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| Number | Title | Issue Date |
| 8177953 | Method and apparatus for evaluation of coated parts A method of verifying performance of a coated part includes calculating a deflection value as a function of a predetermined strain threshold value and a total thickness of a test coupon that comprises a coating on a substrate. The coating of the test coupon is co-de... | 05/15/2012 |
| 8147670 | Profile control on ring anode plating chambers for multi-step recipes The present disclosure generally addresses the problem of controlling a plating profile in multi-step recipes and addresses, in particular, the problem of compensating for variations of the plating tool state to stabilize the plating results. The compensation is don... | 04/03/2012 |
| 8118988 | Analysis of copper ion and complexing agent in copper plating baths A simple titration method involving a single copper ion titrant detected by a copper ion specific electrode provides the concentrations of both copper ions and bath complexing agent (ethylene diamine, for example) in alkaline copper electroplating baths of the type ... | 02/21/2012 |
| 7678258 | Void-free damascene copper deposition process and means of monitoring thereof An improved method of stabilizing wet chemical baths is disclosed. Typically such baths are used in processes for treating workpieces, for example, plating processes for plating metal onto substrates. In particular, the present invention relates to copper plating ba... | 03/16/2010 |
| 7578920 | Electrolytic processing method An electrolytic processing apparatus can detect the end point of electrolytic processing stably with high precision and with a relatively simple construction. The electrolytic processing apparatus includes: a processing electrode which can come close to or into cont... | 08/25/2009 |
| 7544280 | Plating analyzing method and apparatus A plating analyzing method is disclosed for analyzing an electroplating system having an anode, a cathode and plating liquid, based on a Laplace's equation. The method comprises the steps of making the Laplace's equation discrete by Finite Volume Method; forming sim... | 06/09/2009 |
| 7537681 | Method for forming and measuring the thickness of an anodized coating An anodizing system for forming a anodized coating on at least a portion of a substrate thereby creating an anodized substrate is disclosed. The anodizing system includes a bath, a coating thickness monitor, at least one probe and at least one controller. The coatin... | 05/26/2009 |
| 7427344 | Methods for determining organic component concentrations in an electrolytic solution The present invention relates to a method and apparatus for determining organic additive concentrations in a sample electrolytic solution, preferably a copper electroplating solution, by measuring the double layer capacitance of a measuring electrode in such sample ... | 09/23/2008 |
| 7425255 | Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition Bipolar wave current, with both positive and negative current portions, is used to electrodeposit a nanocrystalline grain size deposit. Polarity Ratio is the ratio of the absolute value of the time integrated amplitude of negative polarity current and positive polar... | 09/16/2008 |
| 7384535 | Bath analysis Analytical methods are disclosed for determining the quantity of brightener and leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. The methods improve the reproducibility of measuring brig... | 06/10/2008 |
| 7371312 | Using cell voltage as a monitor for deposition coverage A method and apparatus are described that use cell voltage and/or current as monitor to prevent electrochemical deposition (e.g., electroplating) tools from deplating wafers with no or poor metal (e.g., Cu) seed coverage. In one embodiment, the voltage of a plating ... | 05/13/2008 |
| 7371311 | Modified electroplating solution components in a low-acid electrolyte solution An embodiment of the invention provides a method for reducing within die thickness variations by modifying the concentration of components of a low-acid electroplating solution. For one embodiment, the leveler concentration is increased sufficiently to reduce within... | 05/13/2008 |
| 7371472 | Permanent magnet ring In a permanent magnet ring (1) formed by arranging a plurality of unit permanent magnets (21a, 21b, 21c . . . ), each of a plurality of the unit permanent magnets (21a, 21b, 21c | 05/13/2008 |
| 7368016 | Substrate processing unit and substrate processing apparatus A substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; a pan surrounding a periphery of the substrate holder; a cell, located below the substrate holder and within the pan, having in its interior a chemical processing se... | 05/06/2008 |
| 7368042 | Electroplating apparatus including a real-time feedback system An electro-chemical plating system includes an upper rotor assembly for receiving and holding a wafer; an electroplating reactor vessel for containing plating solution in which the wafer is immersed; an anode array including a plurality of concentric anode segments ... | 05/06/2008 |
| 7361257 | Electrochemical screening system Devices and methods for evaluating an electrochemical reaction are disclosed. A device includes an electrochemical cell having a cavity for containing a liquidus electrolyte, a first working electrode having at least one electrolytic surface at least partially withi... | 04/22/2008 |
| 7357854 | Process for electropolishing a device made from cobalt-chromium The invention is directed to an electropolishing solution for products or devices made from at least in part a cobalt-chromium alloy. The invention is particularly suitable for medical devices or intravascular stents made at least in part of cobalt-chromium. More pa... | 04/15/2008 |
| 7343571 | Simulation model for a semiconductor device describing a quasi-static density of a carrier as a non-quasi-static model There is disclosed a simulation model for designing a semiconductor device, comprising adding at least a part of a difference between a density of a carrier described in a quasi-static manner with respect to a voltage applied between electrodes at a first time and a... | 03/11/2008 |
| 7332198 | Plating apparatus and plating method There is provided a plating apparatus and method which can control the temperature of a plating solution during plating more uniformly and easily form a uniform plated film on the to-be-plated surface of a workpiece, and which can simplify the device and decrease th... | 02/19/2008 |
| 7311809 | Plating apparatus for substrate The present invention provides a plating apparatus for a substrate which can plate a substrate under uniform pressure without increasing a load to be applied while holding the entire surface of a porous member in contact with the surface, to be plated, of the substr... | 12/25/2007 |
