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| Number | Title | Issue Date |
| 7357853 | Electroplating composite substrates An electrolyte employed to selectively deposit a tin or tin alloy film on a composite substrate. A method for depositing the tin or tin alloy on the composite substrate also is described. ... | 04/15/2008 |
| 7314543 | Tin deposition A device includes an integrated circuit and a deposited tin in electrical contact with a portion of the integrated circuit. The deposited tin is formed by electrodeposition from a bath. The deposited tin includes a residue characteristic of the bath. The bath includ... | 01/01/2008 |
| RE39476 | Tin electrolyte Disclosed are electrolyte compositions for depositing tin or tin-alloys at various current densities. Also disclosed are methods of plating such tin or tin-alloys on substrates, such as the high speed tin plating of steel. ... | 01/23/2007 |
| 7122108 | Tin-silver electrolyte A tin-silver electrolyte and methods of depositing tin-silver alloys on a substrate. ... | 10/17/2006 |
| 7041820 | Process for producing (dioxolenon-4-yl)methyl ester derivative There is provided a method by which various compounds (1) having a carboxyl group in the molecule have the carboxyl group converted to a (dioxolenon-4-yl)methyl ester at low cost, in a simple way and at high yield. The process for producing compounds of formu... | 05/09/2006 |
| 6923899 | Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions Provided for is a solution for use in the electroplating of tin and tin alloys comprising a basis solution comprising an acid, optionally a salt thereof, the acid selected from the group consisting of fluoboric acid, an organic sulfonic acid, a mineral acid, or a co... | 08/02/2005 |
| 6911138 | Method for plating electrodes of ceramic chip electronic components A method for plating electrodes of ceramic chip electronic components includes performing electroplating in a plating bath. The plating bath contains tin (II) sulfamate, acting as a tin (II) salt; a complexing agent including at least one selected from the group con... | 06/28/2005 |
| 6860981 | Minimizing whisker growth in tin electrodeposits The present invention relates to a method for reducing tin whisker formation in tin deposits by plating on an underlying metal tin deposits which are predominantly in a predetermined crystal orientation that essentially matches that of the underlying metal in order ... | 03/01/2005 |
| 6821681 | Electrochemical cells and an interchangeable electrolyte therefore An interchangeable electrolyte contains an additive that promotes interchangeable use between batteries and electroplating cells by limiting dendritic deposition in battery cells and promoting a smooth finish in an electroplating cell, such that fresh or spent elect... | 11/23/2004 |
| 6773568 | Metal alloy compositions and plating methods related thereto The present invention provides inter alia electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer addit... | 08/10/2004 |
| 6736954 | Plating bath and method for depositing a metal layer on a substrate A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of p... | 05/18/2004 |
| 6730209 | Solder electroplating bath including brighteners having reduced volatility In accordance with the invention, the volatility of a solder plating bath with volatile brighteners such as aldehydes has its volatility reduced by the addition of diols to the bath. The diols are advantageously 1,3 propanediol or 1,2 propanediol and are accompanied... | 05/04/2004 |
| 6706418 | Metal alloy compositions and plating methods related thereto The present invention provides inter alias electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer addi... | 03/16/2004 |
| 6582582 | Electroplating composition and process An electroplating bath is disclosed that is particularly suited to the electrodeposition of tin, zinc and alloys of the foregoing in a smooth and bright electrodeposit. The disclosed electroplating bath comprises propanedioic acid, diethyl ester, polymer ... | 06/24/2003 |
| 6562220 | Metal alloy sulfate electroplating baths The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful c... | 05/13/2003 |
| 6562221 | Process and composition for high speed plating of tin and tin alloys A composition and process for electroplating tin or tin alloys onto a substrate at relatively high current densities. The electrolyte comprises toluene sulfonic acid and a source of ammonium ions and/or magnesium ions. The process is particularly suited t... | 05/13/2003 |
| 6342148 | Tin electroplating bath An electrolyte bath for plating tin or tin alloy onto metal substrates using a high speed plating process is described. The electrolyte bath contains a stannous alkyl sulfonate and an alkyl sulfonic acid. The bath also contains an organic compound that is... | 01/29/2002 |
| 6322686 | Tin electrolyte Disclosed are electrolyte compositions for depositing tin or tin-alloys at various current densities. Also disclosed are methods of plating such tin or tin-alloys on substrates, such as the high speed tin plating of steel.... | 11/27/2001 |
| 6280596 | Electrolytic tinplating of steel substrate and apparatus Methods and apparatus enabling simultaneous electrolytic tinplating of bottom and top surfaces of continuous-strip flat-rolled steel substrate while moving in the direction of its length, are disclosed. Both surfaces are plated in a first cell of a multi-... | 08/28/2001 |
| 6251253 | Metal alloy sulfate electroplating baths The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful c... | 06/26/2001 |
| 6251255 | Apparatus and method for electroplating tin with insoluble anodes An apparatus and process for adding electrolytically dissolved tin to the electrolyte solution of a tin plating cell is described. The tin plating process cell has an insoluble anode. In conventional plating processes, this requires the addition of tin sa... | 06/26/2001 |
