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| Number | Title | Issue Date |
| 7780839 | Electroplating bronze Electrolytes for white bronzes are disclosed as well as methods of depositing the white bronzes. The electrolytes for depositing the white bronzes are cyanide free and provide a uniform white color. ... | 08/24/2010 |
| 7563353 | Method of forming Sn-Ag-Cu ternary alloy thin-film on base material A method of forming an Sn—Ag—Cu ternary alloy thin-film of the present invention forms the ternary alloy thin-film by electroplating. A plating bath contains an Sn compound, an Ag compound, a Cu compound, an inorganic chelating agent and an organic chelating age... | 07/21/2009 |
| 7357853 | Electroplating composite substrates An electrolyte employed to selectively deposit a tin or tin alloy film on a composite substrate. A method for depositing the tin or tin alloy on the composite substrate also is described. ... | 04/15/2008 |
| 7291201 | Method for making nano-scale lead-free solder A method for making Nano-scale lead-free solder includes the following steps of: forming a mixture solution Sn-Ag or Sn-Ag-Cu; making NaBH4, NaOH and alkyl C12H25OSO3Na to a reducing dispersing solution; producing reactant... | 11/06/2007 |
| 7273540 | Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film An electrolytic plating method, including: preparing a plating solution including water which is a primary medium, a sulfonic acid, and tin, copper, and silver ions, and a complexing agent, concentrations of the sulfonic acid, and tin, copper, and silver ions being ... | 09/25/2007 |
| 7179362 | Electrolyte and method for depositing tin-copper alloy layers The invention relates to an acid electrolyte for depositing tin-copper alloys. Said electrolyte comprises one or more alkylsulfonic acids and/or alkanolsulfonic acids, one or more soluble tin(II) salts, one or more soluble copper(II) salts, and one or more organic s... | 02/20/2007 |
| 7156904 | Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby An aqueous copper-to-resin bonding layer solution comprising: (a) at least one acid type; (b) tin salt or tin oxide; (c) salt or oxide of at least one type of metal selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cob... | 01/02/2007 |
| 7151049 | Electroplating compositions and methods Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, an acid, a thiourea derivative, and an additive selected from alkanol amines, polyethylene imines, a... | 12/19/2006 |
| 7029761 | Bonding layer for bonding resin on copper surface A bonding layer for bonding resin is provided that is formed on a copper surface, and contains an alloy of: (a) copper; (b) tin; and (c) at least one type of metal (third metal) selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromi... | 04/18/2006 |
| 6998036 | Electrolyte and method for depositing tin-silver alloy layers The invention relates to an acidic electrolyte used for depositing tin-silver alloys. The acidic electrolyte comprises one or more alkylsulfonic acids and/or alkanolsulfonic acids, one or more soluble tin (II) salts, one or more soluble silver (I) salts and one or m... | 02/14/2006 |
| 6875332 | Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied The present invention relates to a to-be-mounted electronic component to which functional alloy plating using a bonding material for mounting is applied with a substitute bonding material for solder (tin-lead alloy), and aims at providing alloy plating which has bee... | 04/05/2005 |
| 6808614 | Electroplating solution for high speed plating of tin-copper solder In accordance with the present invention, an electroplating solution is provided for electroplating satin bright tin-copper alloy solder coatings at high speed. The preferred solution comprises sulfonic acid, tin sulfonate, copper sulfonate, non-ionic surfactant, sa... | 10/26/2004 |
| 6773568 | Metal alloy compositions and plating methods related thereto The present invention provides inter alia electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer addit... | 08/10/2004 |
| 6759142 | Plated copper alloy material and process for production thereof A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 μm. The copper-tin alloy layer has a thickness ... | 07/06/2004 |
| 6736954 | Plating bath and method for depositing a metal layer on a substrate A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of p... | 05/18/2004 |
| 6706418 | Metal alloy compositions and plating methods related thereto The present invention provides inter alias electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer addi... | 03/16/2004 |
| 6607653 | Plating bath and process for depositing alloy containing tin and copper The present invention provides a tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the present in... | 08/19/2003 |
| 6582582 | Electroplating composition and process An electroplating bath is disclosed that is particularly suited to the electrodeposition of tin, zinc and alloys of the foregoing in a smooth and bright electrodeposit. The disclosed electroplating bath comprises propanedioic acid, diethyl ester, polymer ... | 06/24/2003 |
| 6562220 | Metal alloy sulfate electroplating baths The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful c... | 05/13/2003 |
| 6508927 | Tin-copper alloy electroplating bath A tin-copper alloy electroplating bath which comprises a water-soluble tin salt, a water-soluble copper salt, an inorganic or organic acid or a water-soluble salt thereof, and one or more compounds selected from thioamide compounds and thiol compounds. Th... | 01/21/2003 |
| 6458264 | Sn-Cu alloy plating bath An acidic Sn--Cu alloy plating bath composition comprising: (a) Sn2+ ions and Cu2+ ions, (b) at least one acid selected from the group consisting of alkane sulfonic acids, alkanol sulfonic acids, and sulfuric acid, and (c) a thiourea... | 10/01/2002 |
