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| Number | Title | Issue Date |
| 8114263 | Polyvinylammonium compound, method of manufacturing same, acidic solution containing said compound and method of electrolytically depositing a copper deposit The invention relates to a polyvinylammonium compound, to a method of manufacturing said compound, to an aqueous acidic solution containing at least said Polyvinylammonium compound for electrolytically depositing a copper deposit as well as to a method of electrolyt... | 02/14/2012 |
| 7993510 | Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in approximately the same plane at the time of manufacturing a multilayer printed ... | 08/09/2011 |
| 7824534 | Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith The object of the present invention is to obtain a low profile electrolytic copper foil with a low surface roughness at the rough surface side (opposite side from the glossy side) in the electrolytic copper foil manufacture using a cathode drum and, particularly, to... | 11/02/2010 |
| 7815786 | Copper electrodeposition in microelectronics An electrolytic plating method and composition for electrolytically plating Cu onto a semiconductor integrated circuit substrate having submicron-sized interconnect features. The composition comprises a source of Cu ions and a suppressor compound comprising polyethe... | 10/19/2010 |
| 7510639 | Leveler compounds Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion coefficient, are provided. Such plating baths deposit a metal layer, part... | 03/31/2009 |
| 7438794 | Method of copper electroplating to improve gapfill A copper electroplating bath composition and a method of copper electroplating to improve gapfill are provided. The method of electroplating includes providing an aqueous electroplating composition, comprising copper, at least one acid, at least one halogen ion, an ... | 10/21/2008 |
| 7427344 | Methods for determining organic component concentrations in an electrolytic solution The present invention relates to a method and apparatus for determining organic additive concentrations in a sample electrolytic solution, preferably a copper electroplating solution, by measuring the double layer capacitance of a measuring electrode in such sample ... | 09/23/2008 |
| 7374652 | Plating method Copper plating baths containing a leveling agent that is a reaction product of a compound including a heteroatom chosen from nitrogen, sulfur and a mixture of nitrogen and sulfur, with a polyepoxide compound containing an ether linkage that deposit copper on the sur... | 05/20/2008 |
| 7371311 | Modified electroplating solution components in a low-acid electrolyte solution An embodiment of the invention provides a method for reducing within die thickness variations by modifying the concentration of components of a low-acid electroplating solution. For one embodiment, the leveler concentration is increased sufficiently to reduce within... | 05/13/2008 |
| 7338585 | Electroplating chemistries and methods of forming interconnections A method comprising forming an interconnection opening through a dielectric material to a contact point; and electroplating a interconnection comprising copper in the contact opening using an electroplating bath comprising an alkoxylated sulfopropylated alkylamine. ... | 03/04/2008 |
| 7335288 | Methods for depositing copper on a noble metal layer of a work piece Methods for electrodeposition of copper on a noble metal layer of a work piece are provided. An exemplary method includes exposing the noble metal layer to an electrodeposition composition. The electrodeposition composition comprises a copper salt, a suppressor, an ... | 02/26/2008 |
| 7316772 | Defect reduction in electrodeposited copper for semiconductor applications A method for electroplating a copper deposit onto a semiconductor integrated circuit device substrate having submicron-sized features, and a concentrate for forming a corresponding electroplating bath. A substrate is immersed into an electroplating bath formed from ... | 01/08/2008 |
| 7316752 | R-T-B-C based rare-earth magnetic powder and bonded magnet The step of preparing a rapidly solidified alloy by rapidly quenching a melt of an R-T-B-C based rare-earth alloy (where R is at least one of the rare-earth elements including Y, T is a transition metal including iron as its main ingredient, B is boron, and C is car... | 01/08/2008 |
| 7291253 | Detection of an unstable additive breakdown product in a plating bath The 3-mercaptopropylsulfonic acid (MPSA) breakdown product of the bis(sodiumsulfopropyl)disulfide (SPS) additive used in acid copper plating baths accelerates copper electrodeposition and can be detected by cyclic voltammetric stripping (CVS) analysis. In the presen... | 11/06/2007 |
| 7232513 | Electroplating bath containing wetting agent for defect reduction An electroplating solution contains a wetting agent in addition to a suppressor and an accelerator. In some embodiments, the solution has a cloud point temperature greater than 35° C. to avoid precipitation of wetting agent or other solute out of the plating soluti... | 06/19/2007 |
| 7214305 | Method of manufacturing electronic device Disclosed is a method of manufacturing an electronic device, comprising forming a concave portion on the surface of a base member, forming an electrically conductive seed layer on that surface of the base member on which a plated film is to be formed, and applying a... | 05/08/2007 |
| 7215021 | Electronic device The conductor wire surface for constituting a circuit formed by print or junction on a substrate formed from a composite member of ceramics, resin, and an inorganic member and from a resin member is coated with glass, resin, solder, or silver paste, thus the corrosi... | 05/08/2007 |
| 7205153 | Analytical reagent for acid copper sulfate solutions Embodiments of the invention provide an analytical method and analytical reagent solutions for determining the concentration of electrolyte components, such as copper, acid and chloride constituents in an acid or basic metal plating bath using a chemical analyzer. C... | 04/17/2007 |
| 7192494 | Method and apparatus for annealing copper films A method and apparatus for annealing copper. The method comprises forming a copper layer by electroplating on a substrate in an integrated processing system and annealing the copper layer in a chamber inside the integrated processing system. ... | 03/20/2007 |
| 7153408 | Copper electroplating of printing cylinders The present invention is directed to an improved copper plating bath for depositing a copper layer onto a printing cylinder, the copper plating bath comprising: (a) a source of copper ions; (b) a source of methane sulphonate ions; (c) a source of chloride ions; (d) ... | 12/26/2006 |
