Class 205/295 - Utilizing alkaline bath

Subclass of Class 205 - Electrolysis: processes, compositions used therein, and methods of preparing the compositions
Definition: Subject matter wherein the electrolyte bath has a pH of
No. of patents: 28
Last issue date: 02/19/2008

Number	Title	Issue Date
7332066	Apparatus and method for electrochemically depositing metal on a semiconductor workpiece A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material, or enhance an ultra-th...	02/19/2008
7252706	Inhibition of calcium and magnesium precipitation from wood preservatives A wood preservative that contains a copper salt complex and a precipitation inhibitor is provided. The wood preservative may contain copper carbonate, an alkanolamine such as monoethanolamine and precipitation inhibitor such as a phosphonate or ethylene diamine comp...	08/07/2007
7226860	Method and apparatus for fabricating metal layer A method of electrochemical deposition (ECD) provides a barrier and a seed layer on a substrate. The surfaces of the substrate are pre-treated before a metal layer is electrochemically deposited thereon in an electrochemical plating cell with a physical or a chemica...	06/05/2007
7078340	Metal deposit process Method and system for controllable deposit of copper onto an exposed surface of a workpiece, such as a semiconductor surface. A seed thickness of copper is optionally deposited onto the exposed surface, preferably using oxygen-free liquid ammonia to enhance this dep...	07/18/2006
6932892	Apparatus and method for electrolytically depositing copper on a semiconductor workpiece A process for applying a metallization interconnect as to a semiconductor workpiece having a barrier layer deposited on a surface thereof is set forth. The process includes the forming of an ultra-thin metal seed layer on the barrier layer. The ultra-thin seed layer...	08/23/2005
6919013	Apparatus and method for electrolytically depositing copper on a workpiece A process for applying a metallization interconnect structure to a semiconductor workpiece having a barrier layer deposited on a surface thereof is set forth. The process includes the forming of an ultra-thin metal seed layer on the barrier layer. The ultra-thin see...	07/19/2005
6897152	Copper bath composition for electroless and/or electrolytic filling of vias and trenches for integrated circuit fabrication The present invention is directed to a copper bath composition and a process for the electroless and/or electrolytic plating of copper to fill vias and trenches during the manufacture of integrated circuits. Specifically, the copper bath composition comprises water,...	05/24/2005
6872295	Method for preparing an electroplating bath and related copper plating process The present invention is related to a method for the preparation of a composition for electroplating a copper-containing layer on a substrate. This method makes use of an aqueous solution that has at least: a source of copper Cu(II) ions, an additive to adjust the p...	03/29/2005
6866765	Electrolytic copper-plated R-T-B magnet and plating method thereof An R-T-B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray diffraction peak intensity I(200) from the (200) plane to the X-ray diffraction...	03/15/2005
6638410	Apparatus and method for electrolytically depositing copper on a semiconductor workpiece A process for applying a metallization interconnect structure to a semiconductor workpiece having a barrier layer deposited on a surface thereof is set forth. The process includes the forming of an ultra-thin metal seed layer on the barrier layer. The ult...	10/28/2003
6632345	Apparatus and method for electrolytically depositing a metal on a workpiece In accordance with one embodiment of the invention, a process for applying a metal to a workpiece is set forth. The workpiece initially includes a seed layer deposited on at least a portion of a surface thereof that is generally unsuitable for bulk electr...	10/14/2003
6344129	Method for plating copper conductors and devices formed A method for plating copper conductors on an electronic substrate and devices formed are disclosed. In the method, an electroplating copper bath that is filled with an electroplating solution kept at a temperature between about 0° C. and about 18° C. is...	02/05/2002
6197181	Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece A process for applying a metallization interconnect structure to a semiconductor workpiece having a barrier layer deposited on a surface thereof is set forth. The process includes the forming of an ultra-thin metal seed layer on the barrier layer. The ult...	03/06/2001
