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Dining Table Having Integral Dishwasher
A space-saving dishwasher, which may be installed within a counter top or table, having a dish-carrying rack that is vertically shiftable through the open top of the dishwasher for facilitating loading and unloading of the dishes.
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| Number | Title | Issue Date |
| 7887693 | Acid copper electroplating bath composition An aqueous acidic copper electroplating composition containing an improved additive system for use at elevated temperatures. The improved additive system comprises (a) a suppressor comprising at least one high molecular weight polymer; (b) a brightener comprising at... | 02/15/2011 |
| 7374652 | Plating method Copper plating baths containing a leveling agent that is a reaction product of a compound including a heteroatom chosen from nitrogen, sulfur and a mixture of nitrogen and sulfur, with a polyepoxide compound containing an ether linkage that deposit copper on the sur... | 05/20/2008 |
| 7338585 | Electroplating chemistries and methods of forming interconnections A method comprising forming an interconnection opening through a dielectric material to a contact point; and electroplating a interconnection comprising copper in the contact opening using an electroplating bath comprising an alkoxylated sulfopropylated alkylamine. ... | 03/04/2008 |
| 7247229 | Coatings for the inhibition of undesirable oxidation in an electrochemical cell A process for electroplating of metal utilizing a valve metal electrode substrate containing multiple coating layers is disclosed. A top coating layer of a valve metal oxide is applied over a first coating layer of an electrochemically active coating. The electrode ... | 07/24/2007 |
| 7244677 | Method for filling recessed micro-structures with metallization in the production of a microelectronic device A method for filling recessed micro-structures at a surface of a semiconductor wafer with metallization is set forth. In accordance with the method, a metal layer is deposited into the micro-structures with a process, such as an electroplating process, that generate... | 07/17/2007 |
| 7232513 | Electroplating bath containing wetting agent for defect reduction An electroplating solution contains a wetting agent in addition to a suppressor and an accelerator. In some embodiments, the solution has a cloud point temperature greater than 35° C. to avoid precipitation of wetting agent or other solute out of the plating soluti... | 06/19/2007 |
| 7220347 | Electrolytic copper plating bath and plating process therewith An electrolytic copper plating bath used for via-filling plating of blind via-holes formed on a substrate, containing a water-soluble copper salt, sulfuric acid, chloride ions, and a leveler as an additive, wherein the leveler is either one or both of a quaternary p... | 05/22/2007 |
| 7128822 | Leveler compounds Compounds that function to provide level or uniform metal deposits are provided. These compounds are particularly useful in providing level copper deposits. Copper plating baths and methods of copper plating using these compounds are also provided. These baths and m... | 10/31/2006 |
| 7037379 | Anti-tarnish aqueous treatment An aqueous solution that has the capacity for removing tarnish and other soil from copper, silver, gold and other noble metals and alloys thereof comprises an acid, thiourea and a transition metal salt. The aqueous material can be used to treat the surfaces of such ... | 05/02/2006 |
| 7033463 | Substrate plating method and apparatus A method and apparatus plate a substrate to form wiring by efficiently filling a fine recess formed in a semiconductor substrate with plating metal without a void or contamination. The plating of the substrate to fill a wiring recess formed in the semiconductor subs... | 04/25/2006 |
| 6994776 | Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device A method for filling recessed microstructures at a surface of a microelectronic workpiece, such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal layer is deposited into the microstructures with a process, such as an e... | 02/07/2006 |
| 6977035 | Method for electrolytic copper plating A method for electrolytic copper plating using an electrolytic copper plating solution including a compound containing a structure of —X—S—Y—, wherein X and Y are independently chosen from hydrogen atom, carbon atom, sulfur atom, nitrogen atom, and oxygen at... | 12/20/2005 |
| 6776893 | Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect A copper electroplating bath and a method to plate substrates with the bath are provided. The bath and method are particularly effective to plate electronic components such as semiconductive wafer VLSI and ULSI interconnects with void-free fill copper plating for ci... | 08/17/2004 |
| 6709562 | Method of making electroplated interconnection structures on integrated circuit chips A process is described for the fabrication of submicron interconnect structures for integrated circuit chips. Void-free and seamless conductors are obtained by electroplating Cu from baths that contain additives and are conventionally used to deposit level, bright, ... | 03/23/2004 |
| 6709564 | Integrated circuit plating using highly-complexed copper plating baths The acid copper sulfate solutions used for electroplating copper circuitry in trenches and vias in IC dielectric material in the Damascene process are replaced with a type of plating system based on the use of highly complexing anions (e.g., pyrophosphate, cyanide, ... | 03/23/2004 |
| 6610192 | Copper electroplating Disclosed are compositions and methods for providing a planarized metal layer on a substrate having small apertures. The compositions and methods of the present invention provide complete fill of small apertures with reduced void formation.... | 08/26/2003 |
| 6607654 | Copper-plating elecrolyte containing polyvinylpyrrolidone and method for forming a copper interconnect A copper-plating electrolyte includes an aqueous copper salt solution, a water-soluble ଲ-naphtholethoxylate compound having the formula ##STR1## wherein n is an integer from 10 to 24, one selected from the group consisting of a disulfide having the ... | 08/19/2003 |
| 6605204 | Electroplating of copper from alkanesulfonate electrolytes Disclosed is an improved electrolyte formulation for the electrodeposition of copper onto electronic devices substrates and a process using the formulation. The formulation is a solution which contains copper alkanesulfonate salts and free alkanesulfonic ... | 08/12/2003 |
