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Pizza Pie With Concentric Rings of Crust
A pizza mold for forming a plurality of concentric raised ridges of dough (i.e., crust) on the surface of a pizza pie.
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| Number | Title | Issue Date |
| 8114264 | Method of electroplating a conversion electron emitting source on implant Methods for preparing an implant coated with a conversion electron emitting source (CEES) are disclosed. The typical method includes cleaning the surface of the implant; placing the implant in an activating solution comprising hydrochloric acid to activate the surfa... | 02/14/2012 |
| 8012335 | Method for collection of valuable metal from ITO scrap Proposed is a method for collecting valuable metal from an ITO scrap including a step of collecting tin by subjecting the ITO scrap to electrolysis. Further proposed is a method for collecting valuable metal from an ITO scrap including the steps of providing an ITO ... | 09/06/2011 |
| 7314543 | Tin deposition A device includes an integrated circuit and a deposited tin in electrical contact with a portion of the integrated circuit. The deposited tin is formed by electrodeposition from a bath. The deposited tin includes a residue characteristic of the bath. The bath includ... | 01/01/2008 |
| 7264704 | Electrolysis cell for restoring the concentration of metal ions in electroplating processes It is described an electrolysis cell wherein the anodic dissolution of metals is carried out, in particular of metals characterised by a relatively high oxidation potential, such as copper, or metals with high hydrogen overpotential, for example tin, aimed at restor... | 09/04/2007 |
| 7247229 | Coatings for the inhibition of undesirable oxidation in an electrochemical cell A process for electroplating of metal utilizing a valve metal electrode substrate containing multiple coating layers is disclosed. A top coating layer of a valve metal oxide is applied over a first coating layer of an electrochemically active coating. The electrode ... | 07/24/2007 |
| 7208073 | Media for use in plating electronic components Improvements in methods for plating metal on substrates are obtained by providing media in the plating solution in sizes that are less than 60% to 80% smaller than the average dimension of the substrates to be plated. It is also advantageous for the substrates and m... | 04/24/2007 |
| RE39476 | Tin electrolyte Disclosed are electrolyte compositions for depositing tin or tin-alloys at various current densities. Also disclosed are methods of plating such tin or tin-alloys on substrates, such as the high speed tin plating of steel. ... | 01/23/2007 |
| 7151049 | Electroplating compositions and methods Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, an acid, a thiourea derivative, and an additive selected from alkanol amines, polyethylene imines, a... | 12/19/2006 |
| 7087315 | Method for forming plating film A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th... | 08/08/2006 |
| 6911138 | Method for plating electrodes of ceramic chip electronic components A method for plating electrodes of ceramic chip electronic components includes performing electroplating in a plating bath. The plating bath contains tin (II) sulfamate, acting as a tin (II) salt; a complexing agent including at least one selected from the group con... | 06/28/2005 |
| 6899802 | Method for recycling of plating solutions In the conventional plating process, plating solutions are newly prepared and the plating solutions used previously are dumped as industrial wastes, which is accompanied by environmental loads, effluent costs, costs for purchasing new solutions, and the like, and th... | 05/31/2005 |
| 6884523 | Electronic component and method of manufacturing the same An external terminal of an electronic component is provided with a lead base material and a metal thin film coating a surface of the lead base material, and an average value of a crystal size index is not less than 7, which is defined based on dimensions of a crysta... | 04/26/2005 |
| 6884393 | Surface treatment of aluminum alloys to improve sterilization process compatibility Disclosed herein are methods of sterilizing a device in a sterilizer, methods of sterilizing a device in an enclosure in a sterilizer, and enclosures for retaining a device capable of being sterilized in a sterilization process. The sterilization process comprises h... | 04/26/2005 |
| 6860981 | Minimizing whisker growth in tin electrodeposits The present invention relates to a method for reducing tin whisker formation in tin deposits by plating on an underlying metal tin deposits which are predominantly in a predetermined crystal orientation that essentially matches that of the underlying metal in order ... | 03/01/2005 |
| 6852210 | Plating method and plating bath precursor used therefor To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing ... | 02/08/2005 |
| 6821681 | Electrochemical cells and an interchangeable electrolyte therefore An interchangeable electrolyte contains an additive that promotes interchangeable use between batteries and electroplating cells by limiting dendritic deposition in battery cells and promoting a smooth finish in an electroplating cell, such that fresh or spent elect... | 11/23/2004 |
| 6811672 | Method for forming plating film and electronic component having plating film formed theron by same method A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th... | 11/02/2004 |
| 6790333 | Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied The present invention relates to a to-be-mounted electronic component to which functional alloy plating using a bonding material for mounting is applied with a substitute bonding material for solder (tin-lead alloy), and aims at providing alloy plating which has bee... | 09/14/2004 |
| 6773568 | Metal alloy compositions and plating methods related thereto The present invention provides inter alia electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer addit... | 08/10/2004 |
| 6773217 | Polymeric coating formulations and steel substrate composites Flat-rolled steel strip, free of surface iron oxide, is provided with a corrosion-protection metallic coating on both surfaces, followed by continuous-line polymeric coating operations in which a single surface is pre-treated so as to activate that surface for adhes... | 08/10/2004 |
| 6736954 | Plating bath and method for depositing a metal layer on a substrate A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of p... | 05/18/2004 |
