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| Number | Title | Issue Date |
| 7776197 | High surface area palladium electrode coating An electrode surface coating and method for manufacturing the electrode surface coating comprising a conductive substrate; and one or more surface coatings comprising one or more of the following metals titanium, niobium, tantalum, ruthenium, rhodium, iridium, palla... | 08/17/2010 |
| 7431815 | Method to reduce ferric ions in ferrous based plating baths A process for cathodically reducing unwanted Fe+3 ions to needed Fe+2 ions in an acidic ferrous based plating bath without reducing agents is disclosed. An auxiliary potential of 0.1 to 0.3 volts vs. SCE is applied between the working electrode... | 10/07/2008 |
| 7361262 | Acid plating bath and method for the electrolytic deposition of satin nickel deposits The plating bath for the deposition of satin nickel deposits according to the present invention contains at least one quarternary ammonium compound and at least one polyether, the at least one polyether having at least one strongly hydrophobic side chain. As compare... | 04/22/2008 |
| 7361276 | Apparatus and method for osmotic membrane distillation A method of enhancing the concentration of a first inorganic compound in a first aqueous solution of a first process of a heavy chemical plant, the method comprising (a) feeding the first solution having the first compound at a first concentration and a first water ... | 04/22/2008 |
| 7323096 | Method for treating the surface of object and apparatus thereof A method for treating the surface of an object to be treated includes introducing a surface treatment fluid into a reaction vessel (4) capable of receiving an object, introducing-the surface treatment fluid into a separation vessel (14) after the objec... | 01/29/2008 |
| 7311834 | Apparatus for the treatment of particulate biodegradable organic waste An apparatus for treating particulate biodegradable organic waste includes a thermal hydrolysis reactor receiving the particulate biodegradable organic waste for performing thermal hydrolysis at a temperature of about 130° C. at a pressure at or above the saturated... | 12/25/2007 |
| 7285202 | Method for electroplating a cylindrical inside surface of a work-piece-extending substantially over a semi-circle A method is described for electroplating a cylindrical inside surface (4) of a work-piece (3) extending substantially over a semi-circle, with an electrolyte being conveyed from a bath (8) in a circulation through a gap (9) between the in... | 10/23/2007 |
| 7247222 | Electrochemical processing cell Embodiments of the invention may generally provide a small volume electrochemical plating cell. The plating cell generally includes a fluid basin configured to contain a plating solution therein, the fluid basin having a substantially horizontal weir. The cell furth... | 07/24/2007 |
| 7229535 | Hydrogen bubble reduction on the cathode using double-cell designs An apparatus and method for planarizing a surface of a substrate using a chamber separated into two parts by a membrane, and two separate electrolytes is provided. The embodiments of the present invention generally provide an electrochemical mechanical polishing sys... | 06/12/2007 |
| 7189146 | Method for reduction of defects in wet processed layers The present invention provides a method and apparatus for wet processing of a conductive layer using a degassed process solution such as a degassed electrochemical deposition solution, a degassed electrochemical polishing solution, a degassed electroless deposition ... | 03/13/2007 |
| 7179359 | Cup-shaped plating apparatus Provided is a cup-shaped plating apparatus which can plate the whole area of a plating target surface with a uniform film thickness. In a cup-shaped plating apparatus including a placement portion of an object to be plated which is provided at an opening end of a pl... | 02/20/2007 |
| 7156972 | Method for controlling the ferric ion content of a plating bath containing iron A system and method for reducing ferric ion content in a plating solution by exposing hydrogen to an electrode in a plating solution for reducing a ferric ion content in the plating solution. ... | 01/02/2007 |
| 7147827 | Chemical mixing, replenishment, and waste management system A chemical control system for controlling the chemistry of a chemical solution having predetermined chemical constituents in a plating system, such as a NiFe plating system, employs a mix container for containing a plating solution and a hold container for containin... | 12/12/2006 |
| 7138039 | Liquid isolation of contact rings Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface formed thereon, a plurality of electrical contact pins extending fro... | 11/21/2006 |
