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| Number | Title | Issue Date |
| 7357853 | Electroplating composite substrates An electrolyte employed to selectively deposit a tin or tin alloy film on a composite substrate. A method for depositing the tin or tin alloy on the composite substrate also is described. ... | 04/15/2008 |
| 7314543 | Tin deposition A device includes an integrated circuit and a deposited tin in electrical contact with a portion of the integrated circuit. The deposited tin is formed by electrodeposition from a bath. The deposited tin includes a residue characteristic of the bath. The bath includ... | 01/01/2008 |
| 7309411 | Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys An electroplating bath medium for electroplating articles with a tin-cobalt, tin-nickel, or tin-cobalt-nickel alloy comprises: at least one tin salt; an alloying metal salt comprising a cobalt salt and/or a nickel salt; a complexant comprising a hydroxycarboxylic ac... | 12/18/2007 |
| 7285622 | Releasable linkage and compositions containing same A compound comprised of a hydrophilic polymer covalently yet reversibly linked to a amine-containing ligand through a dithiobenzyl linkage is described. ... | 10/23/2007 |
| 7276248 | Conjugate having a cleavable linkage for use in a liposome Conjugates of a hydrophobic moiety, such as a lipid, linked through a cleavable dithiobenzyl linkage to a therapeutic agent are described. The dithiobenzyl linkage is susceptible to cleavage by mild thiolysis, resulting in release of the therapeutic agent in its ori... | 10/02/2007 |
| 7273540 | Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film An electrolytic plating method, including: preparing a plating solution including water which is a primary medium, a sulfonic acid, and tin, copper, and silver ions, and a complexing agent, concentrations of the sulfonic acid, and tin, copper, and silver ions being ... | 09/25/2007 |
| 7271211 | Dispersions containing fatty acid esters of styrenated phenol alkoxylates The present invention provides a dispersant for aqueous and non-aqueous systems which can disperse insoluble fine powders in non-aqueous liquids in a short period of time and give long-term dispersion stability to the resulting dispersions without allowing the forma... | 09/18/2007 |
| 7239747 | Method and system for locating position in printed texts and delivering multimedia information Apparatus and methods are disclosed for processing printed material to provide an index of locations within the printed material that can be associated with external actions such as displaying a graphical image, providing an audio or video output, or providing a mul... | 07/03/2007 |
| 7238368 | Releasable linkage and compositions containing same A conjugate comprised of a hydrophilic polymer covalently yet reversibly linked to a amine-, hydroxy- or carboxyl-containing ligand is described. The resulting conjugate is capable of releasing the parent amine, hydroxy, or carboxyl-containing compound via thiol-med... | 07/03/2007 |
| 7205352 | Dispersions containing fatty acid esters of styrenated phenol alkoxylates The present invention provides a dispersant for aqueous and non-aqueous systems which can disperse insoluble fine powders in non-aqueous liquids in a short period of time and give long-term dispersion stability to the resulting dispersions without allowing the forma... | 04/17/2007 |
| 7195702 | Tin alloy electroplating system Disclosed are systems and methods of plating a tin alloy in an efficient, economical, and environmentally friendly manner. An electrochemical cell containing an anolyte compartment and a catholyte compartment separated by a selective membrane is employed. The select... | 03/27/2007 |
| 7122108 | Tin-silver electrolyte A tin-silver electrolyte and methods of depositing tin-silver alloys on a substrate. ... | 10/17/2006 |
| 7063735 | Coating composition A coating composition comprising an aqueous mixture containing inorganic particles, a catechol compound, and one or more fluoroacids. The preferred fluoroacids are selected from fluorotitanic acid, fluorozirconic acid, fluorosilicic acid, fluoroboric acid, fluorosta... | 06/20/2006 |
| 7037559 | Immersion plating and plated structures A first metal is plated onto a substrate comprising a second metal by immersing the substrate into a bath comprising a compound of the first metal and an organic diluent. The second metal is more electropositive than the first metal. The organic diluent has a boilin... | 05/02/2006 |
| 6923899 | Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions Provided for is a solution for use in the electroplating of tin and tin alloys comprising a basis solution comprising an acid, optionally a salt thereof, the acid selected from the group consisting of fluoboric acid, an organic sulfonic acid, a mineral acid, or a co... | 08/02/2005 |
| 6849270 | Releasable linkage and compositions containing same A compound comprised of a hydrophilic polymer covalently yet reversibly linked to a amine-containing ligand through a dithiobenzyl linkage is described. ... | 02/01/2005 |
| 6790333 | Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied The present invention relates to a to-be-mounted electronic component to which functional alloy plating using a bonding material for mounting is applied with a substitute bonding material for solder (tin-lead alloy), and aims at providing alloy plating which has bee... | 09/14/2004 |
| 6730209 | Solder electroplating bath including brighteners having reduced volatility In accordance with the invention, the volatility of a solder plating bath with volatile brighteners such as aldehydes has its volatility reduced by the addition of diols to the bath. The diols are advantageously 1,3 propanediol or 1,2 propanediol and are accompanied... | 05/04/2004 |
| 6605299 | Releasable linkage and compositions containing same A compound comprised of a hydrophilic polymer covalently yet reversibly linked to a amine-containing ligand through a dithiobenzyl linkage is described.... | 08/12/2003 |
