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| Number | Title | Issue Date |
| 7678257 | Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same There is obtained a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode drum, and more particularly an el... | 03/16/2010 |
| 7402230 | Method of manufacturing a low magnetic loss metal tape with biaxial texture The present invention is provided to manufacture a low magnetic loss metal tape with biaxial texture and a manufacturing method thereof. The low magnetic loss metal tape has a non-magnetic metal layer deposited on a nickel layer in the form of stack. The low magneti... | 07/22/2008 |
| 7381318 | Method of manufacturing biaxially textured metallic layer featured by electroplating on the surface of single-crystalline or quasi-single-crystalline metal surface, and articles therefrom Disclosed herein are a biaxially textured pure metal or alloy layer deposited by electroplating process on the surface of a single-crystalline or quasi-single-crystalline metal substrate, and a method for manufacturing the biaxially textured pure metal or alloy laye... | 06/03/2008 |
| 7361256 | Electrolytic reactor An electrolytic reactor including a conical recess of removable slices through which the electrolyte circulates towards a part to be coated under the action of a pump setting up forced circulation. The part is polarized to act as a cathode, facing a coaxial anode in... | 04/22/2008 |
| 7351313 | Production device and production method for conductive nano-wire The object of the present invention is to provide a nano-scale molecular assembly such as a conductive nano-wire. Specifically, there is provided an electrolytic apparatus for forming a molecular assembly, including two electrodes and an electrolytic cell holding an... | 04/01/2008 |
| 7247229 | Coatings for the inhibition of undesirable oxidation in an electrochemical cell A process for electroplating of metal utilizing a valve metal electrode substrate containing multiple coating layers is disclosed. A top coating layer of a valve metal oxide is applied over a first coating layer of an electrochemically active coating. The electrode ... | 07/24/2007 |
| 7247222 | Electrochemical processing cell Embodiments of the invention may generally provide a small volume electrochemical plating cell. The plating cell generally includes a fluid basin configured to contain a plating solution therein, the fluid basin having a substantially horizontal weir. The cell furth... | 07/24/2007 |
| 7227169 | Programmable surface control devices and method of making same Programmable surface control devices whose physical features, such as surface characteristics and mass distribution, are controlled by the presence or absence of an electrodeposition of metal and/or metal ions from a solid solution upon application of a suitable ele... | 06/05/2007 |
| 7215916 | Endless metal belt, fixing belt and heat fixing device Objects of the present invention are to provide an endless metal belt superior in flexing resistance and durability, to provide a fixing belt using the endless metal belt, and to provide a heat fixing device with high durability and high reliability. The objects are... | 05/08/2007 |
| 7190016 | Capacitor structure Structures including a capacitor dielectric material disposed on the surface of an electrode suitable for use in forming capacitors are disclosed. Methods of forming such structures are also disclosed. ... | 03/13/2007 |
| 7182849 | ECP polymer additives and method for reducing overburden and defects Electrochemical plating polymer additives and method which reduces metal overburden in an electroplated metal while optimizing gap fill capability are disclosed. The polymer additives are provided in an electrochemical plating bath solution and may include low catio... | 02/27/2007 |
| 7172818 | Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board A copper foil for chip-on-film use, a plasma display panel, or a high-frequency printed circuit board obtained by rolling copper foil to smooth the surface to give a surface area of not more than 1.30 times an ideal smooth surface, the smoothed copper foil having de... | 02/06/2007 |
| 7125604 | Insulated magnet wire A novel polymer coated magnet wire that includes an insulating polymeric coating on only one facet thereof. Such a magnet wire can be conventionally wound using current transformer manufacturing processes but can be produced at significantly lower cost due to the al... | 10/24/2006 |
| 7105740 | Stranded copper-plated aluminum cable, and method for its fabrication Aluminum cable type electrical conductor having at least one stranded conductor based on conductive wires with an aluminum core coated with an intermediate layer of copper itself coated by a surface layer of nickel. The surface layer of nickel has a thickness from a... | 09/12/2006 |
| 7097754 | Continuous electroforming process to form a strip for battery electrodes and a mandrel to be used in said electroforming process A continuous electroforming process to form a strip for battery electrodes, comprising the steps of providing a mandrel having on its surface a reusable pattern subdivided into conductive and non-conductive areas; moving said mandrel through an electroforming bath t... | 08/29/2006 |
| 7052779 | Copper foil for fine pattern printed circuits and method of production of same Copper foil for fine pattern printed circuits having a sufficient bond strength with a resin substrate, eliminating the problems of residual copper, erosion at the bottom portions of the circuit lines, etc. at the time of formation of fine patterns, and superior in ... | 05/30/2006 |
| 7052586 | Apparatus for making particulates of controlled dimension We make particulates, especially magnetic Fe—Co alloys having high magnetic permeability, of controlled dimensions, especially those having a narrow thickness size distribution centered around a median or target thickness in the range of about 0.1–1.0 μm, using... | 05/30/2006 |
| 6994893 | Solutions and dispersions of organic semiconductors The present invention relates to solutions and/or dispersions of organic semiconductors in a solvent mixture of at least two different organic solvents, characterized in that A. Each of the solvents on its own has a boiling point of below 200° C. and a... | 02/07/2006 |
| 6951603 | Method of producing a conductive structured polymer film A two-layered anode (1′) has a lower layer (2) including a non-conductive carrier material to which a conductive electrode layer (3′) is applied. Non-conductive areas, formed by partial removal of the electrode layer, have a predetermined st... | 10/04/2005 |
| 6887364 | Method for manufacturing a multiple walled tube A method for manufacturing a multiple walled tube comprising a rolling of a plated metal strip through at least two complete revolutions to form a tube having at least a double wall which has a plated layer on the inside of the tube, said rolling being followed by a... | 05/03/2005 |
