Class 205/265 - Palladium

Subclass of Class 205 - Electrolysis: processes, compositions used therein, and methods of preparing the compositions
Definition: Subject matter wherein the single platinum group metal consists
No. of patents: 81
Last issue date: 02/15/2011

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Number	Title	Issue Date
7887692	Palladium plating solution The invention provides a plating solution capable of forming a palladium plating film which can further improve solder characteristics in surface treatment of a composition made of a nickel plating film, a palladium plating film and a gold plating film on a surface ...	02/15/2011
7215014	Solderable metal finish for integrated circuit package leads and method for forming A packaged integrated circuit includes a die surrounded by an encapsulant in which leads are used to electrically connect the die, which is internal to the encapsulant, externally. The leads have a primary metal that is used for electrical conduction and physical su...	05/08/2007
7087315	Method for forming plating film A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th...	08/08/2006
7022210	Locally-distributed electrode and method of fabrication A locally distributed electrode is made by placing a conducting metallic oxide layer and a counter electrode in contact with a noble metal electroplating solution and applying a negative potential to the metallic oxide layer relative to the counter electrode, such t...	04/04/2006
7011738	Activation of a cathode The present invention relates to a method for activation of a cathode comprising at least a cathode substrate wherein the cathode is cleaned by means of an acid, the cleaned cathode is coated with at least one electrocatalytic coating solution, drying the coated cat...	03/14/2006
6974636	Protective coating for turbine engine component A turbine engine component comprising a substrate made of a nickel-base or cobalt-base superalloy and a protective coating overlying the substrate, the coating formed by electroplating at least two platinum group metals selected from the group consisting of platinum...	12/13/2005
6911068	Plating bath and method for depositing a metal layer on a substrate A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with resp...	06/28/2005
6852210	Plating method and plating bath precursor used therefor To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing ...	02/08/2005
6811674	Palladium plating solution The present invention provides a palladium plating solution comprising at least 1 to 60 g/L, in terms of the amount of palladium, of a soluble palladium salt and 0.1 to 300 g/L of a sulfamic acid or its salt, the palladium plating solution being substantially free f...	11/02/2004
6773573	Plating bath and method for depositing a metal layer on a substrate A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with resp...	08/10/2004
6743346	Electrolytic solution for electrochemical deposit of palladium or its alloys An aqueous electrolysis bath of acidic pH for the electrochemical deposition of palladium and its alloys, the bath containing a palladium compound and optionally at least one compound of a secondary metal to be co-deposited in the form of an alloy with the palladium...	06/01/2004
6743950	Palladium complex salt and use thereof for adjusting palladium concentration of an electrolytic solution for deposit of palladium or one of its alloys A novel complex salt off palladium sulfate and ethylenediamine contains 31 to 41% by weight of palladium and has a molar ratio [SO4]:[Pd] of between 0.9 and 1.15 and a ratio [ethylenediamine ]:[Pd] of between 0.8 and 1.2. The invention further relates to ...	06/01/2004
6736954	Plating bath and method for depositing a metal layer on a substrate A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of p...	05/18/2004
6620304	Bath system for galvanic deposition of metals A bath system for galvanic deposition of metals includes a solution containing at least one metal, especially a precious metal and/or precious metal alloy in the form of a water-soluble salt, at least one water-soluble protein material or amino acid and/o...	09/16/2003
6596149	Manufacturing method for capacitor having electrode formed by electroplating A capacitor having an electrode formed by electroplating, and a manufacturing method thereof are disclosed. According to an embodiment of the invention, a conductive film is formed on a conductive plug connected to an active region of a semiconductor subs...	07/22/2003
6346222	Process for synthesizing a palladium replenisher for electroplating baths This invention provides a process of making a palladium replenisher comprising a complex of palladium tetraammine sulfate. The process includes distilling a palladium nitrate solution at a temperature maintained at or below about 115° C. Palladium sulfat...	02/12/2002
6344125	Pattern-sensitive electrolytic metal plating A process for the electrolytic deposition of a metal, preferably copper or an alloy of copper, directly onto a barrier layer coated on a dielectric layer. The process is advantageous because it electrolytically deposits metal in a pattern that is either t...	02/05/2002
6336962	Method and solution for producing gold coating The present invention describes a method of producing gold coating on a workpiece having a palladium surface, having the steps of: a) making an aqueous solution containing at least one compound selected from the group of compounds containing gold(I) and gold(I...	01/08/2002
6323128	Method for forming Co-W-P-Au films A method for forming a quaternary alloy film of Co--W--P--Au for use as a diffusion barrier layer on a copper interconnect in a semiconductor structure and devices formed incorporating such film are disclosed. In the method, a substrate that has copper co...	11/27/2001
6251249	Precious metal deposition composition and process Formulations and procedures for the deposition of precious metals onto solid substrates are disclosed wherein the formulations are iodide-free and contain an organosulfur compound and/or a carboxylic acid and a source of soluble precious metal ion which i...	06/26/2001