| 6248228 | Metal alloy halide electroplating baths The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy halide electroplating baths has a number of unexpected benefits including wider useful cu... | 06/19/2001 |
| 6217738 | Tin plating electrolyte compositions There is a disclosed composition suitable for use in a process for electroplating surfaces with tin, comprising: a) one or more acids selected from sulphuric acid, sulphamic acid, aryl sulphonic acids, alkyl sulphonic acids and alkanol sulphonic acids, b)... | 04/17/2001 |
| 6183619 | Metal alloy sulfonic acid electroplating baths The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfonic acid electroplating baths has a number of unexpected benefits including wider us... | 02/06/2001 |
| 6183545 | Aqueous solutions for obtaining metals by reductive deposition An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1) ##STR1## in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydr... | 02/06/2001 |
| 6179985 | Metal alloy fluoroborate electroplating baths The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy fluoroborate electroplating baths has a number of unexpected benefits including wider use... | 01/30/2001 |
| 6030516 | Tin plating electrolyte compositions There is disclosed a composition suitable for use in a process for electroplating surfaces with tin, comprising: an unsubstituted or substituted para alkylbenzene sulphonic acid (component a), one or more acids capable of giving good plating at low curren... | 02/29/2000 |
| 6022467 | Electrolytic tin plating process with reduced sludge production Continuous electrolytic tin plating is accomplished in a bath containing 90-160 g/L sulfuric acid, 4-70 g/L tin ion and a grain refiner, and 1-4% nonylphenol ethoxylated with 8-10 ethylene oxide groups, having a weight average molecular weight of 616&#b1;... | 02/08/2000 |
| 5871631 | Acidic tin-plating bath and additive therefor An additive for an acidic tinplating bath comprises: an additive ingredient (A) prepared by adding oxypropylene to polyoxyethylene glycol and having an average molecular weight ranging from 3000 to 18000; an additive ingredient (B) prepared by adding oxyp... | 02/16/1999 |
| 5853557 | Low friction, ductile, multilayer electrodeposits The present invention relates to composite articles including a surface layer of tin, lead, silver or an alloy thereof that contains co-deposited non-ionic polymeric particles to provide a reduced-friction deposit that has an initially low coefficient of ... | 12/29/1998 |
| 5814202 | Electrolytic tin plating process with reduced sludge production Continuous electrolytic tin plating is accomplished in a bath containing 90-160 g/L sulfuric acid, 40-70 g/L tin ion and a grain refiner, at a speed of 900-1600 feet per minute and a current density as much as 1500 amperes per square foot or more.... | 09/29/1998 |
| 5750017 | Tin electroplating process A process for plating tin or tin alloy onto metal substrates is described. In the process, a metal substrate is placed in an electroplating bath that contains a stannous sulfate and an organic compound additive in which the organic compound has a heterocy... | 05/12/1998 |
| 5698087 | Plating bath and method for electroplating tin and/or lead It now has been found that a smooth and level deposit of tin, lead or tin-lead alloy can be deposited on a substrate from an aqueous plating bath which comprises (A) at least one bath-soluble metal salt selected from the group consisting of a stannous sal... | 12/16/1997 |
| 5667659 | Low friction solder electrodeposits The present invention relates to a solution and method for plating tin, lead, or tin-lead alloy deposits which contain a co-deposit of fluorocarbon particles to provide a lower-friction solder-type deposit which reduces insertion force and fretting corros... | 09/16/1997 |
| 5651873 | Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface An electroplating solution (A), comprises an aqueous solution consisting essentially of lead phenolsulfonate: 1 to 250 g/liter in terms of Pb content; tin phenolsulfonate: 0.1 to 250 g/liter in terms of Sn content; phenolsulfonic acid: 20 to 300 g/liter; ... | 07/29/1997 |
| 5538617 | Ferrocyanide-free halogen tin plating process and bath Incorporating an additive into a tin electroplating bath substantially inhibits soluble ferrous ions, ferric ions, and stannous ions from reacting thus minimizing the formation of stannic tin which is lost in the plating sludge.... | 07/23/1996 |
| 5525207 | Polyalkylene glycol bis-phenyl-a-sulfopropyl diether compound and their salts, and process for their use The present invention relates to a novel composition of matter, and a process for its use as an electroplating additive for enhancing the performance of a plating bath. Polyalkylene glycol bis-phenyl-A-Sulfopropyl diether compounds and their salts are pro... | 06/11/1996 |
| 5378347 | Reducing tin sludge in acid tin plating The present invention relates to a solution for use in the electroplating of tin and tin alloys comprising a basis solution which includes fluoboric acid or an organic sulfonic acid or one of their salts, divalent tin ions, and an antioxidant compound whi... | 01/03/1995 |
| 5344550 | Process for producing surface-treated steel sheet superior in weldability and paint-adhesion A surface-treated steel sheet is provided, at a low cost, which has high weldability and is useful for a material of containers of foods and beverages. The surface treatment is conducted by applying flattened granular tin coating deposits having a specifi... | 09/06/1994 |
| 5326453 | Method and solution for electrodeposition of a dense, reflective tin or tin-lead alloy New formulations for the electrodeposition of a dense, reflective tin or tin-lead alloy on a cathode have been developed. Such electrodeposition solutions are partially comprised of an additive which is comprised of at least one nonionic surfactant which ... | 07/05/1994 |
