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Class 205/684 - Organic material containing


Subclass of Class 205 - Electrolysis: processes, compositions used therein, and methods of preparing the compositions
Definition: Subject matter in which the electrolyte contains an organic
No. of patents: 109
Last issue date: 03/01/2011


1      
NumberTitleIssue Date
7897029Removal of surface oxides by electron attachment
The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprisin...
03/01/2011
7422700Compositions and methods of electrochemical removal of material from a barrier layer of a wafer
Methods and compositions have been provided for removing barrier layer material from a work piece during an electrochemical mechanical polishing process while protecting a metallization layer of the work piece. The electrochemical planarization composition includes ...
09/09/2008
7384534Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP
Electrolyte compositions and methods for planarizing a surface of a substrate using the electrolyte compositions are provided. In one aspect, an electrolyte composition includes one or more chelating agents, one or more corrosion inhibitors, and one or more pH adjus...
06/10/2008
7357854Process for electropolishing a device made from cobalt-chromium
The invention is directed to an electropolishing solution for products or devices made from at least in part a cobalt-chromium alloy. The invention is particularly suitable for medical devices or intravascular stents made at least in part of cobalt-chromium. More pa...
04/15/2008
7291274Method of deionising and clarifying the aqueous medium used in an electrical discharge machine and the product used in said method
Deionisation and clarification process of the aqueous medium used in an electroerosion machine and product for this process, where the electroerosion machines are comprised of a purification circuit for this aqueous medium, which includes an ion exchange phase betwe...
11/06/2007
7259100Nanoparticles and method for making the same
A method for making nanoparticles, nanoparticle inks and device layers therefrom is disclosed. In accordance with the present invention, nanoparticles are isolated from a composite material that is formed by treating a metal oxide precursor to form the metal nanopar...
08/21/2007
7226312Micro coated electrical feedthru
A method and apparatus for electrically interfacing between two or more distinct environments. The method and apparatus are directed to an electrical feedthru with one or more electrical transmission lines coated with one or more thin dielectric layers of material t...
06/05/2007
7153411Method for cleaning and polishing metallic alloys and articles cleaned or polished thereby
A method of cleaning and polishing an alloy comprising at least one noble metal and at least one non-noble metal, the method including the steps of submerging said alloy in an electrolytic acidic bath comprising at least one chelating or complexing agent including s...
12/26/2006
7150820Thiourea- and cyanide-free bath and process for electrolytic etching of gold
An aqueous thiourea-free gold etching bath for electrolytically etching gold from a microelectronic workpiece. One embodiment of the aqueous thiourea-free bath contains: (a) about 0.5–1.5 M iodide; (b) about 0.1–0.3 M sulfite; and (c) about 1.0–3.0 g/L wetting...
12/19/2006
7128825Method and composition for polishing a substrate
Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic ...
10/31/2006
7128821Electropolishing method for removing particles from wafer surface
An electropolishing method for removing potential device-contaminating particles from a wafer, is disclosed. The method includes immersing the wafer in an electropolishing electrolyte solution and removing defects and particles from the wafer by rotational friction ...
10/31/2006
7097501Micro coated electrical feedthru
A method and apparatus for electrically interfacing between two or more distinct environments. The method and apparatus are directed to an electrical feedthru with one or more electrical transmission lines coated with one or more thin dielectric layers of material t...
08/29/2006
7090763Process for the production of shaped articles of niobium or tantalum by electrochemical etching
Process for the production of shaped articles of niobium or tantalum by electrochemical etching of a niobium or tantalum sheet covered by a structured photoresist mask in an aqueous solution containing hydrofluoric acid, the etching being effected under electrochemi...
08/15/2006
7045052Method of manufacturing a spectral filter for green and longer wavelengths
A method of manufacture for optical spectral filters with omnidirectional properties in the visible, near IR, mid IR and/or far IR (infrared) spectral ranges is based on the formation of large arrays of coherently modulated waveguides by electrochemical etching of a...
05/16/2006
6884338Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
The present invention provides methods of polishing and/or cleaning copper interconnects using bis(perfluoroalkanesulfonyl) imide acids or copper tris(perfluoroalkanesulfonyl) methide acids compositions. ...
04/26/2005
6863797Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP
Electrolyte compositions and methods for planarizing a surface of a substrate using the electrolyte compositions are provided. In one aspect, an electrolyte composition includes one or more chelating agents, one or more corrosion inhibitors, and one or more pH adjus...
03/08/2005
6858126High capacitance anode and system and method for making same
A method of producing electrodes for electrolytic capacitors by etching metal foil in a low pH etching electrolyte is disclosed. The low pH electrolyte is an aqueous solution, which comprises hydrochloric acid, glycerol, sodium perchlorate or perchloric acid, sodium...
02/22/2005
6858124Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
The present invention provides methods of polishing and/or cleaning copper interconnects using sulfonic acid compositions. ...
02/22/2005
6719892Selective removal of brazing compound from joined assemblies
A process for selective removal of a nickel alloy brazing composition from a nickel-base alloy component includes the steps of providing a brazed assembly including nickel-base alloy components joined by nickel alloy brazing composition; immersing the assembly in an...
04/13/2004
6627064Method for removing the hard material coating applied on a hard metal workpiece and a holding device for at least one workpiece
A hard material layer deposited on a hard metal work piece is removed by electrolytic passivation in which a maximum current density equal to at least 0.01 A/cm2 is generated on the work piece at the beginning of the layer removal process. The ...