| 7147767 | Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor The present invention provides plating solutions having either copper bis(perfluoroalkanesulfonyl) imides or copper tris(perfluoroalkanesulfonyl) methides and methods of electrochemically or chemically depositing copper interconnects using these plating solutions. | 12/12/2006 |
| 7144491 | Copper electrolytic solution containing organic sulfur compound and quaternary amine compound of specified skeleton as additives and electrolytic copper foil produced therewith It is an object of the present invention to obtain a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode ... | 12/05/2006 |
| 7135404 | Method for applying metal features onto barrier layers using electrochemical deposition The present invention is directed to a process for producing structures containing metallized features for use in microelectric workpieces. The process treats a barrier layer to promote the adhesion between the barrier layer and the metallized feature. Suitable mean... | 11/14/2006 |
| 7128823 | Anolyte for copper plating Embodiments of the invention provide a method for plating copper into features formed on a semiconductor substrate. The method includes positioning the substrate in a plating cell, wherein the plating cell includes a catholyte volume containing a catholyte solution,... | 10/31/2006 |
| 7128822 | Leveler compounds Compounds that function to provide level or uniform metal deposits are provided. These compounds are particularly useful in providing level copper deposits. Copper plating baths and methods of copper plating using these compounds are also provided. These baths and m... | 10/31/2006 |
| 7115196 | Apparatus and method for electrochemically depositing metal on a semiconductor workpiece A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material, or enhance an ultra-th... | 10/03/2006 |
| 7105082 | Composition and method for electrodeposition of metal on a work piece A composition for electrodeposition of a metal on a work piece, which electrodeposition is conducted at an electrodeposition temperature, is provided. The composition comprises a metal salt, a polymer suppressor having a cloud point, an accelerator and an electrolyt... | 09/12/2006 |
| 7087144 | Contact ring with embedded flexible contacts A contact assembly for supporting a substrate in an electrochemical plating system, wherein that contact assembly includes a contact ring and a thrust plate assembly. The contact ring includes an annular ring member having an upper surface and a lower surface, an an... | 08/08/2006 |
| 7074315 | Copper bath and methods of depositing a matt copper coating In the production of printed circuit boards it is required that organic protective coatings adhere tightly on the copper surfaces. Accordingly, matt layers of copper are to be preferred over lustrous coatings. The bath in accordance with the invention serves to depo... | 07/11/2006 |
| 7033463 | Substrate plating method and apparatus A method and apparatus plate a substrate to form wiring by efficiently filling a fine recess formed in a semiconductor substrate with plating metal without a void or contamination. The plating of the substrate to fill a wiring recess formed in the semiconductor subs... | 04/25/2006 |
| 7025861 | Contact plating apparatus Embodiments of the invention generally provide a substrate processing system and method. The substrate processing system generally includes a fluid basin configured to contain a plating solution therein, an anode assembly positioned in a lower portion of the fluid b... | 04/11/2006 |
| 7022169 | Electroless gold plating solution An electroless gold plating solution is provided that contains no cyanide compound as a source of gold and that contains a decomposition inhibitor represented by general formula (1), provided that, in a case in which the solution contains a gold complex of sulfite a... | 04/04/2006 |
| 7005055 | Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same The invention has an object of obtaining a low-profile electrolytic copper foil made by electrolytic copper foil manufacturing using a cathode drum such that the surface roughness on the rough surface side (the opposite side to the lustrous surface) is low. In parti... | 02/28/2006 |
| 6994776 | Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device A method for filling recessed microstructures at a surface of a microelectronic workpiece, such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal layer is deposited into the microstructures with a process, such as an e... | 02/07/2006 |
| 6984299 | Methods for determining organic component concentrations in an electrolytic solution The present invention relates to a method and apparatus for determining organic additive concentrations in a sample electrolytic solution, preferably a copper electroplating solution, by measuring the double layer capacitance of a measuring electrode in such sample ... | 01/10/2006 |
| 6977035 | Method for electrolytic copper plating A method for electrolytic copper plating using an electrolytic copper plating solution including a compound containing a structure of —X—S—Y—, wherein X and Y are independently chosen from hydrogen atom, carbon atom, sulfur atom, nitrogen atom, and oxygen at... | 12/20/2005 |
| 6932892 | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece A process for applying a metallization interconnect as to a semiconductor workpiece having a barrier layer deposited on a surface thereof is set forth. The process includes the forming of an ultra-thin metal seed layer on the barrier layer. The ultra-thin seed layer... | 08/23/2005 |
| 6919011 | Complex waveform electroplating A method of electroplating an object includes providing a electroplating bath solution with one or more anodes therein, disposing an object to be electroplated in the bath, and passing a complex current waveform between the anode nodes and the object. The waveform i... | 07/19/2005 |
| 6919013 | Apparatus and method for electrolytically depositing copper on a workpiece A process for applying a metallization interconnect structure to a semiconductor workpiece having a barrier layer deposited on a surface thereof is set forth. The process includes the forming of an ultra-thin metal seed layer on the barrier layer. The ultra-thin see... | 07/19/2005 |
| 6919214 | Apparatus for analyzing a substrate employing a copper decoration An apparatus for analyzing a substrate employing a copper decoration includes a bath having at least two receiving containers for receiving electrolytes, slots formed at insides of the receiving containers for receiving substrates to be analyzed in a direction that ... | 07/19/2005 |
