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| Number | Title | Issue Date |
| 8187445 | Process for manufacturing a thick plate electroformed monobloc microwave source Microwave source and polarizer which is formed of an electroformed monobloc comprising a thick plate or septum, greater than 1 mm in thickness. Frequencies of application include the 7.25 GHz and 8.4 GHz frequency bands. ... | 05/29/2012 |
| 7425286 | Method of making optical waveguide apparatus An optical waveguide apparatus includes an optical waveguide, such as an optical sheet of a two-dimensional slab waveguide, and an appropriately-shaped plated structure provided in the optical waveguide. Typically, the plated structure is constructed so as to serve ... | 09/16/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7351313 | Production device and production method for conductive nano-wire The object of the present invention is to provide a nano-scale molecular assembly such as a conductive nano-wire. Specifically, there is provided an electrolytic apparatus for forming a molecular assembly, including two electrodes and an electrolytic cell holding an... | 04/01/2008 |
| 7338857 | Increasing adherence of dielectrics to phase change materials A phase change material is formed over a dielectric material. An impurity is introduced into the dielectric to improve the adherence of said dielectric to said phase change material. ... | 03/04/2008 |
| 7267755 | Method of making a microstructure using a circuit board A method of making a microstructure includes the steps of providing a circuit board that includes a dielectric layer and a conductor layer formed on the dielectric layer, forming a metal structure on the circuit board such that the metal structure extends through th... | 09/11/2007 |
| 7267756 | Fine electroforming mold and manufacturing method thereof The present invention provides a mold for fine electroforming M having a simple structure. In order to improve the productivity of a metal product, an electrode portion can be arranged with a much higher density, and a metal thin film formed on the electrode portion... | 09/11/2007 |
| 7256069 | Wafer-level package and methods of fabricating A carrier for use in a chip-scale package, including a polymeric film with apertures defined therethrough. The apertures, which are alignable with corresponding bond pads of a semiconductor device, each include a quantity of conductive material extending substantial... | 08/14/2007 |
| 7223328 | Sensors for reducing gas molecules Provided is a gas molecule sensor, characterized in that the sensing element is a polycrystalline tin oxide film having a thickness less than 1 μm. The sensing element is produced by electrolytic deposit of a tin film on an insulating support in an electromechanica... | 05/29/2007 |
| 7192807 | Wafer level package and fabrication method A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through t... | 03/20/2007 |
| 7093356 | Method for producing wiring substrate A wiring substrate with bumps protruding from a surface of the substrate covers one side of a metallic base with an electrical insulating film thereon, having open holes exposing the base, etching the base through the open holes to form concavities in the base, elec... | 08/22/2006 |
| 7078999 | Inductor and method for producing the same A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a c... | 07/18/2006 |
| 7060364 | Film carrier tape for mounting electronic devices thereon A film carrier tape for mounting electronic components or devices that excels in not only migration resistance but also adhesiveness of wiring to insulating film; and a process for producing the same. The film carrier tape for mounting electronic components or devic... | 06/13/2006 |
| 7025865 | Method for producing metal mask and metal mask A method for manufacturing a metal mask that facilitates easy dimensional control in the manufacturing process and can manufacture multiple metal masks having high and consistent precision. A Cr film 2 having a mask pattern 2a is formed on the s... | 04/11/2006 |
| 6933165 | Method of making an electrostatic actuator A method of fabricating an electrostatic actuator with an intrinsic stress gradient is provided. An electrode is formed on a substrate and a support layer is formed over the electrode. A metal layer is deposited onto the support layer via a deposition process. Depos... | 08/23/2005 |
| 6922225 | Display device substrate, method for manufacturing the display device substrate, liquid-crystal device, and electronic equipment A panel substrate includes a substrate, a plurality of display electrodes running in parallel on the substrate, and a plurality of wirings respectively continuous from the display electrodes formed on the substrate. The display electrodes and the wirings respectivel... | 07/26/2005 |
| 6911888 | Inductor and method for producing the same A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a c... | 06/28/2005 |
| 6902660 | Method of manufacturing printed circuit board and multi-layered PCB Disclosed is a fabrication method of a printed circuit board, consisting of plating a metal on a pattern-formed metallic substrate to form a conductive metal line; forming a polymer layer as a base substrate over the conductive metal line-formed metallic substrate a... | 06/07/2005 |
| 6849170 | Process for making microdevice with movable microplatform A process for making a microdevice that includes the steps of providing a base member and selectively electroforming a support member for supporting a microplatform with respect to the base member. The process also includes the steps of selectively electroforming th... | 02/01/2005 |
| 6680215 | Liquid crystal-templated conducting organic polymers A method of preparing a conductive polymeric film, includes providing a liquid crystal phase comprising a plurality of hydrophobic cores, the phase on a substrate, introducing a hydrophobic component to the phase, the component a conductive polymer precur... | 01/20/2004 |
| 6635158 | Electro ceramic MEMS structure with controlled actuator gap In an array apparatus, each MEMS element, comprising an actuatable element and a supportive handle, is mounted over a plurality of electrodes wherein the air gap is controlled by the thickness of the electrodes and not primarily by the structure of the ha... | 10/21/2003 |