| 6709719 | Method for producing a tin-zinc alloy film A tin layer and a zinc layer are stacked sequentially on a given substrate to form a multilayered film composed of the tin layer and the zinc layer. Then, a laser beam is irradiated onto the multilayered film to produce a tin-zinc alloy film through the inter-diffus... | 03/23/2004 |
| 6685820 | Method for treating spent tin/lead stripping solution The present invention relates to a method for treating spent tin or tin/lead stripping solution used in the electronic industry, particularly in the manufacture of printed circuit boards or a lead frames. Said method comprises (i) electrolytically reducin... | 02/03/2004 |
| 6645549 | Process for providing bond enhancement and an etch resist in the fabrication of printed circuit boards A process for providing bond enhancement and an etch resist for a printed circuit board is provided. A sheet comprising at least a layer of copper is immerses in a first immersion tin solution comprising a tin metal and a complexing agent in an acidic med... | 11/11/2003 |
| 6582582 | Electroplating composition and process An electroplating bath is disclosed that is particularly suited to the electrodeposition of tin, zinc and alloys of the foregoing in a smooth and bright electrodeposit. The disclosed electroplating bath comprises propanedioic acid, diethyl ester, polymer ... | 06/24/2003 |
| 6372345 | Composite particles for composite dispersion plating and method of plating therewith The present invention is applicable to composite particles for composite dispersion plating used for forming a self-lubricating composite dispersion coating and a method of plating using such composite particles as well as a plating (coating) using the sa... | 04/16/2002 |
| 6361677 | Plant and process for the electrolytic dissolution by oxidation of a metal The plant comprises: an electrolysis cell (1") having a soluble anode (2"1) and an insoluble cathode (3") without an interposed membrane, means for introducing the bath into the cell and for removing the bath from the cell, means for maintaining an appropriate... | 03/26/2002 |
| 6322686 | Tin electrolyte Disclosed are electrolyte compositions for depositing tin or tin-alloys at various current densities. Also disclosed are methods of plating such tin or tin-alloys on substrates, such as the high speed tin plating of steel.... | 11/27/2001 |
| 6258241 | Process for electroplating metals A process for electroplating metal on a resistive substrate and the article of manufacture produced therefrom are disclosed. The metal layer is electroplated onto the resistive substrate in an electroplating bath having a polarization parameter .xi. less ... | 07/10/2001 |
| 6251255 | Apparatus and method for electroplating tin with insoluble anodes An apparatus and process for adding electrolytically dissolved tin to the electrolyte solution of a tin plating cell is described. The tin plating process cell has an insoluble anode. In conventional plating processes, this requires the addition of tin sa... | 06/26/2001 |
| 6136456 | Grain oriented electrical steel sheet and method Grain oriented electrical steel sheet with a very low iron loss and a method for producing the same, wherein the surface of the iron substrate of the grain oriented electrical steel sheet is subjected to an enhancement treatment of crystal grain orientati... | 10/24/2000 |
| 6022467 | Electrolytic tin plating process with reduced sludge production Continuous electrolytic tin plating is accomplished in a bath containing 90-160 g/L sulfuric acid, 4-70 g/L tin ion and a grain refiner, and 1-4% nonylphenol ethoxylated with 8-10 ethylene oxide groups, having a weight average molecular weight of 616&#b1;... | 02/08/2000 |
| 5928487 | Electrolytic plating of steel substrate A new combination of steel strip electrolytic plating process steps which eliminate iron ion dissolution from continuous-strip steel substrate into chemically-corrosive plating solutions, such as Halogen-bath or methylsulphonic acid plating solutions, of ... | 07/27/1999 |
| 5814202 | Electrolytic tin plating process with reduced sludge production Continuous electrolytic tin plating is accomplished in a bath containing 90-160 g/L sulfuric acid, 40-70 g/L tin ion and a grain refiner, at a speed of 900-1600 feet per minute and a current density as much as 1500 amperes per square foot or more.... | 09/29/1998 |
| 5665219 | Process for continuous manufacture of an electrical conductor made of copper-plated and tin-plated aluminum Process for continuous manufacture of an electrical conductor consisting of an at least partially aluminium-based central core coated by continuous electrodeposition with at least one metal layer, including pretreatment of the surface of the core, charact... | 09/09/1997 |
| 5658529 | Method of protecting and sterilizing aluminum surfaces on medical instruments A process for color anodizing and sterilizing aluminum surfaces on medical instruments without fading the anodized color comprises the steps of: anodizing an aluminum surface on a medical instrument to form an oxide film; immersing the surface in a salt b... | 08/19/1997 |
| 5628893 | Halogen tin composition and electrolytic plating process A composition of matter for electrolytically depositing a tin layer on an iron containing-substrate is disclosed comprising an acidic aqueous mixture of: (a) a stannous tin halide; and (b) a salt having (1) an alkaline cation, and (2) an oxygen-containing inor... | 05/13/1997 |
| 5580617 | Method for manufacturing tin-coated strips or sheets from copper or a copper alloy A method for manufacturing a tin-coated surface of rolled copper strips or copper-alloy strips, wherein a strip surface is mechanically treated using a textured working roll to adjust a texture on said strip surface of an average peak-to-valley height wit... | 12/03/1996 |
| 5562814 | Sludge-limiting tin and/or lead electroplating bath A novel electroplating bath is described which comprises an alkane or alkanol sulfonic acid, tin, lead or tin-lead metal alloy and either an alkali carbonate or alkali bicarbonate salt. The addition of the alkali carbonate or bicarbonate salts reduces tin... | 10/08/1996 |
| 5451323 | Method for recovering and reproducing tinning liquid A method of recovering and reproducing a tinning liquid containing Fe ions and other detrimental cations by the steps of removing cations from the tinning liquid by passing the tinning liquid or a diluted liquid of the tinning liquid through a strong-acid... | 09/19/1995 |