| 7111950 | Method for forming a metallic mirror surface on a receiving surface A method for forming a metallic mirror surface on a receiving surface is shown. The method comprises the steps of: cleaning the underlay surface; spraying on the receiving surface an activating treatment agent solution wherein the activating treatment agent solution... | 09/26/2006 |
| 7087144 | Contact ring with embedded flexible contacts A contact assembly for supporting a substrate in an electrochemical plating system, wherein that contact assembly includes a contact ring and a thrust plate assembly. The contact ring includes an annular ring member having an upper surface and a lower surface, an an... | 08/08/2006 |
| 7081182 | Method and apparatus for automatically measuring the concentration of TOC in a fluid used in a semiconductor manufacturing process The present invention relates to a method and apparatus for automatically measuring the concentration of total organic carbon (TOC) in chemicals and ultra-pure water that are used in a wet etch process. The apparatus includes a sampling line extending from a process... | 07/25/2006 |
| 7077945 | Cu—Ni—Fe anode for use in aluminum producing electrolytic cell A method of producing aluminum in an electrolytic cell containing alumina dissolved in an electrolyte, the method comprising the steps of providing a molten salt electrolyte at a temperature of less than 900° C. having alumina dissolved therein in an electrolytic c... | 07/18/2006 |
| 7033480 | Process for recovering platinum group metals from material containing base metals The process of the present invention recovers platinum group metal(s), such as platinum and palladium, from PGM-containing materials containing base metals, such as copper and nickel. The process controls sulfur levels by using solvent extraction 306 to remov... | 04/25/2006 |
| 7014679 | Process for degassing an aqueous plating solution A process for removing oxygen from a copper plating solution is provided. The solution is passed through a degasser comprising a shell and hollow hydrophobic fiber porous membranes wherein the shell while a vacuum is drawn on the surfaces of the fibers opposite the ... | 03/21/2006 |
| 6977035 | Method for electrolytic copper plating A method for electrolytic copper plating using an electrolytic copper plating solution including a compound containing a structure of —X—S—Y—, wherein X and Y are independently chosen from hydrogen atom, carbon atom, sulfur atom, nitrogen atom, and oxygen at... | 12/20/2005 |
| 6953384 | Electronic component chip feeder and manufacturing method of electronic devices using electronic component chips An electronic component chip feeder enabling to feed electronic component chips in which electrodes on the outer surfaces thereof can be cleanly maintained and the reliability of electrical connections is excellent even when miniaturizing thereof is promoted, and a ... | 10/11/2005 |
| 6946066 | Multi step electrodeposition process for reducing defects and minimizing film thickness The present invention relates to a method for forming a planar conductive surface on a wafer. In one aspect, the present invention uses a no-contact process with electrochemical deposition, followed by a contact process with electrochemical mechanical deposition. | 09/20/2005 |
| 6942779 | Method and system for regenerating of plating baths The present invention provides a system and method for selectively removing one or more organic and inorganic and also preferably one or more inorganic contaminants from plating baths. More particularly, the invented method relates to the use of a source of energy i... | 09/13/2005 |
| 6899802 | Method for recycling of plating solutions In the conventional plating process, plating solutions are newly prepared and the plating solutions used previously are dumped as industrial wastes, which is accompanied by environmental loads, effluent costs, costs for purchasing new solutions, and the like, and th... | 05/31/2005 |
| 6890414 | Purification system and method A system for use with a plating cell configured to plate objects in a plating process. At least one byproduct is created in a plating substance used in the plating cell. The system includes a purification system configured to remove at least a portion of the at leas... | 05/10/2005 |
| 6884332 | Method and apparatus for treating an aqueous electroplating bath solution A method and apparatus for treating an aqueous electroplating bath solution. The method comprises continuously agitating the solution; adjusting the pH of the solution, adjusting the temperature of the solution while adding an amount of hydrogen peroxide sufficient ... | 04/26/2005 |