| 6585874 | Method for using electroforming to manufacture fractal antennas One or more fractal antennas are produced in an electroforming circuit. A stainless steel on glass mandrel is covered with a dielectric in an inverse image of a fractal antenna to be formed. The portion of the stainless steel uncovered by the dielectric i... | 07/01/2003 |
| 6527935 | Process for electroplating pins of an integrated circuit package An apparatus and process for electroplating a pin grid array device having a plurality of pins, the pins having a side surface and an extremity. The apparatus comprises a contact plate defining a plane and having a plurality of electrically conductive fle... | 03/04/2003 |
| 6475321 | Method of manufacturing electrode substrate An electrode substrate comprises a backing substrate carrying thereon a metal electrode layer and/or a recording layer, the layer or layers having a smooth surface area with a surface roughness of less than 1 nm by more than 1 μm2. The smooth ... | 11/05/2002 |
| 6419810 | Method of manufacturing an optical fiber connector Electroforming is performed in an electroforming bath with a cathode of a metal wire member immersed in an electroforming solution to electrodeposit nickel around the aluminum alloy wire member. The aluminum alloy wire member is removed by dissolution wit... | 07/16/2002 |
| 6308405 | Process for preparing an electrode substrate An electrode substrate and a recording medium having a smooth surface with surface unevenness of 1 nm or less and a size of 1 μm.quadrature. or more are disclosed. An electrode substrate and a recording medium having a concave-shaped groove for tracking ... | 10/30/2001 |
| 6294111 | Electrochromic inks Apparatus and methods for manufacturing electrochromic cells. Layers of various inks are printed on substrates by high speed printing means. The electrochromic cells comprise layers of electrode, electrolyte, and counter electrode ink materials which are ... | 09/25/2001 |
| 6284120 | Method of electroplating and electrodeposit structure A method of electroplating using a photoresist layer on a conductive seed layer. The photoresist layer defines a column-shaped space. Ridges are formed on the wall surfaces of the photoresist layer surrounding the column-shaped space. The ridges extend fr... | 09/04/2001 |
| 6109369 | Chip scale package A chip scale package includes a mandrel built flexible circuit having a circuit trace on a first surface and an aperture extending therethrough. The chip scale package includes a pad covering the aperture on the first surface of the flexible circuit and a... | 08/29/2000 |
| 6085414 | Method of making a flexible circuit with raised features protruding from two surfaces and products therefrom A process using a shim stock or foil to make flexible circuits having raised pressure contact features protruding outwardly from two surfaces. A first set of raised electrical pressure contact features are made by placing a shim stock or foil of stainless... | 07/11/2000 |
| 6074543 | Method for producing liquid ejecting head A method to produce a liquid ejecting head having an ejection outlet for ejecting a liquid, a heat generating element for applying thermal energy to the liquid, a liquid flow path comprised of a first path portion in fluid communication with the ejection ... | 06/13/2000 |
| 6051119 | Plating structure for a pin grid array package Disclosed is a plating structure including a substrate having a plurality of pins to be plated and a metallic plating screen having a plurality of apertures, wherein each of the apertures has at least two tabs spaced apart from each other, wherein the met... | 04/18/2000 |
| 6019883 | Process for producing a deposit on a removable support The invention relates to a process for the production of an electro-chemical deposit (8-1, . . . , 8-4) with the aid of a substrate (2) having connection pieces (4-1, . . . , 4-5), said pieces being used as electrodes, the deposit taking place on the surf... | 02/01/2000 |
| 5879531 | Method of manufacturing an array of electrical conductors Electrical conductors (2) embedding filaments (4) of a fabric (3), and substantially filling interstices (5) that coextend with the imbedded filaments (4), are fabricated by plating conductive material onto a surface (14) of a passivated cathode against w... | 03/09/1999 |
| 5714050 | Method of producing a box-shaped circuit board A method of producing a circuit board includes the steps of: electroplating a mold surface of a mold so that a circuit body made of a metal plating layer is formed on the mold surface of the mold; pressing the mold against a board made of a thermoplastic ... | 02/03/1998 |
| 5681440 | Encapsulated nickel photoreceptor substrate An electroforming process and apparatus for creating a nickel or like substrate encapsulated by another material to prevent wear to the nickel substrate. The encapsulation of the nickel substrate requires encapsulation of the inner and outer diameter of t... | 10/28/1997 |
| 5676814 | Method of producing conductive polymer composites Disclosed is a method of producing an electrically conductive polymer composite comprising a general-purpose resin layer and an electrically conductive layer, wherein the conductive layer is formed on at least one surface of the general-purpose resin laye... | 10/14/1997 |
| 5673476 | Anode bonding method for selected regions An anode bonding method for bonding a first substrate and a second substrate, both of which have a recessed portion, includes the steps of heating the first and second substrates in a stacked state; and bonding the substrates by applying a voltage between... | 10/07/1997 |
| 5647966 | Method for producing a conductive pattern and method for producing a greensheet lamination body including the same A method for producing a conductive pattern includes the steps of forming a mask layer on a conductive base plate, the mask layer having a pattern defining an exposed area of the conductive base plate; forming a conductive pattern on the exposed area of t... | 07/15/1997 |
| 5643433 | Lead frame and method for manufacturing same A method for manufacturing a lead frame employing a resist pattern formed on a matrix and having a cavity therein, in which an electro-deposition pattern is formed. A connecting cavity portion interconnects tip ends of inner lead cavity portions such that... | 07/01/1997 |