09/30/2003
6610194Bath composition for electropolishing of titanium and method for using same
A bath composition for the electropolishing of a metal surface made of nonalloyed titanium is disclosed. The bath composition may comprise sulfuric acid of 2 to 40% by volume, hydrofluoric acid of 10 to 18% by volume and acetic acid of 42 to 62% by volume...
08/26/2003
6592742Electrochemically assisted chemical polish
A method of chemically polishing a metal layer on a substrate is provided. The metal layer is chemically polished using an electrochemical polishing (ECP) process. In the ECP process, the substrate is immersed in a chemical polishing solution including a ...
07/15/2003
6579439Electrolytic aluminum polishing processes
This invention, in one aspect, relates to processes for electropolishing aluminum, in particular, aluminum alloy metal surfaces, by immersing the metal surface in a polishing solution and making the aluminum alloy material anodic. The polishing solution c...
06/17/2003
6485630Method of reducing wear in lubricated metal cutting operation
A method of reducing cutting tool wear in a lubricated metal cutting operation has been developed. An electrical cutting cell is provided having an anodic conductive cutting tool and a cathodic conductive work-piece connected to a DC current supply; the l...
11/26/2002
6468413Electrochemical etch for high tin solder bumps
An aqueous electrochemical etchant for etching metals in the presence of one or more metals not to be etched, the etchant including glycerol in the concentration range of 1.30 to 1.70 M, a sulfate compound having a sulfate ion concentration in the range o...
10/22/2002
6375826Electro-polishing fixture and electrolyte solution for polishing stents and method
An electro-polishing fixture for polishing stents which incorporates multiple anodes in contact with the stent and a center cathode disposed coaxially within the interior of the stent and a curved exterior cathode disposed about the perimeter of the stent...
04/23/2002
6238810Process for using surface active agents to produce high etch gains for electrolytic capacitor manufacturing
A surface active, viscosity modifying agent is used to promote additional tunnel initiation during the etching of high purity cubicity anode foil, preferably aluminum anode foil, to render it suitable for use in electrolytic capacitors. The anode foil is ...
05/29/2001
6224738Method for a patterned etch with electrolytically grown mask
This present invention is directed to a method of etching anodic foil for electrolytic capacitors and provides a method of electrolytically growing a porous oxide mask on a surface of a high purity etchable strip of anodic foil for forming etch tunnels at...
05/01/2001
6203690Process of reworking pin grid array chip carriers
A process for reworking of PGA chip carriers where one or more I/O pins is unplated. The process includes electrolytically etching the I/O pins which removes any corrosion product from the unplated I/O pins and removes the top gold layer from the remainin...
03/20/2001
6180526Method for improving conformity of a conductive layer in a semiconductor device
A method for improving the conformity of the conductive layer in a contact hole, thus allowing for the formation of a plug in the resulting contact hole. The aforementioned method includes the following steps. First, immerse the conductive layer of the se...
01/30/2001
6120674Electrochemical removal of material in electron-emitting device
An electrochemical procedure is employed to selectively remove certain material from a structure without significantly electrochemically attacking other material of the same chemical type as the removed material. The material to be removed constitutes par...
09/19/2000
6103095Non-hazardous wet etching method
A method for selectively wet etching material during the formation of a field emission display device. In one embodiment, the selective wet etching method comprises immersing, in a fluid bath, a structure having a conductive row layer and a resistor layer...
08/15/2000
6074546Method for photoelectrochemical polishing of silicon wafers
A method is provided for photochemical polishing of a silicon wafer using electromagnetic waves within the spectrum of 150 to 2000 nanometers wavelength. A photochemical polishing apparatus is also disclosed in which the electromagnetic waves are provided...
06/13/2000
5993638Method for obtaining well-defined edge radii on cutting tool inserts in combination with a high surface finish over the whole insert by electropolishing technique
There is disclosed a method for edge rounding of cutting tool inserts, in combination with a high surface finish over the whole insert, of cemented carbide or titanium-based carbonitride alloys. An electrolytic method is used with an electrolyte which pro...
11/30/1999
5911864Method of fabricating a semiconductor structure
The present invention provides for a wet etch and method for preparing a semiconductor device structure from a silicon carbide wafer. A first embodiment of the wet etch comprises a vessel, a tetrahydrofurfuryl alcohol and potassium nitrite etching solutio...
06/15/1999
5911867Method for obtaining a high surface finish on titanium-based coatings by electropolishing
The present invention relates to a method for polishing coated cutting tools and wear parts, where at least the outer layer of the coating consists of TiN, TiC or Ti(C,N), to a high surface finish. An electrolytic method is used with an electrolyte consis...
06/15/1999
5876454Modified implant with bioactive conjugates on its surface for improved integration
The present invention relates to a bioactive conjugate adapted to coat a metal implant outer surface, which has the following structural formula I: --R--X--P I wherein, R is O or S, adapted to be covalently attached ...
03/02/1999
5824651Process for modification of implant surface with bioactive conjugates for improved integration
The present invention relates to a process for the covalent coating of implants with a bioactive conjugate, which comprises the steps of: a) cleaning a metal implant surface from contaminants by deoxidation with potentiostatic electrochemical polishing in...
10/20/1998
5733433Heat generating type ink-jet print head
A heat generating type ink-jet print head including an ink supply passage for receiving an ink from an ink container, a micro chamber for storing the ink and nozzles, all being directly formed on a substrate, and a method for fabricating the ink-jet print...
03/31/1998
5690807Method for producing semiconductor particles
The invention provides a method for producing semiconductor particles in which a semiconductor material of the type for which particles are desired is placed in an electrolytic solution of an anodic cell. The anodic cell is configured with a cathode also ...
11/25/1997
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