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| Number | Title | Issue Date |
| 7431817 | Electroplating solution for gold-tin eutectic alloy The invention relates to an electrolyte used in connection with the deposition of a gold-tin alloy on an electroplatable substrate. This solution generally includes water; stannous and/or stannic tin ions, a complexing agent to render the stannous and/or stannic tin... | 10/07/2008 |
| 7357853 | Electroplating composite substrates An electrolyte employed to selectively deposit a tin or tin alloy film on a composite substrate. A method for depositing the tin or tin alloy on the composite substrate also is described. ... | 04/15/2008 |
| 7348300 | Acetylenic diol ethylene oxide/propylene oxide adducts and processes for their manufacture Disclosed herein are process solutions, which may be aqueous-based, non-aqueous-based, and combinations thereof, that contain at least one alkoxylated acetylenic diol surfactant. In one aspect, the process solution comprises water and an alkoxylated acetylenic diol ... | 03/25/2008 |
| 7323097 | Electroplating method for a semiconductor device An electroplating method calls for immersing a body to be plated in a plating solution containing tin and bismuth to form a tin-bismuth alloy skin layer on surfaces of the body. The plating is carried out such that a solid tin metal and a solid bismuth metal placed ... | 01/29/2008 |
| 7309411 | Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys An electroplating bath medium for electroplating articles with a tin-cobalt, tin-nickel, or tin-cobalt-nickel alloy comprises: at least one tin salt; an alloying metal salt comprising a cobalt salt and/or a nickel salt; a complexant comprising a hydroxycarboxylic ac... | 12/18/2007 |
| 7273540 | Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film An electrolytic plating method, including: preparing a plating solution including water which is a primary medium, a sulfonic acid, and tin, copper, and silver ions, and a complexing agent, concentrations of the sulfonic acid, and tin, copper, and silver ions being ... | 09/25/2007 |
| 7208073 | Media for use in plating electronic components Improvements in methods for plating metal on substrates are obtained by providing media in the plating solution in sizes that are less than 60% to 80% smaller than the average dimension of the substrates to be plated. It is also advantageous for the substrates and m... | 04/24/2007 |
| 7195702 | Tin alloy electroplating system Disclosed are systems and methods of plating a tin alloy in an efficient, economical, and environmentally friendly manner. An electrochemical cell containing an anolyte compartment and a catholyte compartment separated by a selective membrane is employed. The select... | 03/27/2007 |
| RE39476 | Tin electrolyte Disclosed are electrolyte compositions for depositing tin or tin-alloys at various current densities. Also disclosed are methods of plating such tin or tin-alloys on substrates, such as the high speed tin plating of steel. ... | 01/23/2007 |
| 7156904 | Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby An aqueous copper-to-resin bonding layer solution comprising: (a) at least one acid type; (b) tin salt or tin oxide; (c) salt or oxide of at least one type of metal selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cob... | 01/02/2007 |
| 7151049 | Electroplating compositions and methods Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, an acid, a thiourea derivative, and an additive selected from alkanol amines, polyethylene imines, a... | 12/19/2006 |
| 7122108 | Tin-silver electrolyte A tin-silver electrolyte and methods of depositing tin-silver alloys on a substrate. ... | 10/17/2006 |
| 7091129 | Atomic layer deposition using photo-enhanced bond reconfiguration An atomic layer deposition process that reduces defective bonds formed when depositing atomic layers on a substrate or atomic layer when forming an integrated circuit device. As the layers are formed, a substrate or previous layer is exposed to a first reactant. Aft... | 08/15/2006 |
| 7087315 | Method for forming plating film A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th... | 08/08/2006 |
| 7029761 | Bonding layer for bonding resin on copper surface A bonding layer for bonding resin is provided that is formed on a copper surface, and contains an alloy of: (a) copper; (b) tin; and (c) at least one type of metal (third metal) selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromi... | 04/18/2006 |
| 6982030 | Reduction of surface oxidation during electroplating Methods of providing improved metal coatings or metal deposits on a substrate, improvements in plating solutions that are used to provide such metal deposits and articles of the metal-coated substrates. The solderability of the metal coating is enhanced by incorpora... | 01/03/2006 |
| 6911138 | Method for plating electrodes of ceramic chip electronic components A method for plating electrodes of ceramic chip electronic components includes performing electroplating in a plating bath. The plating bath contains tin (II) sulfamate, acting as a tin (II) salt; a complexing agent including at least one selected from the group con... | 06/28/2005 |
| 6902102 | Soldering method and solder joint member In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated ... | 06/07/2005 |
| 6899802 | Method for recycling of plating solutions In the conventional plating process, plating solutions are newly prepared and the plating solutions used previously are dumped as industrial wastes, which is accompanied by environmental loads, effluent costs, costs for purchasing new solutions, and the like, and th... | 05/31/2005 |
| 6884523 | Electronic component and method of manufacturing the same An external terminal of an electronic component is provided with a lead base material and a metal thin film coating a surface of the lead base material, and an average value of a crystal size index is not less than 7, which is defined based on dimensions of a crysta... | 04/26/2005 |
| 6875332 | Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied The present invention relates to a to-be-mounted electronic component to which functional alloy plating using a bonding material for mounting is applied with a substitute bonding material for solder (tin-lead alloy), and aims at providing alloy plating which has bee... | 04/05/2005 |