| 6663758 | Method and apparatus for producing electrolytic copper foil An electrolytic copper foil is electrodeposited onto the cathodic drum surface of a rotating cathode drum by feeding an electrolytic solution between the cathode drum and an anode facing each other and applying direct current between them, while the initi... | 12/16/2003 |
| 6652725 | Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by the apparatus An object of the invention is to provide a method for continuously producing electrodeposited copper foil while thiourea-decomposed products remaining in copper electrolyte are removed through activated carbon treatment. Another object is to provide high-... | 11/25/2003 |
| 6632341 | Method for producing a self-supporting metal film Described is a process for producing a self-supporting metal foil (40), in particular copper foil, which by virtue of its constitution has a low shearing strength and which can be structured in a sharp-edged configuration. In this case a base layer of the... | 10/14/2003 |
| 6544663 | Electrodeposited copper foil An object of the present invention is to provide a copper foil having excellent adhesion to an etching resist layer, without performing physical polishing such as buffing in pre-treatment of an etching process to form a circuit from the copper foil. To at... | 04/08/2003 |
| 6527939 | Method of producing copper foil with an anode having multiple coating layers A method of producing copper foil, and more particularly, in an electrochemical cell containing organic substituents, is provided herein. The metal may be deposited on an electrode that comprises an electrode base having at least one undercoating layer of... | 03/04/2003 |
| 6428672 | Apparatus and method for manufacturing Ni--Fe alloy thin foil Disclosed is a technique for manufacturing a Ni--Fe alloy thin foil using a single-step electrodeposition-based plating process without requiring processes such as melting, casting, forging, and rolling. A manufacturing apparatus is provided which include... | 08/06/2002 |
| 6361673 | Electroforming cell An apparatus for producing metal foil, comprising a drum cathode having an outer plating surface. The drum cathode is partially immersed to a set level in an electrolyte bath and is rotatable in a fixed direction about a generally horizontal axis. A main ... | 03/26/2002 |
| 6291080 | Thin copper foil, and process and apparatus for the manufacture thereof Copper foil produced on a rotating drum cathode machine, wherein each of the outer edge portions of a web of the foil has a thickness greater than the thickness of the central portion of the web. In the process and apparatus used to electrodeposit the foi... | 09/18/2001 |
| 6270645 | Simplified process for production of roughened copper foil A simplified process and apparatus for electrodepositing a bond-enhancing copper treatment layer on a surface of copper foil, preferably wherein a single treatment layer is uniformly applied on raw copper foil using a current density of from about 40 to a... | 08/07/2001 |
| 6194056 | High tensile strength electrodeposited copper foil A high tensile strength copper foil having a matte side roughness Rz of 2.5 μm or less and a tensile strength of 40,000 Kgf/mm2 after heating one hour at 180° C. is produced by a process in which copper is electrodeposited from a solution con... | 02/27/2001 |
| 6153077 | Process for preparing porous electrolytic metal foil A method of manufacturing a porous electrolytic metal foil, in which a thin metal layer is formed by electrically depositing a metal on the surface of a cathode body by moving the cathode body through an electrolyte. The thin metal layer is separated from... | 11/28/2000 |
| 6123788 | Copper wire and process for making copper wire This invention relates to copper wire having a substantially uniform unoriented grain structure that is essentially columnar grain free. This invention also relates to a process for making copper wire comprising: cutting copper foil to form at least one s... | 09/26/2000 |
| 5997710 | Copper foil for a printed circuit board, a process and an apparatus for producing the same This invention provides a process for producing an electrolytic copper foil for a printed wiring board by supplying current between a rotary cathode and an electrolytic anode in a copper electrolyte so as to electrodeposit copper on the surface of the rot... | 12/07/1999 |
| 5958209 | High tensile strength electrodeposited copper foil and process of electrodepositing thereof A high tensile strength copper foil having a matte side roughness Rz of 2.5 μm or less and a tensile strength of 40,000 Kgf/mm2 after heating one hour at 180° C. is produced by a process in which copper is electrodeposited from a solution con... | 09/28/1999 |
| 5897761 | Electrodeposited copper foil for printed wiring board and method for manufacturing the same An electrodeposited copper foil for use in the manufacture of a printed wiring board in which the original profile of the matte surface has been completely removed, preferably by buffing, leaving a surface having linear streaks and a roughness 1.5 μm or ... | 04/27/1999 |
| 5863410 | Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby An electrolytic process for producing copper foil having a low profile surface exhibiting a high peel strength when bonded to a polymeric substrate, which process comprises: (a) preparing an electrolyte comprising a copper sulfate-sulfuric acid solution, ... | 01/26/1999 |
| 5863666 | High performance flexible laminate This invention relates to an improved high performance flexible laminate, comprising: a layer of electrodeposited copper foil overlying a layer of a flexible polymeric material, said copper foil being characterized by an ultimate tensile strength at 23° ... | 01/26/1999 |
| 5834140 | Electrodeposited copper foil for fine pattern and method for producing the same The present invention is an electrodeposited copper foil characterised in that roughening treatment is performed on a matte side of an untreated copper foil wherein the surface roughness Rz of the matte side of the untreated copper foil is the ... | 11/10/1998 |
| 5779870 | Method of manufacturing laminates and printed circuit boards Drum or smooth side-treated metal foil can be used either as an intermediate product for use in the manufacture of laminate or as a part of the finished laminate to be used in the manufacture of multi-layer printed circuit board (PCB) packages. By treatin... | 07/14/1998 |
| 5733429 | Polyacrylic acid additives for copper electrorefining and electrowinning Polyacrylic acids are used in electrowinning and electrorefining baths as additives for grain refinement, dendrite reduction, and for reducing impurities in the electroplate.... | 03/31/1998 |