6183880	Composite foil of aluminum and copper This invention provides a composite foil comprising an aluminum carrier layer and an ultra-thin copper foil having a protective layer disposed between them comprising a porous copper layer and an interpenetrating zinc layer. A process for producing such c...	02/06/2001
6143159	Electrochemical autothermal reformer An electrochemical autothermal reformer (EATR) provides hydrogen. The EATR includes an autothermal reformer region, a reformer anode supply region, and a composite membrane layer separating the reformer anode from the autothermal reformer region. The comp...	11/07/2000
6113759	Anode design for semiconductor deposition having novel electrical contact assembly An anode assembly includes a perforated anode and an electrical contact assembly attached to the anode. A perforated anode holder holds the anode. The anode holder includes perforations at least in a bottom wall such that plating solution may flow through...	09/05/2000
6054037	Halogen additives for alkaline copper use for plating zinc die castings A method and electrolyte bath for depositing Cu+1 ions from the cathode diffusion layer onto a zinc substrate. Halogen ions are used as additives to organophosphonate alkaline copper electrolytes for stabilizing Cu+1 in the cathode d...	04/25/2000
6024850	Modified ion exchange materials Ion exchange materials, as particulate and membranes, are modified by permanently attaching counter ions to a portion of the ion exchange sites. The permanent attachment of the counter ions forms semiconductor junctions which act as mini anodes, or cathod...	02/15/2000
5750018	Cyanide-free monovalent copper electroplating solutions A substantially cyanide-free plating solution for depositing copper from the monovalent ionic state, which includes monovalent copper ion, a reducing agent capable of reducing divalent copper ions to monovalent copper ions, an alkali material in an amount...	05/12/1998
5607570	Electroplating solution The improved aqueous, non-cyanide zinc electroplating solution prevents iron contamination during electroplating. The solution, in addition to water, has a copper salt, preferably copper sulfate, in a concentration of about 0.01-6% by weight of the soluti...	03/04/1997
5516414	Method and apparatus for electrolytically plating copper A method for electrolytically plating copper onto a base metal, such as steel (18), utilizing an insoluble anode (16) includes the steps of: providing a pyrophosphate plating solution (14); adding a copper source, copper hydroxide, to the plating solution...	05/14/1996
5100517	Process for applying a copper layer to steel wire Copper plating cells which utilize soluble copper anodes which replenish the electrolyte with copper ions are normally used for applying copper layers to steel filaments. The amount of copper in such soluble anodes is diminished throughout the plating pro...	03/31/1992
4933051	Cyanide-free copper plating process A process for electroplating copper from an aqueous alkaline non-cyanide bath has improved resistance to degradation. At least a portion of the plating bath is subjected to electrolysis by an insoluble anode to which the current is controlled independentl...	06/12/1990
4521282	Cyanide-free copper electrolyte and process An improved aqueous cyanide-free electrolyte and process for depositing ductile, fine-grained adherent copper deposits on conductive substrates in which the electrolyte contains copper ions in an amount sufficient to electrodeposit copper, a complexing ag...	06/04/1985
4469569	Cyanide-free copper plating process A cyanide-free electrolyte and process for depositing a ductile, fine-grained, adherent copper plate usually of a thickness of about 0.015 to about 5 mils on ferrous-base, copper-base, zinc-base and the like conductive substrates. The electrolyte contains...	09/04/1984
4462874	Cyanide-free copper plating process A process for depositing a ductile, fine-grained adherent copper plate on a conductive substrate employing an electrolyte containing controlled effective amounts of cupric ions, a complexing agent for the cupric ions, a bath stabilizing and buffering agen...	07/31/1984
4456508	Treatment of copper foil A method of treating copper foil for use in the production of printed circuit boards includes the step of depositing onto the copper foil a layer containing nodular or dendritic zinc in such a manner as to increase the bond strength of the foil with a bas...	06/26/1984
4035246	Method and compositions for electroplating copper and brass An improved method of plating a workpiece with brass or copper which involves first applying an aqueous solution containing Rochelle salt, an alkali metal carbonate, and a surfactant to the workpiece without electrical current being applied, and thereafte...	07/12/1977

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Class 205/295 - Utilizing alkaline bath