Quotables
"To place a man in a multi-stage rocket and project him into the controlling gravitational field of the moon where the passengers can make scientific observations, perhaps land alive, and then return to earth--all that constitutes a wild dream worthy of Jules Verne. I am bold enough to say that such a man-made voyage will never occur regardless of all future advances."
Lee deForest, American radio pioneer ; 1957
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7264848 | Non-cyanide electroless gold plating solution and process for electroless gold plating The present invention provides a non-cyanide electroless gold plating solution free from a cyanide compound, comprising, as a completing agent of gold, a compound represented by the formula shown below or a salt thereof: X—(CH2)n—... | 09/04/2007 |
| 7261803 | Non-cyanogen type electrolytic solution for plating gold A non-cyanogen type electrolytic solution, for plating gold, contains a gold salt as a supply source of gold and is added with a non-cyanogen type compound wherein the electrolytic plating solution is added with one selected from a group of thiouracil; 2-aminoethane... | 08/28/2007 |
| 7235165 | Electroplating solution and method for electroplating An electroplating solution may be formulated as an aqueous solution of oxalic acid, trisodium phosphate and ammonium sulfate. Such solutions may be used for both brush plating and bath plating, and are suitable for use with a variety of plating metals and substrate ... | 06/26/2007 |
| 7087315 | Method for forming plating film A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th... | 08/08/2006 |
| 7022210 | Locally-distributed electrode and method of fabrication A locally distributed electrode is made by placing a conducting metallic oxide layer and a counter electrode in contact with a noble metal electroplating solution and applying a negative potential to the metallic oxide layer relative to the counter electrode, such t... | 04/04/2006 |
| 7011738 | Activation of a cathode The present invention relates to a method for activation of a cathode comprising at least a cathode substrate wherein the cathode is cleaned by means of an acid, the cleaned cathode is coated with at least one electrocatalytic coating solution, drying the coated cat... | 03/14/2006 |
| 6863991 | Coated biperiodic metallic mesh arrays with molecular monolayers and lipid bilayers thereon A coated metallic mesh having a molecular layer thereon comprising: (1) a metallic mesh comprising at least one aperture; (2) a coating disposed on the metallic mesh that at least partially fills at least one aperture so as to form a partially-filled aperture; and (... | 03/08/2005 |
| 6852210 | Plating method and plating bath precursor used therefor To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing ... | 02/08/2005 |
| 6852207 | Method for producing prosthetic moulded parts for dental use In a method for manufacture of prosthetic moulded parts for the dental sector with the aid of galvanic metal deposition, deposition at least partly takes place by pulse current. Deposition is preferably ended in a period of less than 5 hours, particularly within 1 t... | 02/08/2005 |
| 6797405 | Method for uniform electrochemical reduction of apertures to micron and submicron dimensions using commercial biperiodic metallic mesh arrays and devices derived therefrom A method for electrodepositing a uniformly thick coating on a metallic mesh is provided, the method comprises the steps of: (1) providing a metallic mesh having a plurality of apertures having at least one dimension greater than nanometer scale sizes; (2) subjecting... | 09/28/2004 |
| 6793798 | Radioactively coated devices This invention relates to radioactively coated devices, preferably radioactively coated medical devices. These coated devices are characterized as having a low rate of leaching of the radioisotope from the surface of the coated device and a uniform radioactive coati... | 09/21/2004 |
| 6773568 | Metal alloy compositions and plating methods related thereto The present invention provides inter alia electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer addit... | 08/10/2004 |
| 6746579 | Electrolytic gold plating method and apparatus therefor An object of the present invention is to provide a method of monitoring deterioration of an electrolytic gold plating solution which can always stably performing gold plating by continuously detecting a deterioration state of the gold sulfite complex plating solutio... | 06/08/2004 |