| 6596151 | Electrodeposition chemistry for filling of apertures with reflective metal The present invention provides plating solutions, particularly copper plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features formed on substrates with none or low supporting... | 07/22/2003 |
| 6544399 | Electrodeposition chemistry for filling apertures with reflective metal The present invention provides plating solutions, particularly copper plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features formed on substrates with none or low supporting... | 04/08/2003 |
| 6511588 | Plating method using an additive A plating method comprising using a plating solution containing an additive satisfying the following conditions: 0.005×h2 /w | 01/28/2003 |
| 6491806 | Electroplating bath composition The present invention relates to a copper electroplating bath composition and method of using it for microelectronic device fabrication. In particular, the present invention relates to copper electroplating in the fabrication of interconnect structures in... | 12/10/2002 |
| 6425996 | Water bath and method for electrolytic deposition of copper coatings For the uniform electrolytic deposition of copper coatings, especially on printed circuit boards, an aqueous deposition bath is used which contains as constituents at least one source of copper ions, at least one compound increasing the electrical conduct... | 07/30/2002 |
| 6406609 | Method of fabricating an integrated circuit The present invention provides an aqueous electroplating solution. The aqueous electroplating solution includes a copper salt comprising a weight by weight percent of the electroplating solution between about 0.1% to about 2.5%. The electroplating solutio... | 06/18/2002 |
| 6402924 | Programmed pulse electroplating process The present invention relates to a method of electrodepositing metal onto a substrate, which comprises applying a pulsed periodic reverse current across the electrodes of a plating cell utilizing a peak reverse current density and peak forward current den... | 06/11/2002 |
| 6379522 | Electrodeposition chemistry for filling of apertures with reflective metal The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features formed on substrates with none or low supporting ... | 04/30/2002 |
| 6344129 | Method for plating copper conductors and devices formed A method for plating copper conductors on an electronic substrate and devices formed are disclosed. In the method, an electroplating copper bath that is filled with an electroplating solution kept at a temperature between about 0° C. and about 18° C. is... | 02/05/2002 |
| 6113771 | Electro deposition chemistry The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed ... | 09/05/2000 |
| 6071398 | Programmed pulse electroplating process The present invention relates to a method of electrodepositing metal onto a substrate, which comprises applying a pulsed periodic reverse current across the electrodes of a plating cell utilizing a peak reverse current density and peak forward current den... | 06/06/2000 |
| 5935402 | Process for stabilizing organic additives in electroplating of copper A process and assembly for stabilizing organic additives in an electrolytic solution while electroplating copper. The process includes forming a protective film on a first surface of an anode and minimizing contact between the electrolytic solution and a ... | 08/10/1999 |
| 5849171 | Acid bath for copper plating and process with the use of this combination An aqueous acid bath for galvanic precipitation of copper is disclosed. The copper plating composition comprises at least one polymer phenazonium compound and ଲ-naphtholalkoxylate. A method for using such a bath for deposition of copper coatings is ... | 12/15/1998 |
| 5750018 | Cyanide-free monovalent copper electroplating solutions A substantially cyanide-free plating solution for depositing copper from the monovalent ionic state, which includes monovalent copper ion, a reducing agent capable of reducing divalent copper ions to monovalent copper ions, an alkali material in an amount... | 05/12/1998 |
| 5543522 | Process for preparing an ambient temperature molten salt using thionyl chloride There are disclosed a process for preparing an ambient temperature molten salt, which comprises treating an ambient temperature molten salt consisting essentially of 20 to 50 mole % of an aluminum halide and 80 to 50 mole % of an onium halide, containing ... | 08/06/1996 |
| 5433840 | Acid bath for the galvanic deposition of copper, and the use of such a bath An aqueous acid bath for the galvanic deposition of bright, ductile and smooth copper coats which is suitable for decorative purposes as well as for strengthening the conductors of printed circuits. The bath is characterized by a content of polyalkylene g... | 07/18/1995 |
| 5421985 | Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations This invention relates to electrodeposited copper foil having an elongation measured at 180° C. in excess of about 5.5%, an ultimate tensile strength measured at 23° C. in excess of about 60,000 psi, and a matte-side Rtm in the range of about... | 06/06/1995 |
| 5417841 | Copper plating of gravure rolls The invention relates to a process for depositing copper on a gravure roll comprising the steps of: immersing a gravure roll in an electroplating bath comprising A) copper, B) sulfuric acid, C) at least one alkoxythio compound, D) at least one sulfonated,... | 05/23/1995 |
| 5252196 | Copper electroplating solutions and processes Compositions and processes for electrolytic plating. The compositions are characterized by critical amounts of one or more brightening and leveling agents. The compositions are particularly useful for plating through hole walls of printed circuit boards, ... | 10/12/1993 |
| 5151170 | Acid copper electroplating bath containing brightening additive For acid copper plating baths containing a brightener used to produce smooth copper coatings of high brilliancy, it has been found that the "break-in" period normally needed after a brightener is added to the plating bath, has been virtually eliminated by... | 09/29/1992 |
| 4948474 | Copper electroplating solutions and methods A method of preparing a compound useful as a brightener in aqueous copper electroplating solutions comprising reacting a compound of the following formula: ##STR1## with a compound of the formula: HS--R2 --Zn wherein: R1 | 08/14/1990 |
| 4781801 | Method of copper plating gravure rolls A method of electropolating a layer of copper on gravure rolls is provided with the so-plated layer being especially adapted to receive electronic engraving. The method comprises the steps of placing a gravure roll in an electroplating bath comprising fro... | 11/01/1988 |
