Bizarre Patents
Neuroimaging as a Marketing Tool
Neuroimaging as a means for validating whether a stimulus such as advertisement, communication, or product evokes a certain mental response such as emotion, preference, or memory, or to predict the consequences of the stimulus on later behavior such as consumption or purchasing.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8012334 | Metal plating compositions and methods Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power. ... | 09/06/2011 |
| 7785460 | Method for producing rare earth metal-based permanent magnet having copper plating film on the surface thereof [Problems] To provide a method for producing a rare earth metal-based permanent magnet having on the surface thereof a copper plating film by using a novel plating solution for use in a copper electroplating treatment capable of forming a copper plating film having ... | 08/31/2010 |
| 7628903 | Silver and silver alloy plating bath A silver and silver alloy plating bath, includes (A) a soluble salt, having a silver salt or a mixture of a silver salt and a salt of a metal such as tin, bismuth, indium, lead, and the like; and (B) a particular aliphatic sulfide compound, such as thiobis(diethylen... | 12/08/2009 |
| 7357853 | Electroplating composite substrates An electrolyte employed to selectively deposit a tin or tin alloy film on a composite substrate. A method for depositing the tin or tin alloy on the composite substrate also is described. ... | 04/15/2008 |
| 7314543 | Tin deposition A device includes an integrated circuit and a deposited tin in electrical contact with a portion of the integrated circuit. The deposited tin is formed by electrodeposition from a bath. The deposited tin includes a residue characteristic of the bath. The bath includ... | 01/01/2008 |
| 7297868 | Preparation of CIGS-based solar cells using a buffered electrodeposition bath A photovoltaic cell exhibiting an overall conversion efficiency of at least 9.0% is prepared from a copper-indium-gallium-diselenide thin film. The thin film is prepared by simultaneously electroplating copper, indium, gallium, and selenium onto a substrate using a ... | 11/20/2007 |
| 7273539 | Method for regeneration of an electrolysis bath for the production of a compound I-III-VIin thin layers The invention relates to the regeneration of an electrolysis bath for the production of I-III-VIY compounds in thin layers, where y is approaching 2 and VI is an element including selenium, whereby selenium is regenerated in the form Se(IV) and/or with addi... | 09/25/2007 |
| 7217464 | Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing method The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by press working at temperatures of not less than 200°C. For this purpose ... | 05/15/2007 |
| 7105082 | Composition and method for electrodeposition of metal on a work piece A composition for electrodeposition of a metal on a work piece, which electrodeposition is conducted at an electrodeposition temperature, is provided. The composition comprises a metal salt, a polymer suppressor having a cloud point, an accelerator and an electrolyt... | 09/12/2006 |
| 7097754 | Continuous electroforming process to form a strip for battery electrodes and a mandrel to be used in said electroforming process A continuous electroforming process to form a strip for battery electrodes, comprising the steps of providing a mandrel having on its surface a reusable pattern subdivided into conductive and non-conductive areas; moving said mandrel through an electroforming bath t... | 08/29/2006 |
| 7087315 | Method for forming plating film A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th... | 08/08/2006 |
| 7052781 | Flexible copper foil structure and fabrication method thereof A new copper foil structure with enhanced flexibility and its fabrication method thereof are disclosed. This inventive structure includes a copper base foil having a matte side and shiny side, and a more thermally stable deposited layer overlying at least the matte ... | 05/30/2006 |
| 7048840 | Method for metal coating the surface of high temperature superconductors The invention relates to a method for metal coating the surface of high temperature superconductors with a copper-oxygen base structure. The aim of the invention is to achieve a method as above, which requires a low production complexity, serves for the production o... | 05/23/2006 |
| 6982030 | Reduction of surface oxidation during electroplating Methods of providing improved metal coatings or metal deposits on a substrate, improvements in plating solutions that are used to provide such metal deposits and articles of the metal-coated substrates. The solderability of the metal coating is enhanced by incorpora... | 01/03/2006 |
| 6974767 | Chemical solution for electroplating a copper-zinc alloy thin film A method of fabricating a semiconductor device, having a Cu—Zn alloy thin film (30) formed on a Cu surface (20) by electroplating the Cu surface (20) in a unique chemical solution containing salts of zinc (Zn) and copper (Cu), their complexing... | 12/13/2005 |
| 6858121 | Method and apparatus for filling low aspect ratio cavities with conductive material at high rate The present invention relates to methods and apparatus for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on the top portion of the workpiece more than at least one additive dis... | 02/22/2005 |
| 6852210 | Plating method and plating bath precursor used therefor To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing ... | 02/08/2005 |
| 6783654 | Electrolytic plating method and device for a wiring board A plating bath which accommodates an insoluble anode and a printed-circuit board, and a copper dissolved bath which supplies copper ions are arranged. The insoluble anode is arranged as opposed to the printed-circuit board being a cathode, and a forward/reverse curr... | 08/31/2004 |
| 6777108 | Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil To control peel strength at an organic release interface between a carrier foil and a copper-microparticle layer which constitute an electrodeposited copper foil with carrier. In the present invention, (1) a barrier copper layer is formed on the release interface la... | 08/17/2004 |
