Quotables
"What can be more palpably absurd than the prospect held out of locomotives traveling twice as fast as stagecoaches?"
The Quarterly Review ; March edition, 1825
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8002962 | Copper electrodeposition in microelectronics A method and composition for electroplating Cu onto a substrate in the manufacture of a microelectronic device involving and electrolytic solution containing a source of Cu ions and a substituted pyridyl polymer compound for leveling. ... | 08/23/2011 |
| 7771579 | Electro chemical plating additives for improving stress and leveling effect A chemical solution for an electro chemical plating process includes an electro chemical plating solution; and an additive, added in the electro chemical plating solution, substantially consisting of a polymer with one or more kinds of impurities, wherein each kind ... | 08/10/2010 |
| 7374652 | Plating method Copper plating baths containing a leveling agent that is a reaction product of a compound including a heteroatom chosen from nitrogen, sulfur and a mixture of nitrogen and sulfur, with a polyepoxide compound containing an ether linkage that deposit copper on the sur... | 05/20/2008 |
| 7335288 | Methods for depositing copper on a noble metal layer of a work piece Methods for electrodeposition of copper on a noble metal layer of a work piece are provided. An exemplary method includes exposing the noble metal layer to an electrodeposition composition. The electrodeposition composition comprises a copper salt, a suppressor, an ... | 02/26/2008 |
| 7329334 | Controlling the hardness of electrodeposited copper coatings by variation of current profile Pulse reverse electrolysis of acid copper solutions is used for applying copper deposits of a controlled hardness for applications such as producing printing cylinders. The benefits include improved production capacity. Hardness of the deposit is controlled by varyi... | 02/12/2008 |
| 7232513 | Electroplating bath containing wetting agent for defect reduction An electroplating solution contains a wetting agent in addition to a suppressor and an accelerator. In some embodiments, the solution has a cloud point temperature greater than 35° C. to avoid precipitation of wetting agent or other solute out of the plating soluti... | 06/19/2007 |
| 7220347 | Electrolytic copper plating bath and plating process therewith An electrolytic copper plating bath used for via-filling plating of blind via-holes formed on a substrate, containing a water-soluble copper salt, sulfuric acid, chloride ions, and a leveler as an additive, wherein the leveler is either one or both of a quaternary p... | 05/22/2007 |
| 7128822 | Leveler compounds Compounds that function to provide level or uniform metal deposits are provided. These compounds are particularly useful in providing level copper deposits. Copper plating baths and methods of copper plating using these compounds are also provided. These baths and m... | 10/31/2006 |
| 7045040 | Process and system for eliminating gas bubbles during electrochemical processing A method and system for preventing gas bubble formation on a selected region of a wafer surface as the surface is brought in contact with a process solution for an electrochemical process is provided. The present invention employs the process solution to prevent or ... | 05/16/2006 |
| 6709562 | Method of making electroplated interconnection structures on integrated circuit chips A process is described for the fabrication of submicron interconnect structures for integrated circuit chips. Void-free and seamless conductors are obtained by electroplating Cu from baths that contain additives and are conventionally used to deposit level, bright, ... | 03/23/2004 |
| 6635166 | Composite plating method Inorganic or organic fine particles which are insoluble to water are added to a metal plating bath, by dispersing the fine particles in a watery medium by the help of an azo-surfactant having an aromatic azo compound residue. Electrolysis is then carried ... | 10/21/2003 |
| 6610192 | Copper electroplating Disclosed are compositions and methods for providing a planarized metal layer on a substrate having small apertures. The compositions and methods of the present invention provide complete fill of small apertures with reduced void formation.... | 08/26/2003 |
| 6607654 | Copper-plating elecrolyte containing polyvinylpyrrolidone and method for forming a copper interconnect A copper-plating electrolyte includes an aqueous copper salt solution, a water-soluble ଲ-naphtholethoxylate compound having the formula ##STR1## wherein n is an integer from 10 to 24, one selected from the group consisting of a disulfide having the ... | 08/19/2003 |
| 6596151 | Electrodeposition chemistry for filling of apertures with reflective metal The present invention provides plating solutions, particularly copper plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features formed on substrates with none or low supporting... | 07/22/2003 |
| 6562222 | Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating In filling fine via holes or trenches of the wiring (LSI) pattern formed on a semiconductor wafer, a copper electroplating is carried out by using a copper electroplating solution. containing an azole or a silane coupling agent, or a copper electroplating... | 05/13/2003 |
| 6527939 | Method of producing copper foil with an anode having multiple coating layers A method of producing copper foil, and more particularly, in an electrochemical cell containing organic substituents, is provided herein. The metal may be deposited on an electrode that comprises an electrode base having at least one undercoating layer of... | 03/04/2003 |
| 6511588 | Plating method using an additive A plating method comprising using a plating solution containing an additive satisfying the following conditions: 0.005×h2 /w | 01/28/2003 |
| 6491806 | Electroplating bath composition The present invention relates to a copper electroplating bath composition and method of using it for microelectronic device fabrication. In particular, the present invention relates to copper electroplating in the fabrication of interconnect structures in... | 12/10/2002 |
| 6372113 | Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same Treated copper foil produced by electrodepositing on a matte surface of a base copper foil a "corrective" copper layer having a surface roughness different from the surface roughness of the matte surface of the base foil and which has a peak count greater... | 04/16/2002 |