| 6736954 | Plating bath and method for depositing a metal layer on a substrate A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of p... | 05/18/2004 |
| 6576114 | Electroplating composition bath There is provided an electrodeposit free of cobalt, cadmium and nickel which contains 1.25 to 1.55% w/w iron, 1 to 2 ppm zirconium; and 97.7 to 98.2% gold and has a pale yellow color less than 3N on the NIHS scale. The invention also provides an electropl... | 06/10/2003 |
| 6533849 | Electroless gold plated electronic components and method of producing the same An neutral electroless gold plating method that minimises "black band" corrosion problem in the final product. The electroless gold plating solution is provided at neutral pH in the presence of a reducing agent, a complexing agent and an accelerator to al... | 03/18/2003 |
| 6475629 | Adhesive film formed of a siloxane-modified polyamideimide resin composition, adhesive sheet and semiconductor device Adhesive film useful for the production of semiconductor devices is produced from a siloxane-modified polyamideimide resin composition, comprising 100 parts by weight of a siloxane-modified polyamideimide resin and 1 to 200 parts by weight of a thermosett... | 11/05/2002 |
| 6423202 | Process for making gold salt for use in electroplating A process for producing sodium gold sulfite in solution is described. The sodium gold sulfite solution is useful in gold electroplating baths, and can be used in applications which require pure, soft gold deposits.... | 07/23/2002 |
| 6344125 | Pattern-sensitive electrolytic metal plating A process for the electrolytic deposition of a metal, preferably copper or an alloy of copper, directly onto a barrier layer coated on a dielectric layer. The process is advantageous because it electrolytically deposits metal in a pattern that is either t... | 02/05/2002 |
| 6344126 | Electroplating apparatus and method An electroplating apparatus is provided with a metal target and a device for supporting a semiconductor wafer (or other workpiece) in an electroplating solution. The target (anode) may be located relatively far from the wafer surface (cathode) at the begi... | 02/05/2002 |
| 6323128 | Method for forming Co-W-P-Au films A method for forming a quaternary alloy film of Co--W--P--Au for use as a diffusion barrier layer on a copper interconnect in a semiconductor structure and devices formed incorporating such film are disclosed. In the method, a substrate that has copper co... | 11/27/2001 |
| 6261436 | Fabrication method for gold bonding wire A gold bonding wire fabrication method, which includes the steps of (a) drawing a non-gold wire rod, for example, a pure silver wire rod or pure palladium wire rod into a core wire of thickness within about 1 μm~500 μm, (b) electroplating the core wire ... | 07/17/2001 |
| 6258241 | Process for electroplating metals A process for electroplating metal on a resistive substrate and the article of manufacture produced therefrom are disclosed. The metal layer is electroplated onto the resistive substrate in an electroplating bath having a polarization parameter .xi. less ... | 07/10/2001 |
| 6203936 | Lightweight metal bipolar plates and methods for making the same Thin, light weight bipolar plates for use in electrochemical cells are rapidly, and inexpensively manufactured in mass production by die casting, stamping or other well known methods for fabricating magnesium or aluminum parts. The use of a light metal, s... | 03/20/2001 |
| 6143159 | Electrochemical autothermal reformer An electrochemical autothermal reformer (EATR) provides hydrogen. The EATR includes an autothermal reformer region, a reformer anode supply region, and a composite membrane layer separating the reformer anode from the autothermal reformer region. The comp... | 11/07/2000 |
| 6126807 | Process for making sodium gold sulfite solution A process for producing sodium gold sulfite in solution is described. The sodium gold sulfite solution is useful in gold electroplating baths, and can be used in applications which require pure, soft gold deposits. A process is also described whereby the ... | 10/03/2000 |
| 5863400 | Electrochemical cells An electrochemical cell comprises a porous membrane (8) of electrically insulating composition, the membrane having pores (not illustrated) communicating from one side of the membrane to another, a working electrode (5) disposed on one side and a counter ... | 01/26/1999 |
