Did You Know...
...that two musicians were responsible for the invention of color print film? Fascinated by photography, Leopold Godowsky and Leopold Mannes worked together to produce an easy-to-use, practical color film. They worked full time as music teachers and gave concerts while experimenting during their off hours in Mannes' kitchen. Their success earned them full-time, well-paying jobs at Kodak and their efforts resulted in Kodachrome film, which was introduced in 1935.
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| Number | Title | Issue Date |
| 7951280 | Gallium electroplating methods and electrolytes employing mixed solvents An electrochemical deposition method and electrolyte to plate uniform, defect free and smooth gallium films are provided. In a preferred embodiment, the electrolyte may include a solvent that comprises water and at least one monohydroxyl alcohol, a gallium salt, and... | 05/31/2011 |
| 7767072 | Method of forming yttrium-modified platinum aluminide diffusion coating A method for forming a modified platinum aluminide coating on a turbine engine component surface includes the step of forming a platinum layer on the turbine engine component surface. A bath is then prepared, including a mixture of a primary alcohol and a tertiary a... | 08/03/2010 |
| 7507321 | Efficient gallium thin film electroplating methods and chemistries The present invention relates to gallium (Ga) electroplating methods and chemistries to deposit uniform, defect free and smooth Ga films with high plating efficiency and repeatability. Such layers may be used in fabrication of electronic devices such as thin film so... | 03/24/2009 |
| 7399423 | Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the me... | 07/15/2008 |
| 7335288 | Methods for depositing copper on a noble metal layer of a work piece Methods for electrodeposition of copper on a noble metal layer of a work piece are provided. An exemplary method includes exposing the noble metal layer to an electrodeposition composition. The electrodeposition composition comprises a copper salt, a suppressor, an ... | 02/26/2008 |
| 7326327 | Rhodium electroplated structures and methods of making same A halide based stress reducing agent is added to the bath of a rhodium plating solution. The stress reducing agent reduces stress in the plated rhodium, increasing the thickness of the rhodium that can be plated without cracking. In addition, the stress reducing age... | 02/05/2008 |
| 7297247 | Electroformed sputtering target A method of fabricating a sputtering target for sputter depositing material onto a substrate in a sputtering chamber is described. In one embodiment of the method, a preform having a surface is formed and a layer of sputtering material is electroplated onto the surf... | 11/20/2007 |
| 7282445 | Multiple seed layers for interconnects One embodiment of the present invention is a method for depositing two or more seed layers over a substrate, the substrate includes a patterned insulating layer which comprises at least one opening surrounded by a field, the at least one opening and the field being ... | 10/16/2007 |
| 7241396 | Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the me... | 07/10/2007 |
| 7239747 | Method and system for locating position in printed texts and delivering multimedia information Apparatus and methods are disclosed for processing printed material to provide an index of locations within the printed material that can be associated with external actions such as displaying a graphical image, providing an audio or video output, or providing a mul... | 07/03/2007 |
| 7235165 | Electroplating solution and method for electroplating An electroplating solution may be formulated as an aqueous solution of oxalic acid, trisodium phosphate and ammonium sulfate. Such solutions may be used for both brush plating and bath plating, and are suitable for use with a variety of plating metals and substrate ... | 06/26/2007 |
| 7199052 | Seed layers for metallic interconnects One embodiment of the present invention is a method for making copper or a copper alloy interconnects, which method includes: (a) forming a patterned insulating layer over a substrate, the patterned insulating layer including at least one opening and a field surroun... | 04/03/2007 |
| 7192509 | Process for producing a metal structure in foam form, a metal foam, and an arrangement having a carrier substrate and a metal foam Process for producing a metal structure in foam form, including the steps of providing a nonconductive substrate having a foamed structure, applying conductive particles to the substrate, so that the conductive particles are fixed to the entire surface of the substr... | 03/20/2007 |
| 7182849 | ECP polymer additives and method for reducing overburden and defects Electrochemical plating polymer additives and method which reduces metal overburden in an electroplated metal while optimizing gap fill capability are disclosed. The polymer additives are provided in an electrochemical plating bath solution and may include low catio... | 02/27/2007 |
| 7112287 | Thin film supporting substrate for used in filter for hydrogen production filter and method for manufacturing filter for hydrogen production In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the me... | 09/26/2006 |
| 7105082 | Composition and method for electrodeposition of metal on a work piece A composition for electrodeposition of a metal on a work piece, which electrodeposition is conducted at an electrodeposition temperature, is provided. The composition comprises a metal salt, a polymer suppressor having a cloud point, an accelerator and an electrolyt... | 09/12/2006 |
| 7105434 | Advanced seed layery for metallic interconnects One embodiment of the present invention is a method for making metallic interconnects, which method is utilized at a stage of processing a substrate having a patterned insulating layer which includes at least one opening and a field surrounding the at least one open... | 09/12/2006 |
| 7097755 | Electrochemical mechanical processing with advancible sweeper The present invention provides an apparatus for electrochemical mechanical processing of a surface of a workpiece by utilizing a process solution. The apparatus of the present invention includes an electrode touching the process solution, a belt workpiece surface in... | 08/29/2006 |
| 7087315 | Method for forming plating film A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th... | 08/08/2006 |