| 6372117 | Bright tin-copper alloy electroplating solution A tin/copper alloy electroplating solution capable of forming a bright plating film in a wide electric current density range is provided. The electroplating solution is a cyanide-free aqueous solution containing an organosulfonic acid, divalent tin and co... | 04/16/2002 |
| 6258241 | Process for electroplating metals A process for electroplating metal on a resistive substrate and the article of manufacture produced therefrom are disclosed. The metal layer is electroplated onto the resistive substrate in an electroplating bath having a polarization parameter .xi. less ... | 07/10/2001 |
| 6251253 | Metal alloy sulfate electroplating baths The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful c... | 06/26/2001 |
| 6248228 | Metal alloy halide electroplating baths The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy halide electroplating baths has a number of unexpected benefits including wider useful cu... | 06/19/2001 |
| 6194056 | High tensile strength electrodeposited copper foil A high tensile strength copper foil having a matte side roughness Rz of 2.5 μm or less and a tensile strength of 40,000 Kgf/mm2 after heating one hour at 180° C. is produced by a process in which copper is electrodeposited from a solution con... | 02/27/2001 |
| 6183545 | Aqueous solutions for obtaining metals by reductive deposition An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1) ##STR1## in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydr... | 02/06/2001 |
| 6179985 | Metal alloy fluoroborate electroplating baths The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy fluoroborate electroplating baths has a number of unexpected benefits including wider use... | 01/30/2001 |
| 6103089 | Multilayer material for sliding elements and process and means for the production thereof A multilayer material is described, whose overlay exhibits improved hardness and improved wear-resistance. The multilayer material includes an overlay, which contains 8-18.5 wt. % tin and 2-16 wt. % copper, the balance being lead, wherein the tin is prese... | 08/15/2000 |
| 5958209 | High tensile strength electrodeposited copper foil and process of electrodepositing thereof A high tensile strength copper foil having a matte side roughness Rz of 2.5 μm or less and a tensile strength of 40,000 Kgf/mm2 after heating one hour at 180° C. is produced by a process in which copper is electrodeposited from a solution con... | 09/28/1999 |
| 5948235 | Tin-silver alloy plating bath and process for producing plated object using the plating bath In the present invention, the tin-silver-system alloy plating solution comprising following five fundamental ingredients (a)-(e): (a) a tin compound; (b) a silver compound; (c) at least one member selected from a group consisting of bismuth compounds and ... | 09/07/1999 |
| 5939215 | Laminated material and process for producing the same A metallic backing layer such as steel covered by a functional layer of AlSn, AlPb, CuPb, CuSn or CuZn, applied by spraying in air, and a softer covering layer applied to the functional layer by chemical or electrolytic deposition exhibits improved corros... | 08/17/1999 |
| 5674371 | Process for electrolytically treating aluminum and compositions therefor A process for providing a variety of light to medium colors of anodized aluminum or aluminum alloy which comprises the steps of anodizing an aluminum or aluminum alloy workpiece in an aqueous strong acid electrolyte solution such as a sulfuric acid soluti... | 10/07/1997 |
| 5614327 | Process for protecting a silver or silver-coated part A process for protecting, especially against corrosion, a silver or silver-coated part, wherein a Cu--Sn alloy comprising from 53 to 75% copper and from 25 to 47% tin and optionally comprising up to 10% zinc is deposited on the said part over a thickness ... | 03/25/1997 |
| 5534129 | Cyanidic-alkaline baths for the galvanic deposition of copper-tin alloy coatings, uses thereof, and metallic bases coated with said copper-tin alloy coating In order to produce bright to brilliant, leveled copper-tin alloy coatings, galvanic baths are used which contain 1 to 60 g/l copper in the form of copper(I) cyanide, 1 to 50 g/l tin in the form of alkali stannate, 0 to 10 g/l zinc in the form of zinc cya... | 07/09/1996 |
| 5494565 | Method of producing workpieces of non-corrosion-resistant metals with wear-resistant coatings and articles Workpieces of non-corrosion-resistant metals are provided with a wear-resistant, non-metallic layer of a nitride, carbide, boride, oxide or silicide of an element of the fourth to the sixth subgroup applied by PVD (physical vapor deposition) after a corro... | 02/27/1996 |
| 5470673 | Electrochromic and electrocatalytic material A process provides for an electrochemical deposition by forming a solution of ions of at least one metal (A) capable of forming a hydrogen bronze and ions of at least one metal (B) from Group VIII of the periodic table, and causing electrochemical deposit... | 11/28/1995 |
| 5443714 | Process and electrolyte for depositing lead and lead-containing layers A process for acidic electrolytical deposition of lead layers and predominantly lead-containing layers onto surfaces using an electrolyte containing lead salts and acids, in particular alkanesulfonic acid, borofluoric acid or silicofluoric acid, with non-... | 08/22/1995 |
| 5385661 | Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition An acidic electrolytic solution for use in the electrodeposition of copper-rich alloys on a substrate, the less noble component being incorporated by underpotential deposition. The solution includes a first salt containing copper cations; a second salt co... | 01/31/1995 |
| 5156729 | Method of making a plain bearing sliding layer A method of making a plain bearing sliding layer for use in internal combustion engines, comprising the immersion of a metal substrate in a chemical solution containing copper, tin and lead salts to which is added one of the compounds represented by the f... | 10/20/1992 |
