Did You Know...
...When G.G. Hubbard learned of his future son-in-law's invention, he called it "only a toy." His daughter was engaged to a young man named Alexander Graham Bell.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7943033 | Electrolytic copper plating method, pure copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anode The present invention pertains to an electrolytic copper plating method characterized in employing pure copper as the anode upon performing electrolytic copper plating, and performing electrolytic copper plating with the pure copper anode having a crystal grain diam... | 05/17/2011 |
| 7357850 | Electroplating apparatus with segmented anode array An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are ... | 04/15/2008 |
| 7258778 | Electrocatalytic coating with lower platinum group metals and electrode made therefrom The present invention relates to an electrocatalytic coating and an electrode having the coating thereon, wherein the coating is a mixed metal oxide coating, preferably platinum group metal oxides, with or without low levels of valve metal oxides. The electrocatalyt... | 08/21/2007 |
| 7247229 | Coatings for the inhibition of undesirable oxidation in an electrochemical cell A process for electroplating of metal utilizing a valve metal electrode substrate containing multiple coating layers is disclosed. A top coating layer of a valve metal oxide is applied over a first coating layer of an electrochemically active coating. The electrode ... | 07/24/2007 |
| 7160421 | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical parameters in accordance with either a mathematical model of the processing ... | 01/09/2007 |
| 7138040 | Electrolytic copper plating method, phosphorous copper anode for electrolytic plating method, and semiconductor wafer having low particle adhesion plated with said method and anode An electrolytic copper plating method characterized in employing phosphorous copper as the anode upon performing electrolytic copper plating, and performing electrolytic copper plating upon making the crystal grain size of the phosphorous copper anode 10 to 1500 μm... | 11/21/2006 |
| 6974767 | Chemical solution for electroplating a copper-zinc alloy thin film A method of fabricating a semiconductor device, having a Cu—Zn alloy thin film (30) formed on a Cu surface (20) by electroplating the Cu surface (20) in a unique chemical solution containing salts of zinc (Zn) and copper (Cu), their complexing... | 12/13/2005 |
| 6935018 | Copper plated invar with acid preclean A method for forming a copper-Invar-copper (CIC) laminate having an intermetallic layer of negligible thickness, and a structure associated with the CIC laminate. Starting with a block of Invar, the method includes a cleaning step followed by an electroplating step.... | 08/30/2005 |
| 6919010 | Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction A substantially uniform layer of a metal is electroplated onto a work piece having a seed layer thereon. The current of a plating cell is provided from an azimuthally asymmetric anode, which is rotated with respect to the work piece (i.e., either or both of the work... | 07/19/2005 |
| 6899803 | Method and device for the regulation of the concentration of metal ions in an electrolyte and use thereof In order to regulate the metal ion concentration in an electrolyte fluid serving to electrolytically deposit metal and additionally containing substances of an electrochemically reversible redox system, it has been known in the art to conduct at least one portion of... | 05/31/2005 |
| 6855235 | Anode impedance control through electrolyte flow control Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to s... | 02/15/2005 |
| 6843897 | Anode slime reduction method while maintaining low current Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to s... | 01/18/2005 |
| 6835294 | Electrolytic copper plating method Electrolytic copper plating methods are provided, wherein copper is electrolytically deposited on a substrate, and the electrolytic copper plating solution supplied to the electrolytic copper plating is subjected to dummy electrolysis using an insoluble anode. The m... | 12/28/2004 |
| 6830673 | Anode assembly and method of reducing sludge formation during electroplating A higher applied potential may be provided to a consumable anode to reduce sludge formation during electroplating. For example, a higher applied potential may be provided to a consumable anode by decreasing the exposed surface area of the anode to the electrolyte so... | 12/14/2004 |
| 6821407 | Anode and anode chamber for copper electroplating An electroplating system includes (a) a phosphorized anode having an average grain size of at least about 50 micrometers and (b) plating apparatus that separates the anode from the cathode and prevents most particles generated at the anode from passing to the cathod... | 11/23/2004 |
| 6797144 | Method for reducing surface defects in an electrodeposition process A method for in-situ cleaning an electrodeposition surface following an electroplating process including providing a first electrode assembly and a second electrode assembly; applying a first current density across the first electrode assembly and the second electro... | 09/28/2004 |
| 6783654 | Electrolytic plating method and device for a wiring board A plating bath which accommodates an insoluble anode and a printed-circuit board, and a copper dissolved bath which supplies copper ions are arranged. The insoluble anode is arranged as opposed to the printed-circuit board being a cathode, and a forward/reverse curr... | 08/31/2004 |
| 6773571 | Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources The present invention pertains to methods and apparatus for electroplating a substantially uniform layer of a metal onto a work piece having a seed layer thereon. The total current of a plating cell is distributed among a plurality of anodes in the plating cell in o... | 08/10/2004 |
| 6740221 | Method of forming copper interconnects A method of forming a copper layer with increased electromigration resistance. A doped copper layer is formed by controlling the incorporation of a non-metallic dopant during copper electroplating. ... | 05/25/2004 |
| 6706166 | Method for improving an electrodeposition process through use of a multi-electrode assembly A method for improving an electrodeposited metal film uniformity and preventing metal deposition and peeling of deposited metal from an electrode during an electrodeposition and electropolishing process including providing a first anode electrode assembly and a semi... | 03/16/2004 |
