Did You Know...
...that Robert Adler has the dubious distinction of being the Father of the Couch Potato? Back in 1955 Adler was employed by what was then Zenith Radio Corp., where he was charged to invent something that would allow viewers to turn down the TV volume without leaving their chairs. After a series of flops (such as a wired contraption that people tripped over), Adler hit on the idea of using sound waves. Thus the Remote Control was born...
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| Number | Title | Issue Date |
| 7402232 | Silver electroplating solution A silver electroplating solution containing a cyanide as a silver source, said silver electroplating solution characterized by containing at least one type of compound of As, Tl, Se, and Te as a brightener and a brightness adjuster having a benzothiazole skeleton or... | 07/22/2008 |
| 7291201 | Method for making nano-scale lead-free solder A method for making Nano-scale lead-free solder includes the following steps of: forming a mixture solution Sn-Ag or Sn-Ag-Cu; making NaBH4, NaOH and alkyl C12H25OSO3Na to a reducing dispersing solution; producing reactant... | 11/06/2007 |
| 7267259 | Method for enhancing the solderability of a surface A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty a... | 09/11/2007 |
| 7235165 | Electroplating solution and method for electroplating An electroplating solution may be formulated as an aqueous solution of oxalic acid, trisodium phosphate and ammonium sulfate. Such solutions may be used for both brush plating and bath plating, and are suitable for use with a variety of plating metals and substrate ... | 06/26/2007 |
| 7087315 | Method for forming plating film A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th... | 08/08/2006 |
| 7064065 | Silver under-layers for electroless cobalt alloys In one embodiment, a method for depositing a capping layer on a substrate surface containing a copper layer is provided which includes exposing the substrate surface to a zinc solution, exposing the substrate surface to a silver solution to form a silver layer there... | 06/20/2006 |
| 7037357 | Recovery of metals from jarosite-containing materials A method to dissolve at least one metal from jarosite or other iron hydroxyl sulphate containing-material which includes the steps of subjecting the material to alkaline treatment in a brine solution to facilitate jarosite decomposition, and acidification of the bri... | 05/02/2006 |
| 7022169 | Electroless gold plating solution An electroless gold plating solution is provided that contains no cyanide compound as a source of gold and that contains a decomposition inhibitor represented by general formula (1), provided that, in a case in which the solution contains a gold complex of sulfite a... | 04/04/2006 |
| 7011738 | Activation of a cathode The present invention relates to a method for activation of a cathode comprising at least a cathode substrate wherein the cathode is cleaned by means of an acid, the cleaned cathode is coated with at least one electrocatalytic coating solution, drying the coated cat... | 03/14/2006 |
| 6875330 | Process for coating workpieces with bearing metal A process is provided for coating metallic workpieces with a bearing material, wherein the workpiece first receives a hard chromium plating having a pearl or columnar structure type surface. A predominantly silver layer is then galvanically deposited, which fills in... | 04/05/2005 |
| 6863991 | Coated biperiodic metallic mesh arrays with molecular monolayers and lipid bilayers thereon A coated metallic mesh having a molecular layer thereon comprising: (1) a metallic mesh comprising at least one aperture; (2) a coating disposed on the metallic mesh that at least partially fills at least one aperture so as to form a partially-filled aperture; and (... | 03/08/2005 |
| 6852210 | Plating method and plating bath precursor used therefor To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing ... | 02/08/2005 |
| 6797405 | Method for uniform electrochemical reduction of apertures to micron and submicron dimensions using commercial biperiodic metallic mesh arrays and devices derived therefrom A method for electrodepositing a uniformly thick coating on a metallic mesh is provided, the method comprises the steps of: (1) providing a metallic mesh having a plurality of apertures having at least one dimension greater than nanometer scale sizes; (2) subjecting... | 09/28/2004 |
| 6793798 | Radioactively coated devices This invention relates to radioactively coated devices, preferably radioactively coated medical devices. These coated devices are characterized as having a low rate of leaching of the radioisotope from the surface of the coated device and a uniform radioactive coati... | 09/21/2004 |
| 6773573 | Plating bath and method for depositing a metal layer on a substrate A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with resp... | 08/10/2004 |
| 6773568 | Metal alloy compositions and plating methods related thereto The present invention provides inter alia electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer addit... | 08/10/2004 |
| 6736954 | Plating bath and method for depositing a metal layer on a substrate A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of p... | 05/18/2004 |
| 6620304 | Bath system for galvanic deposition of metals A bath system for galvanic deposition of metals includes a solution containing at least one metal, especially a precious metal and/or precious metal alloy in the form of a water-soluble salt, at least one water-soluble protein material or amino acid and/o... | 09/16/2003 |
| 6544397 | Method for enhancing the solderability of a surface A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting... | 04/08/2003 |
| 6533161 | Process for producing a gas-tight soldered joint and use of the process in the production of components with a vacuum-tight casing In order to simplify the soldering process in the production of a vacuum-tight soldered joint between a ceramic component and a copper component, a layer of silver is first applied galvanically to the copper component to form the soldering material togeth... | 03/18/2003 |
| 6387243 | Separation of metal ions absorbed on a resin and installation for recycling photographic effluents including an exchanger and an electrolytic vessel A method for separating metal ions absorbed on a resin includes: suspending or percolating a cationic exchange resin charged with a polar solvent containing an eluting agent or a mixture of eluting agents containing at least an organic or mineral ligand c... | 05/14/2002 |
