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| Number | Title | Issue Date |
| 8133374 | Method and apparatus for manufacturing negative electrode for non-aqueous electrolyte secondary battery A method for manufacturing a negative electrode for a non-aqueous electrolyte secondary battery is provided. A negative electrode precursor of the non-aqueous electrolyte secondary battery is allowed to absorb lithium ions, the negative electrode precursor includes ... | 03/13/2012 |
| 8038864 | Method of fabricating semiconductor device, and plating apparatus A method of fabricating a semiconductor device of the invention includes a plating process of filling a plurality of recesses provided to an insulating film formed on a substrate with an electro-conductive material, wherein the plating process includes a process ste... | 10/18/2011 |
| 7883615 | Controlled electrochemical deposition of polysaccharide films and hydrogels, and materials formed therefrom A method is provided for electrochemically depositing a polysaccharide mass having a selected physical state. According to an embodiment, an electrically conductive support of a substrate is contacted with an aqueous solution including a selectively insolubilizable ... | 02/08/2011 |
| 7837850 | Electroplating systems and methods An electroplating system is provided. The system comprises a reaction tank, a tube, and a video bubble detector. The reaction tank, having a first diameter, contains a plating solution. The tube, connecting to the reaction tank, comprises an inflow tube and a branch... | 11/23/2010 |
| 7563352 | Method and conveyorized system for electorlytically processing work pieces In order to avoid an edge-effect (increased electrical field line density at the edges of electrolytically to be processed work pieces) during the electrolytic processing of work pieces 3.x in a conveyorized system, the electric currents originating fr... | 07/21/2009 |
| 7385290 | Electrochemical reaction cell for a combined barrier layer and seed layer Methods and apparatus for forming conductive interconnect layers useful in articles such as semiconductor chips, memory devices, semiconductor dies, circuit modules, and electronic systems. An electrochemical cell may be used in the reduction of oxides on a dual-pur... | 06/10/2008 |
| 7371312 | Using cell voltage as a monitor for deposition coverage A method and apparatus are described that use cell voltage and/or current as monitor to prevent electrochemical deposition (e.g., electroplating) tools from deplating wafers with no or poor metal (e.g., Cu) seed coverage. In one embodiment, the voltage of a plating ... | 05/13/2008 |
| 7363094 | Multivariable controller design method for multiple input/outputs systems with multiple input/output constraints A method for dynamically controlling a multiple input, multiple output (MIMO) system having multiple input and output constraints, the method comprising. In an exemplary embodiment, the method includes configuring a MIMO tracking controller to implement closed loop ... | 04/22/2008 |
| 7347572 | Telescope mirror for high bandwidth free space optical data transmission Optical mirror elements for high bandwidth free space optical communication are produced by an electroforming replication technique. Onto the precision surface of a mandrel that is a negative of the required optical surface a layer of metal is deposited forming an e... | 03/25/2008 |
| 7301190 | Structures and methods to enhance copper metallization Disclosed structures and methods inhibit atomic migration and related capacitive-resistive effects between a metallization layer and an insulator layer in a semiconductor structure. One exemplary structure includes an inhibiting layer between an insulator and a meta... | 11/27/2007 |
| 7285196 | Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals In recent years, copper wiring has emerged as a promising substitute for the aluminum wiring in integrated circuits, because copper offers lower electrical resistance and better reliability at smaller dimensions than aluminum. However, use of copper typically requir... | 10/23/2007 |
| 7279084 | Apparatus having plating solution container with current applying anodes A method for an electroplating cell which includes providing an anode chamber with at least two concentric anodes including an inner anode and an outer anode; generating a computer generated model with a simulation computer program; and selecting at least one curren... | 10/09/2007 |
| 7270733 | Method and apparatus for real time monitoring of industrial electrolytes The present invention relates generally to any electrolyte and methods for monitoring the constituents contained therein. More specifically, the present invention relates to plating baths and methods for monitoring the constituents contained therein based on chemome... | 09/18/2007 |
| 7269818 | Circuit element function matching despite auto-generated dummy shapes Methods, systems, program products are disclosed that control placement of dummy shapes about sensitive circuit elements such that the dummy shapes are at least substantially similar for each circuit element even though the dummy shapes are auto-generated. In one em... | 09/11/2007 |
| 7262505 | Selective electroless-plated copper metallization Structures and methods are provided which include a selective electroless copper metallization. The present invention includes a novel methodology for forming copper vias on a substrate, including depositing a thin film seed layer of Palladium (Pd) or Copper (Cu) on... | 08/28/2007 |
| 7255783 | Use of infrared imaging to reduce energy consumption and fluoride consumption Operations in an electrolytic cell for producing aluminum are controlled by sensing infrared radiation on an outer surface of a cell chamber to determine an actual temperature. When the actual temperature is greater than a target temperature, a crust hole is repaire... | 08/14/2007 |
| 7253521 | Methods for making integrated-circuit wiring from copper, silver, gold, and other metals Integrated circuits include networks of electrical components that are typically wired, or interconnected, together with aluminum wires. In recent years, researchers have begun using copper in combination with diffusion barriers, rather than aluminum, to form the wi... | 08/07/2007 |
| 7250094 | Heat treatment apparatus A processing gas is prevented from entering into a space below a placement table. A supporting surface for supporting the lower face of a placement table is provided at an inner circumferential portion of the upper end of a support column. A circumferentially extend... | 07/31/2007 |
| 7247223 | Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces A method and apparatus for processing a microfeature workpiece. In one embodiment, the apparatus includes a support member configured to carry a microfeature workpiece at a workpiece plane, and a vessel positioned at least proximate to the support member. The vessel... | 07/24/2007 |
