ball grid array packages for semiconductor die include a thermally conductive container and a substrate that substantially enclose a semiconductor die. The die is positioned with respect to the container by thermally conductive supports formed in the container or at... | 07/15/2008 |
| 7390758 | Method of manufacturing a semiconductor integrated circuit device with elimination of static charge A sealed type container accommodating a semiconductor substrate is positioned to a load port of a semiconductor manufacturing apparatus. The semiconductor substrate is taken out of the container. An ionizer is used for static-eliminating the semiconductor substrates... | 06/24/2008 |
| 7322098 | Method of simultaneous two-disk processing of single-sided magnetic recording disks Various methods and apparatus for simultaneously processing two single-sided hard memory disks is provided. Disks are positioned in pairs, with one surface of one disk positioned adjacent one surface of the second disk, with the disk surfaces touching or with a slig... | 01/29/2008 |
| 7172981 | Semiconductor integrated circuit device manufacturing method including static charge elimination A sealed type container accommodating a semiconductor substrate is positioned to a load port of a semiconductor manufacturing apparatus. The semiconductor substrate is taken out of the container. An ionizer is used for static-charge-eliminating the semiconductor sub... | 02/06/2007 |
| 7168153 | Method for manufacturing single-sided hard memory disks Various apparatus and methods are provided for positioning and handling single-sided hard memory disks. A disk carrier is provided with ribs formed on the inside surface of opposing side walls. The ribs form disk receiving grooves or channels. The ribs further compr... | 01/30/2007 |
| 7147107 | Packaging platform having an adjustable thickness A platform (40) has a rigid body with an adjustable thickness (t) to selectively occupy any remaining space within a container (20) used for packaging items such as semiconductor wafers (22). The platform (40) in one example has a first p... | 12/12/2006 |
| 7112305 | Automation-optimized microarray package A method and system for economically packaging microarrays into sealed reaction chambers and storage vessels. A pocket strip is manufactured as a linear sequence of pockets, or wells, into which microarrays are positioned. A cover strip is then heat sealed to the up... | 09/26/2006 |
| 7059476 | Tray for electronic parts A first construction of a tray for electronic parts according to the present invention is provided with an engaging cut-out corner portion which is formed by cutting a corner portion of a table-like flat portion which is arranged diagonally with respect to a-cut-out... | 06/13/2006 |
| 6844242 | Method of manufacturing SOI wafer A boat (4) has a recess (5) for supporting a laminated wafer (50). The recess (5) has a first side surface (5a), a first bottom surface (5b), a second side surface (5c), a second bottom surface ( | 01/18/2005 |
| 6475432 | Carrier and support for work pieces A device for use in carrying and supporting a work piece before, during, and after a treatment process. The device can be used for both shipping and treating the work piece, and the device will not adversely affect the work piece during the treatment proc... | 11/05/2002 |
| 6341935 | Wafer boat having improved wafer holding capability A wafer boat for securely holding wafers therein during processing in a vertical furnace and a method for loading dummy wafers into a wafer boat without having to remove/reload for each oxidation process have been disclosed. In the wafer boat, a plurality... | 01/29/2002 |
| 6074479 | Silicon single crystal wafer annealing method and equipment, and silicon single crystal wafer and manufacturing method related thereto This invention anneals a vertical stack of two or more groups of unseparated wafers, with approximately 10 wafers in each group. The invention makes it possible to anneal more wafers in a single annealing operation under a variety of conditions, including... | 06/13/2000 |
| 4057142 | Packaging of semiconductor discs A stackable plastics pallet for packaging semiconductor discs on a gas-ti foil covering, said pallet having a plurality of circular depressions each for accommodating a semiconductor disc, and means for securing the discs between the pallets, the securin... | 11/08/1977 |