| 6878258 | Apparatus and method for removing contaminants from semiconductor copper electroplating baths The present invention generally provides an apparatus and method for removing contaminants from a plating solution. The apparatus generally includes a plating cell having an electrolyte inlet and an electrolyte drain, an electrolyte storage unit in fluid communicati... | 04/12/2005 |
| 6827832 | Electrochemical cell and process for reducing the amount of organic contaminants in metal plating baths The invention disclosed relates to an electrochemical process for decreasing high levels of organic contaminants in metal plating baths. The process involves breaking down the organic contaminants in an electrochemical cell by electrochemical oxidation. The electroc... | 12/07/2004 |
| 6797141 | Removal of coagulates from a non-glare electroplating bath The invention deals with the technical problem to devise a process for the extended use of electrolytes which economically ensures a high electrolyte quality without having to accept production interruptions for regeneration. Especially, it is envisaged to conduct t... | 09/28/2004 |
| 6790332 | Method for the galvanic deposition of nickel, cobalt, nickel alloys or cobalt alloys with periodic current pulses A method for galvanically depositing nickel, cobalt, nickel alloys or cobalt alloys in a galvanic bath includes using electrolytes containing nickel compounds or cobalt compounds. At least one anode and at least one cathode of the bath are subject to periodic curren... | 09/14/2004 |
| 6733650 | Apparatus and process for producing zinc oxide film Disclosed are a process for producing a zinc oxide film comprising the steps of transporting a conductive long substrate via above at least one electrode comprised of zinc in an electrodeposition bath held in an electrodeposition tank and applying an electric field ... | 05/11/2004 |
| 6692628 | Process to remove ferric iron impurities from an acidic aqueous solution used in the electro-winning of copper A process for the removal of primarily iron impurities from acidic aqueous electrolytic solutions used in the electro-winning of copper is described. Strong base Type 1 ion exchange resin is used to remove acid from the solution resulting in a treated sol... | 02/17/2004 |
| 6638409 | Stable plating performance in copper electrochemical plating A real-time and in-line process control system maintains stable plating performance in copper electrochemical plating IC devices by using a real time, on-line programmable controller. Two or more valves to direct the flow of the electrolyte from the elect... | 10/28/2003 |
| 6616827 | Filtration method of copper electrolyte The present invention provides a filtration method of copper electrolyte that can remove minute electrolytic by-products and dirt and may improve filtration efficiency by improving a conventional filtration method, the so-called precoating method. In a fi... | 09/09/2003 |
| 6607651 | Process and system for treating the discharge stream from an ion exchanger A method is disclosed for treating a flushing solution from an ion exchanger used in electroplating operations by co-precipitating or selectively precipitating out metal hydroxides derived from metal ions from the structures being plated in the electropla... | 08/19/2003 |
| 6596148 | Regeneration of plating baths and system therefore The present invention provides a system and method for selectively removing one or more organic and also preferably one or more inorganic contaminants from plating baths. More particularly, the invented method relates to the use of a source of energy in c... | 07/22/2003 |
| 6508924 | Control of breakdown products in electroplating baths Disclosed are methods for analyzing additive breakdown products in electroplating baths as well as methods of controlling the presence of such breakdown products in electroplating baths.... | 01/21/2003 |
| 6495024 | Method for the removal of arsenic from sulfuric acid solution The object of this invention is a method by which arsenic is removed from sulfuric acid solution, in which the sulfuric add concentration is at least 300 g/l, at a temperature of 50-105° C. by reducing the arsenic in the solution with the aid of sulfur d... | 12/17/2002 |
| 6306275 | Method for controlling organic micelle size in nickel-plating solution A process for controlling the micelle size distribution of an alkylene oxide dispersion in a nickel-plating electrolyte is used to maintain the electrolyte in a condition suitable for producing nickel coatings having a uniform satin finish in which finish... | 10/23/2001 |