| 6576110 | Coated anode apparatus and associated method An anode is configured to be used within a metal film plating apparatus. The anode has a substantially planar electric field generating portion and an electrolyte solution chemical reaction portion. The planar electric field generating portion is coated w... | 06/10/2003 |
| 6569300 | Steel-clad cathode for electrolytic refining of copper An electrolytic cathode consists of a solid copper hanger bar and a stainless-steel mother plate attached to a receiving groove in the underside of the hanger bar. In the preferred embodiment of the invention, the entire length of connection is welded, th... | 05/27/2003 |
| 6527939 | Method of producing copper foil with an anode having multiple coating layers A method of producing copper foil, and more particularly, in an electrochemical cell containing organic substituents, is provided herein. The metal may be deposited on an electrode that comprises an electrode base having at least one undercoating layer of... | 03/04/2003 |
| 6527934 | Method for electrolytic deposition of copper A process is provided for electrolytically depositing copper onto a workpiece. The process includes the steps of providing a copper generation vessel and generating a copper plating solution from solid-state copper in the vessel. The plating solution so g... | 03/04/2003 |
| 6432293 | Process for copper-plating a wafer using an anode having an iridium oxide coating A process for copper-plating a wafer which comprises electroplating a semiconductor wafer with an electrode comprising a corrosion-resistant metal substrate and a coat mainly composed of iridium oxide provided on the substrate as an anode and the wafer as... | 08/13/2002 |
| 6344129 | Method for plating copper conductors and devices formed A method for plating copper conductors on an electronic substrate and devices formed are disclosed. In the method, an electroplating copper bath that is filled with an electroplating solution kept at a temperature between about 0° C. and about 18° C. is... | 02/05/2002 |
| 6251251 | Anode design for semiconductor deposition An anode assembly including a perforated anode. A perforated anode holder holds the anode. The anode holder includes perforations at least in a bottom wall such that plating solution may flow through perforations in the anode holder and perforations in th... | 06/26/2001 |
| 6113759 | Anode design for semiconductor deposition having novel electrical contact assembly An anode assembly includes a perforated anode and an electrical contact assembly attached to the anode. A perforated anode holder holds the anode. The anode holder includes perforations at least in a bottom wall such that plating solution may flow through... | 09/05/2000 |
| 6099711 | Process for the electrolytic deposition of metal layers The invention relates to a method for the electrolytic deposition of metal coatings, in particular of copper coatings with certain physical-mechanical and optical properties and uniform coating thickness. According to known methods using soluble anodes an... | 08/08/2000 |
| 5935402 | Process for stabilizing organic additives in electroplating of copper A process and assembly for stabilizing organic additives in an electrolytic solution while electroplating copper. The process includes forming a protective film on a first surface of an anode and minimizing contact between the electrolytic solution and a ... | 08/10/1999 |
| 5628892 | Electroplating method and apparatus for the preparation of metal foil and split insoluble electrode used therein A length of electroplated metal foil, typically copper foil is prepared by placing a stationary arcuate anode concentrically with a rotating cathode drum to define a channel therebetween, passing a plating solution through the channel, conducting electric... | 05/13/1997 |
| 5580437 | Anode useful for electrochemical conversion of anhydrous hydrogen halide to halogen gas A particular anode comprising an electrochemically active material selected from the group consisting of the oxides of the elements tin, germanium and lead and mixtures comprising at least one of the respective oxides of such elements is useful in an elec... | 12/03/1996 |
| 5543522 | Process for preparing an ambient temperature molten salt using thionyl chloride There are disclosed a process for preparing an ambient temperature molten salt, which comprises treating an ambient temperature molten salt consisting essentially of 20 to 50 mole % of an aluminum halide and 80 to 50 mole % of an onium halide, containing ... | 08/06/1996 |
| 5407556 | Process of producing metallic foil by electrolysis A process of producing a metallic foil by electrolysis by depositing the metallic foil on a cathode by electrolysis from a sulfuric acid acidic solution is disclosed, which comprises using an electrode having a coating of an electrode active material cont... | 04/18/1995 |
| 5262040 | Method of using a metal substrate of improved surface morphology A metal surface is now described having enhanced adhesion of subsequently applied coatings. The substrate metal of the article, such as a valve metal as represented by titanium, is provided with a highly desirable surface characteristic for subsequent coa... | 11/16/1993 |
| 5143593 | Method of copper plating A method of copper-plating a material whereby electrolysis is performed using an electrolytic plating cell including a diaphragm which separates an anode chamber having therein an insoluble metal electrode as an anode from a cathode chamber having therein... | 09/01/1992 |
| 5100517 | Process for applying a copper layer to steel wire Copper plating cells which utilize soluble copper anodes which replenish the electrolyte with copper ions are normally used for applying copper layers to steel filaments. The amount of copper in such soluble anodes is diminished throughout the plating pro... | 03/31/1992 |
| 4933051 | Cyanide-free copper plating process A process for electroplating copper from an aqueous alkaline non-cyanide bath has improved resistance to degradation. At least a portion of the plating bath is subjected to electrolysis by an insoluble anode to which the current is controlled independentl... | 06/12/1990 |
| 4869792 | Electrochemical process for producing catalysts A process for producing catalysts, in which an active component or a compound to be converted into an active component is obtained or deposited on a carrier material, using deposition-precipitation. According to the invention, the formula of a carrier mat... | 09/26/1989 |
| 4696731 | Amorphous metal-based composite oxygen anodes Improved amorphous metal-based composite oxygen anodes comprise a substrate material, a first coating of an amorphous metal alloy applied thereto and a second coating of a mixed metal oxide applied to the first coating and fused therewith. A method for th... | 09/29/1987 |