| 5783313 | Coated Article An article is coated with a multilayer coating comprising a semi-bright nickel layer deposited on the surface of the article, a bright nickel layer deposited on the bright nickel layer, a palladium strike layer deposited on the semi-bright nickel layer, a... | 07/21/1998 |
| 5726075 | Method for fabricating microbump interconnect for bare semiconductor dice A method for forming an interconnect for a bare semiconductor is provided. The interconnect includes an insulating film with a pattern of conductors and microbumps adapted to make an electrical connection with contact locations on the die. The insulating ... | 03/10/1998 |
| 5580437 | Anode useful for electrochemical conversion of anhydrous hydrogen halide to halogen gas A particular anode comprising an electrochemically active material selected from the group consisting of the oxides of the elements tin, germanium and lead and mixtures comprising at least one of the respective oxides of such elements is useful in an elec... | 12/03/1996 |
| 5391285 | Adjustable plating cell for uniform bump plating of semiconductor wafers An apparatus plates metal bumps of uniform height on one surface of a semiconductor wafer (32). A plating tank (12) contains the plating solution. The plating solution is filtered (16) and pumped (14) through an inlet (22) to an anode plate (24) within pl... | 02/21/1995 |
| 5384026 | Method for gold plating a metallic surface A compact, hand portable, mobile electroplating unit provided with wheels, a seat for the user, and all of the chemical solutions and applicator equipment, including a D.C. power source, required to electroplate a metallic film on a metallic surface.... | 01/24/1995 |
| 5318687 | Low stress electrodeposition of gold for X-ray mask fabrication An electrodeposition process for producing gold masks for X-ray lithography of integrated circuits is disclosed. The process produces a gold layer of tightly controlled grain size and arsenic content which results in minimum stress in the gold film and th... | 06/07/1994 |
| 5302278 | Cyanide-free plating solutions for monovalent metals A solution for use in electroplating which comprises at least one monovalent metal such as copper, silver or gold which is complexed by a thiosulfate ion; and a stabilizer of an organic sulfinate compound such as, for example, one having the formula R-SO | 04/12/1994 |
| 5277790 | Non-cyanide electroplating solution for gold or alloys thereof Disclosed are cyanide free electroplating solutions for gold or alloys thereof; said solutions comprising gold in the form of a soluble sulfite complex, an added source of sulfite and/or bisulfite ion and a supporting electrolyte; and said solutions furth... | 01/11/1994 |
| 5266183 | Method for plating an x-ray mask A method for making an x-ray mask having a low-stress absorber layer. A substrate is placed in an electroplating system and an electroplating solution is provided to the electroplating system. The electroplating solution has a gold sulfite based component... | 11/30/1993 |
| 5176811 | Gold plating bath additives for copper circuitization on polyimide printed circuit boards Disclosed is a method of fabricating a microelectronic package, especially a microelectronic package having gold plated copper circuitization on a polyimide substrate. The method includes the steps of forming a pattern of copper circuitization on the sele... | 01/05/1993 |
| 5085744 | Electroplated gold-copper-zinc alloys A solution for electroplating gold-copper-zinc alloys. A solution containing excess cyanide and hydroxide ions, gold and copper each in the form of a cyanide complex, and zinc at least partially in the form of a zincate complex. Additives such as conducti... | 02/04/1992 |
| 5080763 | Method of forming conductor lines of a semiconductor device A method of forming conductor lines of a semiconductor device comprises a step of depositing (electroplating) a gold (Au) layer on an underlying barrier conductive layer in a gold plating bath. According to the present invention, the plating bath is suppl... | 01/14/1992 |
| 4962004 | Method of inhibiting electrochemical reduction of polyimide during electroplating and articles formed thereby A method of inhibiting degradation of the metal-polyimide bond of a metal-polyimide composite due to electrochemical reduction of the polyimide while electroplating wherein the electroplating process is carried out in an ammonium ions-based plating soluti... | 10/09/1990 |
