Bizarre Patents
Mountable Printable Placard With Headband
A resilient headband in a shape for being mounted on the head of the user. The headband is equipped with a longitudinal slotted member for holding a placard.
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| Number | Title | Issue Date |
| 7622029 | Electropolishing apparatus and method for implantable medical devices An electropolishing device for polishing a cylindrical medical device such as a stent includes anodes in the form of rollers arranged to contact an exterior surface of the device. A drive mechanism rotates the anodes periodically during the electropolishing process ... | 11/24/2009 |
| 7425250 | Electrochemical mechanical processing apparatus A system for electrochemical mechanical polishing of a conductive surface of a wafer is provided. The system includes a wafer holder to hold the wafer and a belt pad disposed proximate to the wafer to polish the conductive surface. Application of a potential differe... | 09/16/2008 |
| 7344623 | System and method for radially positioning a workpiece for electrochemical machining A system and method are described for radially positioning a workpiece for electrochemical machining. In one embodiment, a pressurized air chamber is configured to contain pressurized air. In addition, an expandable diaphragm is configured to position the workpiece ... | 03/18/2008 |
| 7303662 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 12/04/2007 |
| 7264008 | Apparatus for cleaning a wafer An apparatus for cleaning a wafer includes a plurality of holders for contacting and securing peripheral portions of a wafer, and for rotating the wafer, a first plate disposed to face a first surface of the wafer, the first plate having a plurality of first nozzles... | 09/04/2007 |
| 7247223 | Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces A method and apparatus for processing a microfeature workpiece. In one embodiment, the apparatus includes a support member configured to carry a microfeature workpiece at a workpiece plane, and a vessel positioned at least proximate to the support member. The vessel... | 07/24/2007 |
| 7211178 | Fixture for electro-chemical machining On a fixture for electro-chemical machining for the production of long, curved cavities (11) in a component (12), the working electrode (3) of the electro-chemical machining tool (1) is connected to a guide body (1a) which m... | 05/01/2007 |
| 7128825 | Method and composition for polishing a substrate Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic ... | 10/31/2006 |
| 7125477 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 10/24/2006 |
| 7112270 | Algorithm for real-time process control of electro-polishing Method and apparatus for process control of electro-processes. The method includes electro-processing a wafer by the application of two or more biases and determining an amount of charge removed as a result of each bias, separately. In one embodiment, an endpoint is... | 09/26/2006 |
| 7101471 | Method for planar material removal technique using multi-phase process environment An electroetching process of the present invention uses a multiphase environment for planarizing a wafer with conductive surface having a non-uniform topography. The multiphase environment includes a high resistance phase and an etching solution phase. The conductiv... | 09/05/2006 |
| 7097755 | Electrochemical mechanical processing with advancible sweeper The present invention provides an apparatus for electrochemical mechanical processing of a surface of a workpiece by utilizing a process solution. The apparatus of the present invention includes an electrode touching the process solution, a belt workpiece surface in... | 08/29/2006 |
| 7077721 | Pad assembly for electrochemical mechanical processing Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A... | 07/18/2006 |
| 7066800 | Conductive polishing article for electrochemical mechanical polishing An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adap... | 06/27/2006 |
| 7059948 | Articles for polishing semiconductor substrates Methods, articles of manufacture, and apparatus are provided for depositing a layer, planarizing a layer, or combinations thereof, a material layer on a substrate. In one embodiment, an article of manufacture is provided for polishing a substrate, comprising a polis... | 06/13/2006 |
| 7029365 | Pad assembly for electrochemical mechanical processing Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an ... | 04/18/2006 |
| 7022216 | Electrolytic etching of metal layers A method for selectively removing a layer of electrolytically dissoluble metal such as copper overplate from a substrate such as a low-k dielectric comprising: providing a substrate bearing on a major surface thereof a layer of ele... | 04/04/2006 |
| 7014748 | Anodizing method, substrate processing method, and substrate manufacturing method This invention is to reduce the influence of a gas generated by an anodizing reaction. A silicon substrate (101) to be processed is horizontally held. A negative electrode (129) is arranged on the upper side of the silicon substrate (101), and a... | 03/21/2006 |
| 6979248 | Conductive polishing article for electrochemical mechanical polishing An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coat... | 12/27/2005 |
| 6979391 | Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method For electrolytic treatment of electrically mutually insulated, electrically conductive structures 4 on surfaces of electrically insulating foil material (Fo), is unloaded from a store 15′, 15″, transported on a conveying line through a treatment un... | 12/27/2005 |
| 6969817 | Apparatus and method for machining in confined spaces A machining apparatus is provided. The machining apparatus includes a discharge machining head assembly and a slide assembly supporting the head assembly. The machining apparatus also includes an electromagnet configured to support the slide assembly in a position o... | 11/29/2005 |
| 6962524 | Conductive polishing article for electrochemical mechanical polishing Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupl... | 11/08/2005 |
