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| Number | Title | Issue Date |
| 7407569 | Gold plating solution and gold plating method A gold plating solution comprising iodide ions, gold iodide complex ions and a non-aqueous solvent, which is less toxic and stable, while having a performance comparable to a cyanide type gold plating solution. The present invention further provides a gold plating s... | 08/05/2008 |
| 7371311 | Modified electroplating solution components in a low-acid electrolyte solution An embodiment of the invention provides a method for reducing within die thickness variations by modifying the concentration of components of a low-acid electroplating solution. For one embodiment, the leveler concentration is increased sufficiently to reduce within... | 05/13/2008 |
| 7261803 | Non-cyanogen type electrolytic solution for plating gold A non-cyanogen type electrolytic solution, for plating gold, contains a gold salt as a supply source of gold and is added with a non-cyanogen type compound wherein the electrolytic plating solution is added with one selected from a group of thiouracil; 2-aminoethane... | 08/28/2007 |
| 7214440 | Metallic separator for fuel cell and production method for the same A metallic separator for a fuel cell has excellent corrosion resistance and contact resistance, even when a gold coating is applied directly without a surface treatment by a nickel coating. The metallic separator for a fuel cell, comprising stainless steel having a ... | 05/08/2007 |
| 7105082 | Composition and method for electrodeposition of metal on a work piece A composition for electrodeposition of a metal on a work piece, which electrodeposition is conducted at an electrodeposition temperature, is provided. The composition comprises a metal salt, a polymer suppressor having a cloud point, an accelerator and an electrolyt... | 09/12/2006 |
| 6911068 | Plating bath and method for depositing a metal layer on a substrate A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with resp... | 06/28/2005 |
| 6814850 | Acid bath for electrodeposition of glossy gold and gold alloy layers and a gloss additive for same The invention provides an acid bath for the electrodeposition of glossy gold and gold alloy layers and a gloss additive for same. By using compounds of the formula I R—SOm—H (I) in which | 11/09/2004 |
| 6773573 | Plating bath and method for depositing a metal layer on a substrate A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with resp... | 08/10/2004 |
| 6736954 | Plating bath and method for depositing a metal layer on a substrate A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of p... | 05/18/2004 |
| 6733651 | Method for producing a cyanide-free solution of a gold compound that is suitable for galvanic gold baths A method for producing a cyanide-free solution of a gold compound that is suitable for gold electrodeposition baths. The method includes the steps of reacting at least one of a cysteine and a cysteinate with at least one of tetrachloroauric acid and a tetrachloroaur... | 05/11/2004 |
| 6635166 | Composite plating method Inorganic or organic fine particles which are insoluble to water are added to a metal plating bath, by dispersing the fine particles in a watery medium by the help of an azo-surfactant having an aromatic azo compound residue. Electrolysis is then carried ... | 10/21/2003 |
| 6620304 | Bath system for galvanic deposition of metals A bath system for galvanic deposition of metals includes a solution containing at least one metal, especially a precious metal and/or precious metal alloy in the form of a water-soluble salt, at least one water-soluble protein material or amino acid and/o... | 09/16/2003 |
| 6576114 | Electroplating composition bath There is provided an electrodeposit free of cobalt, cadmium and nickel which contains 1.25 to 1.55% w/w iron, 1 to 2 ppm zirconium; and 97.7 to 98.2% gold and has a pale yellow color less than 3N on the NIHS scale. The invention also provides an electropl... | 06/10/2003 |
| 6565732 | Gold plating solution and plating process The present invention provides a non-cyanide electrolytic gold plating solution comprising a gold compound, as a source material for gold, selected from the group consisting of a gold salt and a gold complex, a buffering agent, an organic brightener, and ... | 05/20/2003 |
| 6511589 | Gold plating solution and gold plating method using thereof A non-cyanide electrolytic gold plating solution excellent in its solution stability, and a method for gold plating using thereof. A non-cyanide electrolytic gold plating solution according to the present invention containing a trivalent gold compound whi... | 01/28/2003 |
| 6336962 | Method and solution for producing gold coating The present invention describes a method of producing gold coating on a workpiece having a palladium surface, having the steps of: a) making an aqueous solution containing at least one compound selected from the group of compounds containing gold(I) and gold(I... | 01/08/2002 |
| 6323128 | Method for forming Co-W-P-Au films A method for forming a quaternary alloy film of Co--W--P--Au for use as a diffusion barrier layer on a copper interconnect in a semiconductor structure and devices formed incorporating such film are disclosed. In the method, a substrate that has copper co... | 11/27/2001 |
| 6251249 | Precious metal deposition composition and process Formulations and procedures for the deposition of precious metals onto solid substrates are disclosed wherein the formulations are iodide-free and contain an organosulfur compound and/or a carboxylic acid and a source of soluble precious metal ion which i... | 06/26/2001 |
| 6183545 | Aqueous solutions for obtaining metals by reductive deposition An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1) ##STR1## in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydr... | 02/06/2001 |
| 6165342 | Cyanide-free electroplating bath for the deposition of gold and gold alloys Cyanide-free electroplating baths for deposition of gold and gold alloy coatings, using sulphurous gold complexes that are stable for a relatively long time, can be used with current density over 1 A/dm2 and are practically odor-free, are obtai... | 12/26/2000 |
