Quotables
"It is my heart-warmed and world-embracing Christmas hope and aspiration that all of us, the high, the low, the rich, the poor, the admired, the despised, the loved, the hated, the civilized, the savage (every man and brother of us all throughout the whole earth), may eventually be gathered together in a heaven of everlasting rest and peace and bliss, except the inventor of the telephone. "
Mark Twain ; Christmas greetings, 1890
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| Number | Title | Issue Date |
| 7857961 | Copper plating bath formulation To provide a copper plating solution composition that precipitates copper plated membranes that are both uniform and smooth and which has good external appearance even if the copper plated membranes that are formed are relatively thin. The copper plating solution co... | 12/28/2010 |
| 7575666 | Process for electrolytically plating copper An electrolytic copper plating process comprising two steps is proposed. The process is particularly suited to plating in very confined spaces. The first step comprises a pre-treatment solution comprising an anti-suppressor that comprises a sulfur containing organic... | 08/18/2009 |
| 7429400 | Method of using ultrasonics to plate silver A method of reducing solder mask interface attack in a process of fabricating printed circuit boards. The method comprises the steps of providing a printed circuit board with a solder mask applied thereon and treating the printed circuit board with an immersion plat... | 09/30/2008 |
| 7405157 | Methods for the electrochemical deposition of copper onto a barrier layer of a work piece Methods are provided for electrochemically depositing copper on a work piece. One method includes the step of depositing overlying the work piece a barrier layer having a surface and subjecting the barrier layer surface to a surface treatment adapted to facilitate d... | 07/29/2008 |
| 7399423 | Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the me... | 07/15/2008 |
| 7387717 | Method of performing electrolytic treatment on a conductive layer of a substrate A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surfac... | 06/17/2008 |
| 7357850 | Electroplating apparatus with segmented anode array An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are ... | 04/15/2008 |
| 7311808 | Device and method for increasing mass transport at liquid-solid diffusion boundary layer A device and method for increasing the mass transport rate of a chemical or electrochemical process at the solid and fluid interface in a fluid cell. The device includes a membrane in close contact with surface of the work piece, to separate the process cell into tw... | 12/25/2007 |
| 7300869 | Integrated barrier and seed layer for copper interconnect technology An integrated barrier and seed layer that is useful for creating conductive pathways in semiconductor devices. The barrier portion of the integrated layer prevents diffusion of the conductive material into the underlying dielectric substrate while the seed portion p... | 11/27/2007 |
| 7267749 | Workpiece processor having processing chamber with improved processing fluid flow A processing container (610) for providing a flow of a processing fluid during immersion processing of at least one surface of a microelectronic workpiece is set forth. The processing container comprises a principal fluid flow chamber (505) providing a... | 09/11/2007 |
| 7264403 | Optical ferrule having a covering and associated method of ablating an optical fiber An optical ferrule is provided with a ferrule body having a front face and at least one covering applied to the front face to protect the front face of the ferrule from a laser beam used during a trimming process. The optical ferrule may also have a second covering ... | 09/04/2007 |
| 7264704 | Electrolysis cell for restoring the concentration of metal ions in electroplating processes It is described an electrolysis cell wherein the anodic dissolution of metals is carried out, in particular of metals characterised by a relatively high oxidation potential, such as copper, or metals with high hydrogen overpotential, for example tin, aimed at restor... | 09/04/2007 |
| 7247256 | CMP slurry for forming aluminum film, CMP method using the slurry, and method for forming aluminum wiring using the CMP method A first chemical mechanical polishing (CMP) slurry includes a polishing agent, an oxidant, a pH control additive, and an oxide film removal retarder which reduces a removal rate of the silicon oxide film. A second chemical mechanical polishing (CMP) slurry includes ... | 07/24/2007 |
| 7241396 | Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the me... | 07/10/2007 |
| 7235165 | Electroplating solution and method for electroplating An electroplating solution may be formulated as an aqueous solution of oxalic acid, trisodium phosphate and ammonium sulfate. Such solutions may be used for both brush plating and bath plating, and are suitable for use with a variety of plating metals and substrate ... | 06/26/2007 |
| 7229535 | Hydrogen bubble reduction on the cathode using double-cell designs An apparatus and method for planarizing a surface of a substrate using a chamber separated into two parts by a membrane, and two separate electrolytes is provided. The embodiments of the present invention generally provide an electrochemical mechanical polishing sys... | 06/12/2007 |
| 7217464 | Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing method The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by press working at temperatures of not less than 200°C. For this purpose ... | 05/15/2007 |
| 7217353 | Method and apparatus for plating substrate After bubbles adsorbed to a substrate are removed by rotating the substrate in a plating solution at a higher speed or after the wettability of the surface of the substrate to be plated is improved before the substrate is immersed in the plating solution, the substr... | 05/15/2007 |
| 7201829 | Mask plate design The present invention includes a mask plate design that includes at least one or a plurality of channels portions on a surface of the mask plate, into which electrolyte solution will accumulate when the mask plate surface is disposed on a surface of wafer, and out o... | 04/10/2007 |
| 7179736 | Method for fabricating planar semiconductor wafers The present invention relates to a method of fabricating planar semiconductor wafers. The method comprises forming a dielectric layer on a semiconductor wafer surface, the semiconductor wafer surface having vias, trenches and planar regions. A barrier and seed metal... | 02/20/2007 |