| 7236847 | Systems and methods for closed loop defect reduction Systems and methods for repairing defects on a specimen are provided. A method may include processing a specimen, detecting defects on the specimen, and repairing one or more of the defects. An additional method may include detecting defects on a specimen, repairing... | 06/26/2007 |
| 7235165 | Electroplating solution and method for electroplating An electroplating solution may be formulated as an aqueous solution of oxalic acid, trisodium phosphate and ammonium sulfate. Such solutions may be used for both brush plating and bath plating, and are suitable for use with a variety of plating metals and substrate ... | 06/26/2007 |
| 7223328 | Sensors for reducing gas molecules Provided is a gas molecule sensor, characterized in that the sensing element is a polycrystalline tin oxide film having a thickness less than 1 μm. The sensing element is produced by electrolytic deposit of a tin film on an insulating support in an electromechanica... | 05/29/2007 |
| 7220665 | H plasma treatment Electronic devices are constructed by a method that includes forming a first conductive layer in an opening in a multilayer dielectric structure supported by a substrate, forming a core conductive layer on the first conductive layer, subjecting the core conductive l... | 05/22/2007 |
| 7205153 | Analytical reagent for acid copper sulfate solutions Embodiments of the invention provide an analytical method and analytical reagent solutions for determining the concentration of electrolyte components, such as copper, acid and chloride constituents in an acid or basic metal plating bath using a chemical analyzer. C... | 04/17/2007 |
| 7189318 | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical parameters in accordance with either a mathematical model of the processing ... | 03/13/2007 |
| 7189146 | Method for reduction of defects in wet processed layers The present invention provides a method and apparatus for wet processing of a conductive layer using a degassed process solution such as a degassed electrochemical deposition solution, a degassed electrochemical polishing solution, a degassed electroless deposition ... | 03/13/2007 |
| 7172683 | Method of managing a plating liquid used in a plating apparatus The concentration of a leveler in a plating liquid that is used by a plating apparatus for filling metal such as copper in interconnection trenches and holes defined in the surface of a semiconductor substrate or the like is determined based on a peak area (Ar value... | 02/06/2007 |
| 7160421 | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical parameters in accordance with either a mathematical model of the processing ... | 01/09/2007 |
| 7147827 | Chemical mixing, replenishment, and waste management system A chemical control system for controlling the chemistry of a chemical solution having predetermined chemical constituents in a plating system, such as a NiFe plating system, employs a mix container for containing a plating solution and a hold container for containin... | 12/12/2006 |
| 7115196 | Apparatus and method for electrochemically depositing metal on a semiconductor workpiece A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material, or enhance an ultra-th... | 10/03/2006 |
| 7094614 | In-situ monitoring of chemical vapor deposition process by mass spectrometry A method and apparatus are provided for controlling a CVD process used to deposit films on semiconductor substrates wherein the by-products of the reaction are measured and monitored during the reaction preferably using mass spectrometry and the results used to calc... | 08/22/2006 |
| 7089522 | Device, design and method for a slot in a conductive area A design, device, system and process for placing slots in active regions (e.g., metal areas). Embodiments of the present invention improve the planarization of metal areas (e.g., lines) and insulators by reducing depressions (e.g., dishing) in the metal areas by inc... | 08/08/2006 |
| 7070687 | Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing Apparatus and method for treating a surface of a substrate for electrolytic or electroless plating of metals in integrated circuit manufacturing. In one embodiment the method includes forming a barrier layer on a substrate. A metal-seed layer is then formed on the b... | 07/04/2006 |
| 7067048 | Method to improve the control of electro-polishing by use of a plating electrode an electrolyte bath A method and apparatus which uses a plating electrode in an electrolyte bath. The plating electrode works to purify an electrolyte polishing solution during the electro-polishing process. Preferably, the plating electrode is employed in a closed loop feedback system... | 06/27/2006 |
| 7020537 | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical parameters in accordance with either a numerical of the processing chamber o... | 03/28/2006 |
| 6998337 | Thermal annealing for Cu seed layer enhancement Semiconductor devices with highly reliable Cu interconnects exhibiting reduced resistance are formed by sequentially depositing a seed layer by PVD, depositing a conformal seed layer enhancement film by electroplating, and then thermal annealing the seed layer enhan... | 02/14/2006 |
| 6969672 | Method and apparatus for controlling a thickness of a conductive layer in a semiconductor manufacturing operation A method of controlling a conductive layer deposition process includes depositing a conductive layer onto a semiconductor wafer based upon a deposition recipe, measuring a thickness of the conductive layer deposited on the semiconductor wafer, determining whether th... | 11/29/2005 |
| 6958113 | Plating apparatus and plating method A plating apparatus for plating a substrate. The apparatus is provided with a plating unit, a substrate cleaning unit, a substrate transport mechanism, a post-treatment agent supplying section, a minor constituent managing section for managing minor constituents (an... | 10/25/2005 |
| 6937002 | Method of using an array of electrodes for high throughput development and testing of materials Methods and apparatus employ the use of arrays (301, 902) of two or more electronically-discrete electrodes (1, 2, 3 . . . ) to facilitate high-throughput preparation and testing of materials comprising two or more elements. High rates of deposition, s... | 08/30/2005 |
| 6926816 | Analysis method of film thickness distribution and design system of printed circuit board and manufacturing processes The object of the present invention is to provide a film thickness distribution analysis method that ensures quick and effective prediction of film thickness distribution by computer simulation in the pattern plating process. On the circuit pattern of a print... | 08/09/2005 |