| 6821681 | Electrochemical cells and an interchangeable electrolyte therefore An interchangeable electrolyte contains an additive that promotes interchangeable use between batteries and electroplating cells by limiting dendritic deposition in battery cells and promoting a smooth finish in an electroplating cell, such that fresh or spent elect... | 11/23/2004 |
| 6811672 | Method for forming plating film and electronic component having plating film formed theron by same method A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th... | 11/02/2004 |
| 6790333 | Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied The present invention relates to a to-be-mounted electronic component to which functional alloy plating using a bonding material for mounting is applied with a substitute bonding material for solder (tin-lead alloy), and aims at providing alloy plating which has bee... | 09/14/2004 |
| 6783653 | Solar selective absorption coatings A new class of solar selective absorption coatings are disclosed. These coatings comprise a structured metallic overlayer such that the overlayer has a sub-micron structure designed to efficiently absorb solar radiation, while retaining low thermal emissivity for in... | 08/31/2004 |
| 6736954 | Plating bath and method for depositing a metal layer on a substrate A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of p... | 05/18/2004 |
| 6726827 | Electroplating solution for high speed plating of tin-bismuth solder In accordance with the present invention, an electroplating solution is provided for electroplating satin bright tin-bismuth alloy solder coatings in high speed electroplating applications. The solution comprises a sulfonic acid electrolyte, a soluble tin compound, ... | 04/27/2004 |
| 6685820 | Method for treating spent tin/lead stripping solution The present invention relates to a method for treating spent tin or tin/lead stripping solution used in the electronic industry, particularly in the manufacture of printed circuit boards or a lead frames. Said method comprises (i) electrolytically reducin... | 02/03/2004 |
| 6677056 | Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the plating film A tin-silver alloy plating film improved in solderability and flex cracking characteristics is provided by producing it by an electroplating process which uses a current having a pulse waveform of a current passing period of not less than 3 ms and not mor... | 01/13/2004 |
| 6669834 | Method for high deposition rate solder electroplating on a microelectronic workpiece The present invention is directed to an improved electroplating method, chemistry, and apparatus for selectively depositing tin/lead solder bumps and other structures at a high deposition rate pursuant to manufacturing a microelectronic device from a work... | 12/30/2003 |
| 6645549 | Process for providing bond enhancement and an etch resist in the fabrication of printed circuit boards A process for providing bond enhancement and an etch resist for a printed circuit board is provided. A sheet comprising at least a layer of copper is immerses in a first immersion tin solution comprising a tin metal and a complexing agent in an acidic med... | 11/11/2003 |
| 6582582 | Electroplating composition and process An electroplating bath is disclosed that is particularly suited to the electrodeposition of tin, zinc and alloys of the foregoing in a smooth and bright electrodeposit. The disclosed electroplating bath comprises propanedioic acid, diethyl ester, polymer ... | 06/24/2003 |
| 6544398 | Non-cyanide-type gold-tin alloy plating bath The present invention provides a non-cyanide-type gold-tin alloy plating bath comprising: (i) at least one water-soluble gold compound, (ii) at least one completing agent for gold, (iii) at least one water-soluble tin compound, and (iv) at least one compo... | 04/08/2003 |
| 6537683 | Stratified composite material for sliding elements and method for the production thereof A method is described for producing composite multilayer materials which exhibit optimum properties throughout their entire service life. The composite multilayer material comprises a backing layer, a bearing metal layer, an intermediate layer and an elec... | 03/25/2003 |
| 6500327 | Sn-Bi alloy plating bath and method of plating using the same An Sn--Bi alloy plating bath has a pH about 2.0 to 9.0 and comprises Bi3+ ions, Sn2+ ions, complexing agent (I) and complexing agent (II). Complexing agent (I) can be (a) aliphatic dicarboxylic acids having alkyl groups of 1-3 carbon... | 12/31/2002 |
| 6478944 | Functional Sn-Bi alloy plating using a substitute material for Pb The present invention relates to a to-be-mounted electronic component to which functional alloy plating using a bonding material for mounting is applied with a substitute bonding material for solder (tin-lead alloy), and aims at providing alloy plating wh... | 11/12/2002 |
| 6454928 | Method for preventing the thermal oxidation yellowing of tin-plated wires A method for providing a tin-plated wire which is free from thermal oxidation yellowing. In a tin-plated wire which comprises a core wire 1 with its surface being formed with a tin-plating layer 2, the composition of the plating is comprised of 30 to 500 ... | 09/24/2002 |
| 6361677 | Plant and process for the electrolytic dissolution by oxidation of a metal The plant comprises: an electrolysis cell (1") having a soluble anode (2"1) and an insoluble cathode (3") without an interposed membrane, means for introducing the bath into the cell and for removing the bath from the cell, means for maintaining an appropriate... | 03/26/2002 |
| 6337145 | Multilayer material for sliding elements and process for the production thereof A process for the production of sliding elements in which an overlay of lead-tin-copper is applied by electroplating to the prefabricated semi-finished product, and in which a ternary, fluoroborate-free electroplating bath is used without brighteners and ... | 01/08/2002 |
| 6322686 | Tin electrolyte Disclosed are electrolyte compositions for depositing tin or tin-alloys at various current densities. Also disclosed are methods of plating such tin or tin-alloys on substrates, such as the high speed tin plating of steel.... | 11/27/2001 |