| 6740221 | Method of forming copper interconnects A method of forming a copper layer with increased electromigration resistance. A doped copper layer is formed by controlling the incorporation of a non-metallic dopant during copper electroplating. ... | 05/25/2004 |
| 6736954 | Plating bath and method for depositing a metal layer on a substrate A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of p... | 05/18/2004 |
| 6562220 | Metal alloy sulfate electroplating baths The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful c... | 05/13/2003 |
| 6537683 | Stratified composite material for sliding elements and method for the production thereof A method is described for producing composite multilayer materials which exhibit optimum properties throughout their entire service life. The composite multilayer material comprises a backing layer, a bearing metal layer, an intermediate layer and an elec... | 03/25/2003 |
| 6534116 | Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence The present invention relates to methods and apparatus for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on the top portion of the workpiece more than at least one a... | 03/18/2003 |
| 6497806 | Method of producing a roughening-treated copper foil A method of producing a roughening-treated copper foil, comprising (A) a copper foil, (B) a composite metal layer, which is formed on a bonding surface of the copper foil and comprises (I) copper, (II) at least one metal selected from the group consisting... | 12/24/2002 |
| 6409906 | Electroplating solution for plating antimony and antimony alloy coatings A method and an aqueous electroplating solution for plating tarnish-resistant bluish-white antimony or antimony alloys containing at least one other metal from an aqueous acidic solution having a pH below about 6.0 at a temperature from about 65 to about ... | 06/25/2002 |
| 6379487 | Component of printed circuit board A method of forming a laminate used in the manufacture of printed circuit boards, comprising the steps of applying a layer of chromium having a thickness from about 30 grams per square meter to about 160 grams per square meter to each side of a steel subs... | 04/30/2002 |
| 6344123 | Method and apparatus for electroplating alloy films A compositionally modulated material electroplated film is deposited by using at least two source metal anodes in an electroplating apparatus, and changing at least one power setting of an electroplating power supply. In order to obtain sharp boundaries b... | 02/05/2002 |
| 6344125 | Pattern-sensitive electrolytic metal plating A process for the electrolytic deposition of a metal, preferably copper or an alloy of copper, directly onto a barrier layer coated on a dielectric layer. The process is advantageous because it electrolytically deposits metal in a pattern that is either t... | 02/05/2002 |
| 6342308 | Copper foil bonding treatment with improved bond strength and resistance to undercutting A treated electrodeposited copper foil having a bond-enhancing copper layer, preferably a plurality of layers, electrodeposited on a bonding side of a base copper foil, a layer of co-deposited copper and arsenic electrodeposited on the bond-enhancing laye... | 01/29/2002 |
| 6319387 | Copper alloy electroplating bath for microelectronic applications A metallized structure for use in a microelectronic circuit is set forth. The metallized structure comprises a dielectric layer, an ultra-thin film bonding layer disposed exterior to the dielectric layer, and a low-Me concentration, copper-Me alloy layer ... | 11/20/2001 |
| 6251253 | Metal alloy sulfate electroplating baths The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful c... | 06/26/2001 |
| 6248228 | Metal alloy halide electroplating baths The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy halide electroplating baths has a number of unexpected benefits including wider useful cu... | 06/19/2001 |
| 6183545 | Aqueous solutions for obtaining metals by reductive deposition An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1) ##STR1## in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydr... | 02/06/2001 |
| 6179985 | Metal alloy fluoroborate electroplating baths The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy fluoroborate electroplating baths has a number of unexpected benefits including wider use... | 01/30/2001 |
| 6071570 | Electrodes of improved service life A method of preparing electrodes is now described, which electrodes have enhanced adhesion of subsequently applied coatings combined with excellent coating service life. In the method, a substrate metal, such as a valve metal as represented by titanium, i... | 06/06/2000 |
| 6054037 | Halogen additives for alkaline copper use for plating zinc die castings A method and electrolyte bath for depositing Cu+1 ions from the cathode diffusion layer onto a zinc substrate. Halogen ions are used as additives to organophosphonate alkaline copper electrolytes for stabilizing Cu+1 in the cathode d... | 04/25/2000 |
| 5895562 | Gas shielding during plating Gas shielding is employed to prevent metal plating on contacts during electroplating to reduce particulate contamination and increase thickness uniformity. In another embodiment, gas shielding is employed to prevent deposition on the backside and edges of... | 04/20/1999 |
| 5804054 | Preparation of copper indium gallium diselenide films for solar cells High quality thin films of copper-indium-gallium-diselenide useful in the production of solar cells are prepared by electrodepositing at least one of the constituent metals onto a glass/Mo substrate, followed by physical vapor deposition of copper and sel... | 09/08/1998 |
| 5730854 | Alkoxylated dimercaptans as copper additives and de-polarizing additives A copper electroplating process using alkoxylated dimercaptan ethers as an additive. The additives prevent dendritic formations which short out electrodes. Also provided is a method for polarizing the electrodes, allowing for current reduction and cost sa... | 03/24/1998 |