| 6582582 | Electroplating composition and process An electroplating bath is disclosed that is particularly suited to the electrodeposition of tin, zinc and alloys of the foregoing in a smooth and bright electrodeposit. The disclosed electroplating bath comprises propanedioic acid, diethyl ester, polymer ... | 06/24/2003 |
| 6562221 | Process and composition for high speed plating of tin and tin alloys A composition and process for electroplating tin or tin alloys onto a substrate at relatively high current densities. The electrolyte comprises toluene sulfonic acid and a source of ammonium ions and/or magnesium ions. The process is particularly suited t... | 05/13/2003 |
| 6562220 | Metal alloy sulfate electroplating baths The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful c... | 05/13/2003 |
| 6508927 | Tin-copper alloy electroplating bath A tin-copper alloy electroplating bath which comprises a water-soluble tin salt, a water-soluble copper salt, an inorganic or organic acid or a water-soluble salt thereof, and one or more compounds selected from thioamide compounds and thiol compounds. Th... | 01/21/2003 |
| 6458264 | Sn-Cu alloy plating bath An acidic Sn--Cu alloy plating bath composition comprising: (a) Sn2+ ions and Cu2+ ions, (b) at least one acid selected from the group consisting of alkane sulfonic acids, alkanol sulfonic acids, and sulfuric acid, and (c) a thiourea... | 10/01/2002 |
| 6436269 | Plating bath and method for electroplating tin-zinc alloys The present invention relates to an aqueous plating bath for electrodeposition of tin-zinc alloys comprising at least one bath-soluble stannous salt, at least one bath soluble zinc salt, and a quaternary ammonium polymer selected from a ureylene quaternar... | 08/20/2002 |
| 6372117 | Bright tin-copper alloy electroplating solution A tin/copper alloy electroplating solution capable of forming a bright plating film in a wide electric current density range is provided. The electroplating solution is a cyanide-free aqueous solution containing an organosulfonic acid, divalent tin and co... | 04/16/2002 |
| 6365179 | Conjugate having a cleavable linkage for use in a liposome Conjugates of a hydrophobic moiety, such as a lipid, linked through a cleavable dithiobenzyl linkage to a therapeutic agent are described. The dithiobenzyl linkage is susceptible to cleavage by mild thiolysis, resulting in release of the therapeutic agent... | 04/02/2002 |
| 6342244 | Releasable linkage and compositions containing same A compound comprised of a hydrophilic polymer covalently yet reversibly linked to a amine-containing ligand through a dithiobenzyl linkage is described.... | 01/29/2002 |
| 6342148 | Tin electroplating bath An electrolyte bath for plating tin or tin alloy onto metal substrates using a high speed plating process is described. The electrolyte bath contains a stannous alkyl sulfonate and an alkyl sulfonic acid. The bath also contains an organic compound that is... | 01/29/2002 |
| 6337145 | Multilayer material for sliding elements and process for the production thereof A process for the production of sliding elements in which an overlay of lead-tin-copper is applied by electroplating to the prefabricated semi-finished product, and in which a ternary, fluoroborate-free electroplating bath is used without brighteners and ... | 01/08/2002 |
| 6331240 | Tin-indium alloy electroplating solution A tin/indium alloy plating solution not containing any cyanide and serving as a substitute for tin/lead alloy plating is provided. The tin/indium alloy plating solution is a weakly alkaline aqueous solution for tin/indium alloy electroplating, prepared by... | 12/18/2001 |
| 6267863 | Electroplating solution for electroplating lead and lead/tin alloys An electroplating solution for plating bright tin, lead, or tin-lead alloy solder coatings in high speed electroplating applications. The electroplating solution includes an alkane or alkanol sulfonic acid electrolyte, a non-ionic surfactant, a grain refi... | 07/31/2001 |
| 6251253 | Metal alloy sulfate electroplating baths The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful c... | 06/26/2001 |
| 6248228 | Metal alloy halide electroplating baths The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy halide electroplating baths has a number of unexpected benefits including wider useful cu... | 06/19/2001 |
| 6183619 | Metal alloy sulfonic acid electroplating baths The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfonic acid electroplating baths has a number of unexpected benefits including wider us... | 02/06/2001 |
| 6179985 | Metal alloy fluoroborate electroplating baths The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy fluoroborate electroplating baths has a number of unexpected benefits including wider use... | 01/30/2001 |
| 6176996 | Tin alloy plating compositions A tin-based, two-component alloy electroplating composition comprising 20 to 500 g/l of a tin salt, 1 to 100 g/l of a metal salt selected from the group consisting of a zinc, cobalt, bismuth and copper salt, 20 to 200 g/l of methanesulfonic acid, 10 to 30... | 01/23/2001 |
| 6103089 | Multilayer material for sliding elements and process and means for the production thereof A multilayer material is described, whose overlay exhibits improved hardness and improved wear-resistance. The multilayer material includes an overlay, which contains 8-18.5 wt. % tin and 2-16 wt. % copper, the balance being lead, wherein the tin is prese... | 08/15/2000 |
| 6103088 | Process for preparing bismuth compounds The invention provides a process for preparing bismuth compounds, in particular a process for preparing highly concentrated solutions of bismuth methanesulfonate, that are stable to hydrolysis. The preparation takes place from aqueous solutions of bismuth comp... | 08/15/2000 |
| 6099713 | Tin-silver alloy electroplating bath and tin-silver alloy electroplating process Disclosed is a tin-silver alloy electroplating bath containing: (A) stannous salt; (B) silver salt; (C) one kind or two or more kinds of acids selected from the group consisting of sulfuric acid, phosphoric acid, phosphonic acid, hydroxycarboxylic acid, a... | 08/08/2000 |