| 6942780 | Method and apparatus for processing a substrate with minimal edge exclusion An apparatus for processing a material on a wafer surface includes a cavity defined by a peripheral wall and configured to direct a process solution and direct it to the surface to to a first wafer surface region without being directed to a second wafer surface regi... | 09/13/2005 |
| 6939455 | Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method For electrolytic treatment of circuit boards and foils LP, a method and a device are used in which the sheets and foils are transported through a treatment unit and brought thereby in contact with treatment fluid 3. The sheets and foils are guided during tran... | 09/06/2005 |
| 6935003 | Compound fabrication process and apparatus A miniature machine tool for micro-machining is capable of performing on a workpiece at least one conventional mechanical machining operation and another micro-machining operation such as electrochemical machining (ECM), electro deposit machining (EDM), micro-millin... | 08/30/2005 |
| 6923900 | Alloy pipes and methods of making same A profiled tube (50b) comprising a high carbon content alloy (greater than 0.3%), superalloy or other high creep strength material, has a fluted bore with internal fins (52b) and intervening valleys or troughs (56b). Such a ... | 08/02/2005 |
| 6913683 | Method and device for the production of pipe segments from a hollow pipe A method for the production of pipe segments from a pipe (10) in which the pipe (10) is rotated about its longitudinal axis, while an electrode (20) is positioned in the vicinity of the outer surface (11) of the pipe (10) and elect... | 07/05/2005 |
| 6858125 | Multi-axis numerical control electromachining of bladed disks A multi-axis machine, with numerical control on each axis, is used to drive the tool and workpiece movements necessary to machining complex airfoil geometry. Tooling is typically made of a metal such as brass or other low cost material and rotates during machining. ... | 02/22/2005 |
| 6852208 | Method and apparatus for full surface electrotreating of a wafer Deposition of conductive material on or removal of conductive material from a workpiece frontal side of a semiconductor workpiece is performed by providing an anode having an anode area which is to face the workpiece frontal side, and electrically connecting the wor... | 02/08/2005 |
| 6835299 | Electrochemical machining method and apparatus An electrochemical machining technique involves moving a cathode (2) towards an anodic workpiece (1). A current is passed through an electrolyte which flows between the cathode (2) and workpiece (1) so as to cause material to be removed e... | 12/28/2004 |
| 6743350 | Apparatus and method for rejuvenating cooling passages within a turbine airfoil An electrode for rejuvenating a cooling passage within an airfoil, the electrode including a tip, an end, a conductive core extending between the tip and the end, and an insulating coating disposed on the conductive core. The insulating coating exposes a number of c... | 06/01/2004 |
| 6743406 | Family of discretely sized silicon nanoparticles and method for producing the same A family of discrete and uniformly sized silicon nanoparticles, including 1 (blue emitting), 1.67 (green emitting), 2.15 (yellow emitting), 2.9 (red emitting) and 3.7 nm (infrared emitting) nanoparticles, and a method that produces the family. The nanoparticles prod... | 06/01/2004 |
| 6709565 | Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation The present invention pertains to apparatus and methods for planarization of metal surfaces having both recessed and raised features, over a large range of feature sizes. The invention accomplishes this by increasing the fluid agitation in raised regions with respec... | 03/23/2004 |
| 6663765 | Method and device for the manufacture of the medical expanding stents Method and device for manufacturing of expandable cylindrical metal meshes for use in expandable stents and in particular for customized manufacturing. The method includes determining the type and size of the stent to be implanted, electrochemically formi... | 12/16/2003 |
| 6644920 | Method for providing a curved cooling channel in a gas turbine component as well as coolable blade for a gas turbine component A method of forming a curved cooling channel into a gas turbine component such as a turbine blade uses an electrode in the form of a helix. The electrode is driven to rotate around the central rotational axis of the helix and axially along the central rot... | 11/11/2003 |
| 6585947 | Method for producing silicon nanoparticles A method for producing the silicon nanoparticle of the invention is a gradual advancing electrochemical etch of bulk silicon. Separation of nanoparticles from the surface of the silicon may also be conducted. Once separated, various methods may be employe... | 07/01/2003 |
| 6562227 | Plunge electromachining An electromachining apparatus includes a mandrel for supporting a workpiece next to a cutter mounted on an arbor. The workpiece is powered as an anode and the cutter is powered as a cathode, and a coolant is circulated therebetween. The cutter is rotated ... | 05/13/2003 |
| 6532662 | Method for processing dynamic pressure groove of fluid dynamic bearing According to this dynamic pressure groove processing method, dynamic pressure grooves are formed in specified regions by electrochemical machining with the electrode of an electrode tool put close to a workpiece in the initial stage. Through this electroc... | 03/18/2003 |
| 6485630 | Method of reducing wear in lubricated metal cutting operation A method of reducing cutting tool wear in a lubricated metal cutting operation has been developed. An electrical cutting cell is provided having an anodic conductive cutting tool and a cathodic conductive work-piece connected to a DC current supply; the l... | 11/26/2002 |
| 6482307 | Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing Deposition of conductive material on or removal of conductive material from a wafer frontal side of a semiconductor wafer is performed by providing an anode having an anode area which is to face the wafer frontal side, and electrically connecting the wafe... | 11/19/2002 |