| 6344129 | Method for plating copper conductors and devices formed A method for plating copper conductors on an electronic substrate and devices formed are disclosed. In the method, an electroplating copper bath that is filled with an electroplating solution kept at a temperature between about 0° C. and about 18° C. is... | 02/05/2002 |
| 6113771 | Electro deposition chemistry The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed ... | 09/05/2000 |
| 5935402 | Process for stabilizing organic additives in electroplating of copper A process and assembly for stabilizing organic additives in an electrolytic solution while electroplating copper. The process includes forming a protective film on a first surface of an anode and minimizing contact between the electrolytic solution and a ... | 08/10/1999 |
| 5849171 | Acid bath for copper plating and process with the use of this combination An aqueous acid bath for galvanic precipitation of copper is disclosed. The copper plating composition comprises at least one polymer phenazonium compound and ଲ-naphtholalkoxylate. A method for using such a bath for deposition of copper coatings is ... | 12/15/1998 |
| 5750018 | Cyanide-free monovalent copper electroplating solutions A substantially cyanide-free plating solution for depositing copper from the monovalent ionic state, which includes monovalent copper ion, a reducing agent capable of reducing divalent copper ions to monovalent copper ions, an alkali material in an amount... | 05/12/1998 |
| 5607570 | Electroplating solution The improved aqueous, non-cyanide zinc electroplating solution prevents iron contamination during electroplating. The solution, in addition to water, has a copper salt, preferably copper sulfate, in a concentration of about 0.01-6% by weight of the soluti... | 03/04/1997 |
| 5543522 | Process for preparing an ambient temperature molten salt using thionyl chloride There are disclosed a process for preparing an ambient temperature molten salt, which comprises treating an ambient temperature molten salt consisting essentially of 20 to 50 mole % of an aluminum halide and 80 to 50 mole % of an onium halide, containing ... | 08/06/1996 |
| 5433840 | Acid bath for the galvanic deposition of copper, and the use of such a bath An aqueous acid bath for the galvanic deposition of bright, ductile and smooth copper coats which is suitable for decorative purposes as well as for strengthening the conductors of printed circuits. The bath is characterized by a content of polyalkylene g... | 07/18/1995 |
| 5421985 | Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations This invention relates to electrodeposited copper foil having an elongation measured at 180° C. in excess of about 5.5%, an ultimate tensile strength measured at 23° C. in excess of about 60,000 psi, and a matte-side Rtm in the range of about... | 06/06/1995 |
| 5417841 | Copper plating of gravure rolls The invention relates to a process for depositing copper on a gravure roll comprising the steps of: immersing a gravure roll in an electroplating bath comprising A) copper, B) sulfuric acid, C) at least one alkoxythio compound, D) at least one sulfonated,... | 05/23/1995 |
| 5217599 | Bonding of polyimide film Disclosed is a method for electroplating a metal sheet adapted for being used in electronic packaging material, such as printed circuit boards. Bismaleimide and its derivative are added into the plated solution so as to form insoluble particles of bismale... | 06/08/1993 |
| 5151170 | Acid copper electroplating bath containing brightening additive For acid copper plating baths containing a brightener used to produce smooth copper coatings of high brilliancy, it has been found that the "break-in" period normally needed after a brightener is added to the plating bath, has been virtually eliminated by... | 09/29/1992 |
| 5024736 | Process for electroplating utilizing disubstituted ethane sulfonic compounds as electroplating auxiliaries and electroplating auxiliaries containing same A process in which disubstituted ethane sulfonic compounds are employed as electroplating auxiliaries in electroplating. The compounds for use in combination with the claimed process have the general formula: ##STR1## wherein, A represents a pyridini... | 06/18/1991 |
| 4948474 | Copper electroplating solutions and methods A method of preparing a compound useful as a brightener in aqueous copper electroplating solutions comprising reacting a compound of the following formula: ##STR1## with a compound of the formula: HS--R2 --Zn wherein: R1 | 08/14/1990 |
| 4640745 | Process for producing a cutting base Process for producing a sound recording cutting base, which includes precipitating a cuttable copper layer on a substrate from an electroplating bath, the copper layer having an initial grain size and having recrystallizing characteristics as a result of ... | 02/03/1987 |
| 4490220 | Electrolytic copper plating solutions Acid copper electroplating solutions containing the reaction product of (A) a compound containing a nitrogen-carbon-sulfur radical of the general structural formula ##STR1## where R1 and R2 are alkyl radicals a hydrogen atom or mixt... | 12/25/1984 |
| 4379738 | Electroplating zinc An electroplating process is described for plating various metals and alloys in which certain organic substances are added to the plating solution. This permits high plating rates with excellent plating results, including smooth bright finishes, freedom f... | 04/12/1983 |
| 4377449 | Electrolytic silver plating A silver electroplating bath comprising heterocyclic organic additives such as lactones, lactams, cyclic sulfate esters, cyclic imides and cyclic oxazolinones, preferably phenolphthalein.... | 03/22/1983 |
| 4376685 | Acid copper electroplating baths containing brightening and leveling additives The invention is concerned with the electrodeposition of copper from an aqueous acidic bath containing the following additives: a. An alkylated polyalkyleneimine obtained as the reaction product of a polyalkyleneimine represented by the formula : wherein R is... | 03/15/1983 |
| 4310392 | Electrolytic plating The electroplating of various metals such as zinc, copper, cadmium, chromium, nickel cobalt, gold, silver, palladium, platinum, ruthenium and alloys of such metals takes place from electrolytes comprising heterocyclic additives such as lactones, lactams, ... | 01/12/1982 |
| 4272335 | Composition and method for electrodeposition of copper A composition and method for electrodepositing ductile, bright, level copper deposits from an aqueous acidic copper plating bath having dissolved therein a brightening amount of a compound comprising a substituted phthalocyanine radical. In accordance wit... | 06/09/1981 |