| 7313454 | Method and apparatus for classifying manufacturing outputs A method for process monitoring involves acquiring data samples associated with a plurality of manufacturing related variables for a plurality of outputs of a manufacturing process. The distance of each data sample relative to every other data sample is then calcula... | 12/25/2007 |
| 7291253 | Detection of an unstable additive breakdown product in a plating bath The 3-mercaptopropylsulfonic acid (MPSA) breakdown product of the bis(sodiumsulfopropyl)disulfide (SPS) additive used in acid copper plating baths accelerates copper electrodeposition and can be detected by cyclic voltammetric stripping (CVS) analysis. In the presen... | 11/06/2007 |
| 7288180 | Electric current control method and apparatus for use in gas generators The invention provides a method and apparatus for current control in gas generators capable of generating a fluorine or fluoride gas by and in which the electrolysis can be maintained in an optimum condition, stable operation is possible and no manpower is demanded.... | 10/30/2007 |
| 7279084 | Apparatus having plating solution container with current applying anodes A method for an electroplating cell which includes providing an anode chamber with at least two concentric anodes including an inner anode and an outer anode; generating a computer generated model with a simulation computer program; and selecting at least one curren... | 10/09/2007 |
| 7278911 | Conductive polishing article for electrochemical mechanical polishing Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly th... | 10/09/2007 |
| 7270733 | Method and apparatus for real time monitoring of industrial electrolytes The present invention relates generally to any electrolyte and methods for monitoring the constituents contained therein. More specifically, the present invention relates to plating baths and methods for monitoring the constituents contained therein based on chemome... | 09/18/2007 |
| 7257891 | Method for forming bonding pads A method for forming bonding pads on a printed circuit board (PCB) with circuit patterns is provided. A plurality of copper patterns are formed on the PCB which are electrically connected to the circuit patterns, and a filler is filled between the copper patterns su... | 08/21/2007 |
| 7255783 | Use of infrared imaging to reduce energy consumption and fluoride consumption Operations in an electrolytic cell for producing aluminum are controlled by sensing infrared radiation on an outer surface of a cell chamber to determine an actual temperature. When the actual temperature is greater than a target temperature, a crust hole is repaire... | 08/14/2007 |
| 7252714 | Apparatus and method for thermally controlled processing of microelectronic workpieces Apparatus and method for thermally controlled processing of microelectronic workpieces with liquids. An apparatus in accordance with and embodiment of the invention includes a process vessel configured to carry a processing liquid, such as an electroless processing ... | 08/07/2007 |
| 7247343 | Method for manufacturing magnetic recording medium A method for manufacturing a magnetic recording medium for efficiently and certainly manufacturing a magnetic recording medium. The magnetic recording medium has a recording layer formed to have predetermined concavo-convex pattern and an adequately flat surface. Ac... | 07/24/2007 |
| 7242000 | Method and apparatus for screening combinatorial libraries of semiconducting properties This invention discloses methods, materials, and devices for making and screening combinatorial libraries to identify semi-conducting and thermoelectric materials. The disclosed method includes preparing a combinatorial library of materials, and identifying library ... | 07/10/2007 |
| 7238084 | Chemical mechanical polishing apparatus and chemical mechanical polishing method using the same Polishing uniformity in a CMP process may be improved due to an improvement in the temperature uniformity of a polishing surface, when a wafer is polished by a CMP apparatus including a polishing head for holding the wafer, a platen, a polishing pad at a top of the ... | 07/03/2007 |
| 7232513 | Electroplating bath containing wetting agent for defect reduction An electroplating solution contains a wetting agent in addition to a suppressor and an accelerator. In some embodiments, the solution has a cloud point temperature greater than 35° C. to avoid precipitation of wetting agent or other solute out of the plating soluti... | 06/19/2007 |
| 7229535 | Hydrogen bubble reduction on the cathode using double-cell designs An apparatus and method for planarizing a surface of a substrate using a chamber separated into two parts by a membrane, and two separate electrolytes is provided. The embodiments of the present invention generally provide an electrochemical mechanical polishing sys... | 06/12/2007 |
| 7204917 | Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same The present invention is directed to a top surface of a workpiece surface influencing device and a method of using the same. The top surface of the workpiece surface influencing device is adapted for use in an electrochemical mechanical processing apparatus in which... | 04/17/2007 |
| 7205153 | Analytical reagent for acid copper sulfate solutions Embodiments of the invention provide an analytical method and analytical reagent solutions for determining the concentration of electrolyte components, such as copper, acid and chloride constituents in an acid or basic metal plating bath using a chemical analyzer. C... | 04/17/2007 |
| 7201829 | Mask plate design The present invention includes a mask plate design that includes at least one or a plurality of channels portions on a surface of the mask plate, into which electrolyte solution will accumulate when the mask plate surface is disposed on a surface of wafer, and out o... | 04/10/2007 |
| 7189435 | Nanofabrication Pathways to rapid and reliable fabrication of three-dimensional nanostructures are provided. Simple methods are described for the production of well-ordered, multilevel nanostructures. This is accomplished by patterning block copolymer templates with selective expos... | 03/13/2007 |
| 7189647 | Sequential station tool for wet processing of semiconductor wafers Methods and apparatus are provided for processing semiconductor wafers sequentially. Sequential processes employ multi-station processing modules, where particular encompassing wafer processes are divided into sub-processes, each optimized for increasing wafer to wa... | 03/13/2007 |
| 7189318 | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical parameters in accordance with either a mathematical model of the processing ... | 03/13/2007 |