| 6375822 | Method for enhancing the solderability of a surface A process for enhancing the solderability of a surface, particularly copper surfaces upon printed circuit boards, is disclosed. The surface is plated using a silver plating solution. The plated surface is then further treated with a solution that comprise... | 04/23/2002 |
| 6344125 | Pattern-sensitive electrolytic metal plating A process for the electrolytic deposition of a metal, preferably copper or an alloy of copper, directly onto a barrier layer coated on a dielectric layer. The process is advantageous because it electrolytically deposits metal in a pattern that is either t... | 02/05/2002 |
| 6299754 | PH sensitive reference electrode in electrolytic desilvering An apparatus is disclosed for electrolytic desilvering of photographic processing solutions, more particularly fixing solutions or bleach-fixing solutions, comprising an electrolysis unit equiped with a monitoring system comprising a cathode, an anode and... | 10/09/2001 |
| 6287445 | Coating particles in a centrifugal bed An apparatus and method are provided for coating particles in a rotating container. A cathode forms an electrically conductive inner surface of a side wall of the container. An anode is positioned relative to the cathode so as to permit both the cathode a... | 09/11/2001 |
| 6258241 | Process for electroplating metals A process for electroplating metal on a resistive substrate and the article of manufacture produced therefrom are disclosed. The metal layer is electroplated onto the resistive substrate in an electroplating bath having a polarization parameter .xi. less ... | 07/10/2001 |
| 6251249 | Precious metal deposition composition and process Formulations and procedures for the deposition of precious metals onto solid substrates are disclosed wherein the formulations are iodide-free and contain an organosulfur compound and/or a carboxylic acid and a source of soluble precious metal ion which i... | 06/26/2001 |
| 6187167 | Recovery of metal from solution Recovery of silver from a photographic fixer solution in an electrolytic cell is controlled so as to maintain a high current efficiency whilst minimizing unwanted side effects. The rate of change of plating voltage at constant current through the cell is ... | 02/13/2001 |
| 6183545 | Aqueous solutions for obtaining metals by reductive deposition An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1) ##STR1## in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydr... | 02/06/2001 |
| 6033866 | Highly sensitive amperometric bi-mediator-based glucose biosensor A highly sensitive sensor for the amperometric assay of glucose in aqueous media having a face-to-face sandwich configuration is provided which comprises a sensing electrode strip containing a first redox mediator in an electrically conductive coating and... | 03/07/2000 |
| 6027862 | Method of applying a silver layer to a glass substrate A description is given of a method of providing an adhesive silver layer on a glass substrate, in which method the glass surface is activated, whereafter a first silver layer is provided from an electroless silver bath and reinforced by means of a second ... | 02/22/2000 |
| 5944978 | Cleaning method of an electrolyzed water forming apparatus and an electrolyzed water forming apparatus having mechanism for conducting the method Chlorine ion-containing water supplied from one of water discharge pipelines of an electrolysis vessel of an apparatus for continuously forming electrolyzed water is caused to flow backwardly to one of electrode chambers and a water supply branch pipe the... | 08/31/1999 |
| 5876952 | Non-invasive glucose biosensor: determination of glucose in urine An amperometric glucose biosensor having high sensitivity and accuracy over a wide range of glucose concentrations and a method for the rapid detection of glucose in urine are provided. The biosensor strip comprises an electrically conductive carbon layer... | 03/02/1999 |
| 5853557 | Low friction, ductile, multilayer electrodeposits The present invention relates to composite articles including a surface layer of tin, lead, silver or an alloy thereof that contains co-deposited non-ionic polymeric particles to provide a reduced-friction deposit that has an initially low coefficient of ... | 12/29/1998 |
| 5665219 | Process for continuous manufacture of an electrical conductor made of copper-plated and tin-plated aluminum Process for continuous manufacture of an electrical conductor consisting of an at least partially aluminium-based central core coated by continuous electrodeposition with at least one metal layer, including pretreatment of the surface of the core, charact... | 09/09/1997 |
| 5660708 | Process for manufacturing a lead frame It is an object of this invention to provide a process for manufacturing a lead frame by polishing a blank for a lead frame electrolytically and plating the electrolytically polished surface of the blank with a metal, which process enables the electrolyti... | 08/26/1997 |
| 5601696 | Silver plating baths and silver plating method using the same An object is to provide practical silver plating technique, high-speed silver plating technique and silver strike plating technique which have, respectively, substantially the same performance as cyanide baths without use of any toxic cyanide. A hydantoin... | 02/11/1997 |
| 5434035 | Fixer additives used in combination with iron complex based bleaches to improve desilvering A method of treating a seasoned fixing solution comprising desilvering a fixing solution containing a chelating compound represented by Formula I MOOC(CH2)m(X)p((CH2)n COOM)q (I) where X is N, or C--OH; n and m ... | 07/18/1995 |
| 5387441 | Metal-ceramic joint A process is described for electrolessly depositing or electrodepositing a solder layer composed of copper and silver and having an overall composition of silver/copper of from 75:25 to 70:30 and a total layer thickness of 15 to 100 μm on a metallized ce... | 02/07/1995 |
| 5302278 | Cyanide-free plating solutions for monovalent metals A solution for use in electroplating which comprises at least one monovalent metal such as copper, silver or gold which is complexed by a thiosulfate ion; and a stabilizer of an organic sulfinate compound such as, for example, one having the formula R-SO | 04/12/1994 |