| 7166144 | Interlaced series parallel configuration for metal solvent extraction plants An interlaced series parallel configuration for the extraction of metal values from an metal value containing aqueous is a special series parallel configuration wherein the stripped organic is first contacted in a second extraction stage with the partially copper de... | 01/23/2007 |
| 7147767 | Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor The present invention provides plating solutions having either copper bis(perfluoroalkanesulfonyl) imides or copper tris(perfluoroalkanesulfonyl) methides and methods of electrochemically or chemically depositing copper interconnects using these plating solutions. | 12/12/2006 |
| 7138040 | Electrolytic copper plating method, phosphorous copper anode for electrolytic plating method, and semiconductor wafer having low particle adhesion plated with said method and anode An electrolytic copper plating method characterized in employing phosphorous copper as the anode upon performing electrolytic copper plating, and performing electrolytic copper plating upon making the crystal grain size of the phosphorous copper anode 10 to 1500 μm... | 11/21/2006 |
| 7128823 | Anolyte for copper plating Embodiments of the invention provide a method for plating copper into features formed on a semiconductor substrate. The method includes positioning the substrate in a plating cell, wherein the plating cell includes a catholyte volume containing a catholyte solution,... | 10/31/2006 |
| 7118658 | Electroplating reactor A reactor for electroplating a workpiece includes a vessel having a ring contact arranged to support a workpiece in a horizontal orientation. In an embodiment of the invention, an electrode is arranged below the ring contact, and a pressing member is arranged above ... | 10/10/2006 |
| 7112287 | Thin film supporting substrate for used in filter for hydrogen production filter and method for manufacturing filter for hydrogen production In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the me... | 09/26/2006 |
| 7105082 | Composition and method for electrodeposition of metal on a work piece A composition for electrodeposition of a metal on a work piece, which electrodeposition is conducted at an electrodeposition temperature, is provided. The composition comprises a metal salt, a polymer suppressor having a cloud point, an accelerator and an electrolyt... | 09/12/2006 |
| 7087315 | Method for forming plating film A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th... | 08/08/2006 |
| 7071013 | Fixture and method for uniform electroless metal deposition on integrated circuit bond pads A method and an apparatus for uniform electroless plating of layers onto exposed metallizations in integrated circuits such as bond pads. The apparatus provides means for holding a plurality of wafers, and rotating each wafer at constant speed and synchronous within... | 07/04/2006 |
| 7052781 | Flexible copper foil structure and fabrication method thereof A new copper foil structure with enhanced flexibility and its fabrication method thereof are disclosed. This inventive structure includes a copper base foil having a matte side and shiny side, and a more thermally stable deposited layer overlying at least the matte ... | 05/30/2006 |
| 7049007 | Composite foil and its manufacturing process A peelable composite foil includes a metallic carrier foil, a first barrier layer on one side of the metallic carrier and a second metallic layer on the first barrier layer. The second metallic layer includes a combination of a metal selected from the group includin... | 05/23/2006 |
| 7048840 | Method for metal coating the surface of high temperature superconductors The invention relates to a method for metal coating the surface of high temperature superconductors with a copper-oxygen base structure. The aim of the invention is to achieve a method as above, which requires a low production complexity, serves for the production o... | 05/23/2006 |
| 7045443 | Method for manufacturing semiconductor device, semiconductor device, circuit board, and electronic apparatus A method is provided for manufacturing a semiconductor device, a semiconductor device, a circuit board, and an electronic apparatus. In such a semiconductor device, semiconductor chips can be readily aligned when they are stacked and terminals can be prevented from ... | 05/16/2006 |
| 7033463 | Substrate plating method and apparatus A method and apparatus plate a substrate to form wiring by efficiently filling a fine recess formed in a semiconductor substrate with plating metal without a void or contamination. The plating of the substrate to fill a wiring recess formed in the semiconductor subs... | 04/25/2006 |
| 7030021 | Method of fabricating metal interconnection of semiconductor device A method of fabricating a metal interconnection of semiconductor device is disclosed. A metal interconnection fabricating method according to the present invention comprises the steps of depositing a metal layer on a substrate having a predetermined structure; patte... | 04/18/2006 |
| 7026244 | Low resistance and reliable copper interconnects by variable doping A method and system is provided for efficiently varying the composition of the metal interconnects for a semiconductor device. A metal interconnect according to the present disclosure has an intermediate layer on a dielectric material, the intermediate layer having ... | 04/11/2006 |
| 7014679 | Process for degassing an aqueous plating solution A process for removing oxygen from a copper plating solution is provided. The solution is passed through a degasser comprising a shell and hollow hydrophobic fiber porous membranes wherein the shell while a vacuum is drawn on the surfaces of the fibers opposite the ... | 03/21/2006 |
| 6986838 | Nanomachined and micromachined electrodes for electrochemical devices A nanomachined and micromachined electrode (10) is disclosed that is produced by providing a layer of aluminum (11) positioned upon a conductive substrate (12), anodizing the layer of aluminum to produce a layer of aluminum oxide (13) hav... | 01/17/2006 |
| 6979393 | Method for plating copper conductors and devices formed A method for plating copper conductors on an electronic substrate and devices formed are disclosed. In the method, an electroplating copper bath that is filled with an electroplating solution kept at a temperature between about 0° C. and about 18° C. is first prov... | 12/27/2005 |
| 6977035 | Method for electrolytic copper plating A method for electrolytic copper plating using an electrolytic copper plating solution including a compound containing a structure of —X—S—Y—, wherein X and Y are independently chosen from hydrogen atom, carbon atom, sulfur atom, nitrogen atom, and oxygen at... | 12/20/2005 |