| 5575900 | Gold plating solutions Opportunistic decorative mass production gold plating solutions are described which are capable of plating gold at concentrations as low as one-half pennyweight per gallon based on an alkaline gold cyanide complex. The low concentration enables ecological... | 11/19/1996 |
| 5302278 | Cyanide-free plating solutions for monovalent metals A solution for use in electroplating which comprises at least one monovalent metal such as copper, silver or gold which is complexed by a thiosulfate ion; and a stabilizer of an organic sulfinate compound such as, for example, one having the formula R-SO | 04/12/1994 |
| 5277790 | Non-cyanide electroplating solution for gold or alloys thereof Disclosed are cyanide free electroplating solutions for gold or alloys thereof; said solutions comprising gold in the form of a soluble sulfite complex, an added source of sulfite and/or bisulfite ion and a supporting electrolyte; and said solutions furth... | 01/11/1994 |
| 5217599 | Bonding of polyimide film Disclosed is a method for electroplating a metal sheet adapted for being used in electronic packaging material, such as printed circuit boards. Bismaleimide and its derivative are added into the plated solution so as to form insoluble particles of bismale... | 06/08/1993 |
| 5169514 | Plating compositions and processes A gold or gold alloy plating composition comprises: a source of gold ions such as potassium gold (I) cyanide; optionally a source of alloying metal (e.g. nickel or cobalt) ions, for example as a sulphate; optionally a complexing agent for the alloying met... | 12/08/1992 |
| 4913787 | Gold plating bath and method A gold plating bath having potassium aurous cyanide and thiourea complexing agent dissolved in water and adjusted to an acidity of pH 3 or lower can be used as either electroplating or electroless plating bath. Bright gold electroplating is possible when ... | 04/03/1990 |
| 4755265 | Processes for the deposition or removal of metals Methods for depositing metals on or removing metals from substrates are provided which involve the use of electrolytic cells comprising an anode and cathode, sulfuric acid, and a chalcogen-containing compound soluble in said bath and having the empirical ... | 07/05/1988 |
| 4717459 | Electrolytic gold plating solution An electrolytic gold plating solution including a soluble gold salt, a conductivity salt, and, in addition, a mixture of a lead compound and a complexing agent having the stability constant with lead of not less than 15 or a complex obtained from the lead... | 01/05/1988 |
| 4686017 | Electrolytic bath and methods of use An electrolytic bath, suitable for depositing a metal on or removing a metal from a substrate is provided which comprises an anode and cathode, an acid having a pKa of about 6 or less, and a chalcogen-containing compound soluble in said bath an... | 08/11/1987 |
| 4497696 | Gold-plating electrolyte and process for preparing same A gold-plating electrolyte which has the following composition, g/l: The electrolyte can also incorporate additives--ethylenediaminetetraacetocopper (II)-bis(2-aminoethylammonium) or ethylenediamine tetraacetocadmium-bis-(2-aminoethylammonium) in an amoun... | 02/05/1985 |
| 4465564 | Gold plating bath containing tartrate and carbonate salts A bath for electrodepositing gold utilizes, as the essential ingredients of its electrolyte, salts providing the tartrate radical and the carbonate radical. The bath will have a pH value ranging from approximately neutral to highly alkaline, and adjustmen... | 08/14/1984 |
| 4435253 | Gold sulphite electroplating solutions and methods An electroplating bath solution comprising an alkali metal or ammonium gold sulphite, a water soluble salt of thallium metal to effect brightening and grain refining, and a non-hydroxy, non-amino carboxylic acid such as formic acid and oxalic acid to ensu... | 03/06/1984 |
| 4379738 | Electroplating zinc An electroplating process is described for plating various metals and alloys in which certain organic substances are added to the plating solution. This permits high plating rates with excellent plating results, including smooth bright finishes, freedom f... | 04/12/1983 |
| 4377449 | Electrolytic silver plating A silver electroplating bath comprising heterocyclic organic additives such as lactones, lactams, cyclic sulfate esters, cyclic imides and cyclic oxazolinones, preferably phenolphthalein.... | 03/22/1983 |
| 4377448 | Electrolytic gold plating A gold electroplating bath comprising heterocyclic organic compounds such as lactones, lactams, cyclic sulfate esters, cyclic imides and cyclic oxazolinones.... | 03/22/1983 |
| 4310391 | Electrolytic gold plating A particular type of electrode structure is described which is useful as a counter electrode in gold plating processes. The electrode surface comprises oxides of certain group eight elements and oxides of certain valve metals. A process for preparing the ... | 01/12/1982 |
| 4310392 | Electrolytic plating The electroplating of various metals such as zinc, copper, cadmium, chromium, nickel cobalt, gold, silver, palladium, platinum, ruthenium and alloys of such metals takes place from electrolytes comprising heterocyclic additives such as lactones, lactams, ... | 01/12/1982 |
| 4212708 | Gold-plating electrolyte The gold-plating electrolyte of the present invention contains the components in the following proportions, g/l: hexapotassium μ-ethylenediaminotetracetate bis(aurous sulphite):10.5-123.0 a salt of an alkali metal of ethylenediaminotetracetic acid: 17.8-140.0... | 07/15/1980 |
| 4192723 | Aqueous solution of monovalent gold and ammonium sulfite complex, process for the preparation thereof and electrolytic bath obtained therefrom for the plating of gold or gold alloys Aqueous solution of monovalent gold and ammonium sulfite complex. As opposed to the corresponding alkali-gold sulfite solution, this solution is stable under slightly acidic pH conditions and can be used advantageously for preparing electrolytic baths for... | 03/11/1980 |
| 4080381 | Water soluble tertiary amine boranes New water soluble ether substituted tertiary amine boranes are prepared by reaction of dimethylsulfide borane and an ether substituted tertiary amine of the formula wherein a is zero or an integer from 1 to 3, x is zero or an integer from 1 to 4, b is an ... | 03/21/1978 |