6203936	Lightweight metal bipolar plates and methods for making the same Thin, light weight bipolar plates for use in electrochemical cells are rapidly, and inexpensively manufactured in mass production by die casting, stamping or other well known methods for fabricating magnesium or aluminum parts. The use of a light metal, s...	03/20/2001
6183545	Aqueous solutions for obtaining metals by reductive deposition An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1) ##STR1## in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydr...	02/06/2001
6159623	Palladium plating solution, palladium plating film formed using the solution and lead frame for semiconductor apparatuses having the palladium plating film A palladium plating film having excellent soldering characteristics, including excellent solder wettability, high solder wetting speed, and especially the maintenance of these characteristics in a high-temperature atmosphere, is produced by using a pallad...	12/12/2000
6143159	Electrochemical autothermal reformer An electrochemical autothermal reformer (EATR) provides hydrogen. The EATR includes an autothermal reformer region, a reformer anode supply region, and a composite membrane layer separating the reformer anode from the autothermal reformer region. The comp...	11/07/2000
6143431	Production of Palladium-103 Palladium-103 radiochemical of high radionuclidic purity can be produced in commercial scale quantities by irradiating enriched Palladium targets comprising a mixture of Pd isotopes with protons or deuterons in the 10-50 MeV energy range. Commercially via...	11/07/2000
6139977	Palladium surface coating suitable for wirebonding and process for forming palladium surface coatings A surface finish which provides improved wirebonding performance for integrated circuit packages is disclosed. The surface finish which is formed on a substrate includes a palladium layer and one or more material layers. The one or more material layers ar...	10/31/2000
5976344	Composition for electroplating palladium alloys and electroplating process using that composition An aqueous electroplating bath for the electrodeposition of palladium alloys in a mixed ligand system. A first ligand operates to form a complex of palladium and a second ligand functions to form a complex of another metal which brings the plating potenti...	11/02/1999
5948222	Reactivation of deactivated anodes Disclosed is a method of reactivating a deactivated anode that has a coating of a noble metal or noble metal oxide on a substrate. A coating of a noble metal is deposited on the anode either electrolessly or electrolytically. The noble metal in the deposi...	09/07/1999
5726075	Method for fabricating microbump interconnect for bare semiconductor dice A method for forming an interconnect for a bare semiconductor is provided. The interconnect includes an insulating film with a pattern of conductors and microbumps adapted to make an electrical connection with contact locations on the die. The insulating ...	03/10/1998
5660708	Process for manufacturing a lead frame It is an object of this invention to provide a process for manufacturing a lead frame by polishing a blank for a lead frame electrolytically and plating the electrolytically polished surface of the blank with a metal, which process enables the electrolyti...	08/26/1997
5580437	Anode useful for electrochemical conversion of anhydrous hydrogen halide to halogen gas A particular anode comprising an electrochemically active material selected from the group consisting of the oxides of the elements tin, germanium and lead and mixtures comprising at least one of the respective oxides of such elements is useful in an elec...	12/03/1996
5415685	Electroplating bath and process for white palladium The present invention relates to an improved metallic additive free palladium electroplating bath comprising the use of a sulfonic acid compound in combination with a special class of pyridine related nitrogen compounds to both stabilize the bath and to p...	05/16/1995
5217599	Bonding of polyimide film Disclosed is a method for electroplating a metal sheet adapted for being used in electronic packaging material, such as printed circuit boards. Bismaleimide and its derivative are added into the plated solution so as to form insoluble particles of bismale...	06/08/1993
5185073	Method of fabricating nendritic materials A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in ...	02/09/1993
5180482	Thermal annealing of palladium alloys This invention is concerned with production of electrical devices comprising an electrodeposited conductive region free from cracking defects. In the production of a contact portion of the device from a metal strip electroplated with a conductive stripe o...	01/19/1993
5178745	Acidic palladium strike bath This invention is an acid palladium strike bath which improves adhesion and porosity of subsequent platings of palladium or palladium alloys on metal substrates, especially those susceptible to passivation such as nickel, chromium, bronze and steel. The a...	01/12/1993
5149420	Method for plating palladium A method for plating palladium on Group IV-B and V-B metals, particularly niobium, vanadium, zirconium, titanium and tantalum as pure metals and as alloys is described. The method provides the metal to be plated with a roughened exposed surface to be plat...	09/22/1992
4911798	Palladium alloy plating process A process is described for electroplating palladium and palladium alloys. The process involves the use of an alkyl hydroxyamine as complexing agent and is particularly good for palladium alloys such as palladium-nickel and palladium-cobalt....	03/27/1990
4911799	Electrodeposition of palladium films A process for electroplating palladium containing deposits from baths comprising a combination of a surfactant and a brightener combination. The surfactant is an alkyl, ammonium-type salt containing 4 to 35 carbon atoms. The brightener is 0-benzaldehydesu...	03/27/1990
4867850	Thermal detectors and process for manufacturing the same Thermal detectors comprising at least one pair of membrane electrodes formed on a base material (such a pyroelectric, semiconductive and insulating materials), wherein at least one member of said pair of electrodes is covered with a black membrane of prec...	09/19/1989

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Class 205/265 - Palladium