| 6974531 | Method for electroplating on resistive substrates A conductive material is electroplated onto a platable resistive metal barrier layer(s) employing a plating bath optionally comprising a super filling additive and a suppressor, and by changing the current or voltage as a function of the area of plated metal. A stru... | 12/13/2005 |
| 6932892 | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece A process for applying a metallization interconnect as to a semiconductor workpiece having a barrier layer deposited on a surface thereof is set forth. The process includes the forming of an ultra-thin metal seed layer on the barrier layer. The ultra-thin seed layer... | 08/23/2005 |
| 6919013 | Apparatus and method for electrolytically depositing copper on a workpiece A process for applying a metallization interconnect structure to a semiconductor workpiece having a barrier layer deposited on a surface thereof is set forth. The process includes the forming of an ultra-thin metal seed layer on the barrier layer. The ultra-thin see... | 07/19/2005 |
| 6916412 | Adaptable electrochemical processing chamber An electrochemical processing chamber which can be modified for treating different workpieces and methods for so modifying electrochemical processing chambers. In one particular embodiment, an electrochemical processing chamber 200 includes a plurality of wal... | 07/12/2005 |
| 6913680 | Method of application of electrical biasing to enhance metal deposition A method and associated apparatus includes depositing metal on a plating surface of an object immersed in an electrolyte solution prior to bulk deposition on the plating surface. In one aspect, the method further includes applying a voltage between an anode and the ... | 07/05/2005 |
| 6911068 | Plating bath and method for depositing a metal layer on a substrate A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with resp... | 06/28/2005 |
| 6890416 | Copper electroplating method and apparatus An electroplating apparatus prevents anode-mediated degradation of electrolyte additives by creating a mechanism for maintaining separate anolyte and catholyte and preventing mixing thereof within a plating chamber. The separation is accomplished by interposing a po... | 05/10/2005 |
| 6884335 | Electroplating using DC current interruption and variable rotation rate A negative bias is applied to an integrated circuit wafer immersed in an electrolytic plating solution to generate a DC current. After about ten percent to sixty percent of the final layer thickness has formed in a first plating time, biasing is interrupted during s... | 04/26/2005 |
| 6878411 | Bath for the electrochemical deposition of high-gloss white rhodium coatings and whitening agent for the same The invention concerns a bath for the electrochemical deposition of high-gloss white rhodium coatings and a whitening agent for the same. The brightness or degree of whiteness of the deposited coatings is significantly increased by means of compounds having the form... | 04/12/2005 |
| 6825512 | Micromachined sensor with insulating protection of connections An active part of a sensor is formed, for example, by micro-machined silicon wafers bearing electronic elements, electrical conductors, connection pads, and pins. The pads are electrically connected to the pin ends by conductive elements. Then the wafer and the pin ... | 11/30/2004 |
| 6818116 | Additive-assisted cerium-based electrolytic coating process for corrosion protection of aluminum alloys The corrosion resistance of an aluminum or aluminum alloy component is enhanced by immersing an aluminum alloy to act as a cathode and an oxygen-evolving anode in an electrolyte comprising water, cerium ions, and an additive selected from among animal gelatin, deriv... | 11/16/2004 |
| 6790336 | Method of fabricating damascene structures in mechanically weak interlayer dielectrics A copper damascene process for a mechanically weak low k dielectric layer is described. Electropolishing is used to etch back the copper. A sacrificial conductive layer beneath the barrier layer assures complete planarization of the copper. ... | 09/14/2004 |
| 6773573 | Plating bath and method for depositing a metal layer on a substrate A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with resp... | 08/10/2004 |
| 6736954 | Plating bath and method for depositing a metal layer on a substrate A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of p... | 05/18/2004 |
| 6638041 | Water based hydraulic fluid and hydraulic pressure device A subject of the present invention is to provide a water based hydraulic fluid and a hydraulic pressure device able to prevent burning and wearing in a sliding portion of a member constructed by an iron-based material as much as possible. Therefore, the w... | 10/28/2003 |
| 6620304 | Bath system for galvanic deposition of metals A bath system for galvanic deposition of metals includes a solution containing at least one metal, especially a precious metal and/or precious metal alloy in the form of a water-soluble salt, at least one water-soluble protein material or amino acid and/o... | 09/16/2003 |
| 6610191 | Electro deposition chemistry The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed ... | 08/26/2003 |
| 6589602 | Highly adhesive surface-coated cemented carbide and method for producing the same The present invention is to provide a highly adhesive surface-coated cemented carbide which comprises a cemented carbide base material and a hard film formed on a surface of the base material, characterized in that both of the hard film at a proximate por... | 07/08/2003 |
| 6582582 | Electroplating composition and process An electroplating bath is disclosed that is particularly suited to the electrodeposition of tin, zinc and alloys of the foregoing in a smooth and bright electrodeposit. The disclosed electroplating bath comprises propanedioic acid, diethyl ester, polymer ... | 06/24/2003 |
| 6576110 | Coated anode apparatus and associated method An anode is configured to be used within a metal film plating apparatus. The anode has a substantially planar electric field generating portion and an electrolyte solution chemical reaction portion. The planar electric field generating portion is coated w... | 06/10/2003 |
| 6521113 | Method of improving the oxidation resistance of a platinum modified aluminide diffusion coating An electrolyte for use in electrolytic platinum plating that results in reduced Cl, S, or P contaminant production. The bath comprises 0.01 to 320 g/lit of platinum in the form of the platinum salt dinitrodiammine platinum, Pt(NH3)2 ... | 02/18/2003 |
