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| Number | Title | Issue Date |
| 8066865 | Electroplating methods and chemistries for deposition of group IIIA-group via thin films An electrochemical co-deposition method and solution to plate uniform, defect free and smooth (In,Ga)—Se films with repeatability and controllable molar ratios of (In,Ga) to Se are provided. Such layers are used in fabrication of semiconductor and electronic devic... | 11/29/2011 |
| 8066864 | Crosslinked polymers, galvanization baths comprising them and use thereof The invention relates to polymers which comprise at least partially cross-linked main chains constructed from repeat units of the general formula I and possibly repeat units of the general formula II | 11/29/2011 |
| 8048284 | Metal plating compositions Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on ... | 11/01/2011 |
| 7892413 | Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films Described is an electrodeposition solution for deposition of a Group IB-IIIA thin film on a conductive surface. In a preferred embodiment, the electrodeposition solution comprises a solvent; a Group IB material source that dissolves in the solvent and provides a Gro... | 02/22/2011 |
| 7833404 | Electrolytic phosphate chemical treatment method A method of forming a film composed of a phosphate compound and a metal on the surface of an article to be treated by performing electrolytic treatment on a metal article to be treated in a phosphate chemical treatment bath. The method includes contacting the metal ... | 11/16/2010 |
| 7575665 | Method of reducing corrosion of silver containing surfaces Described is a method of reducing corrosion of a silver-containing surface comprising electro-depositing a layer of an iodine-containing material on the silver-containing surface at a charge density of about 80 mA*s (milliamps second)/cm2 or less. Also de... | 08/18/2009 |
| 7468123 | Method for electrolytic coating of materials with aluminum, magnesium or aluminum and magnesium alloys The invention concerns a method for electrolytic coating of materials with aluminum, magnesium or aluminum and magnesium alloys. The method is characterized in that the material is pretreated by being immersed in an electrolytic solution, where it is anodized, the e... | 12/23/2008 |
| 7425255 | Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition Bipolar wave current, with both positive and negative current portions, is used to electrodeposit a nanocrystalline grain size deposit. Polarity Ratio is the ratio of the absolute value of the time integrated amplitude of negative polarity current and positive polar... | 09/16/2008 |
| 7419579 | Method for manufacturing a ferroelectric film A method for manufacturing a ferroelectric film includes the steps of causing, in a solution containing sol-gel raw materials, hydrolysis and polycondensation to the sol-gel raw materials to form a liquid containing particulate gels dispersed therein, and forming a ... | 09/02/2008 |
| 7393473 | Method for producing a composite plated product There is provided a composite plated product wherein a coating of a composite material containing carbon particles in a silver layer is formed on a substrate, the composite plated product having a large content of carbon and a large quantity of carbon particles on t... | 07/01/2008 |
| 7368046 | Layered composite material for plain bearings, production and use thereof The invention is a method for the production of a composite multilayer material having a backing layer, a bearing metal layer of a copper alloy or an aluminum alloy, a nickel intermediate layer and an overlay consisting of about 0-20 wt. % copper and about 0-20 wt. ... | 05/06/2008 |
| 7368048 | Method for forming Re alloy coating film having high-Re-content through electroplating Disclosed is a method for forming a high-Re-content alloy film, such as a Re-based film containing Re at 98% or more by atomic composition, or an alloy film containing Re in the range of 65 to less than 98% by atomic composition and at least one of Ni, Fe and Co. Th... | 05/06/2008 |
| 7273539 | Method for regeneration of an electrolysis bath for the production of a compound I-III-VIin thin layers The invention relates to the regeneration of an electrolysis bath for the production of I-III-VIY compounds in thin layers, where y is approaching 2 and VI is an element including selenium, whereby selenium is regenerated in the form Se(IV) and/or with addi... | 09/25/2007 |
| 7239747 | Method and system for locating position in printed texts and delivering multimedia information Apparatus and methods are disclosed for processing printed material to provide an index of locations within the printed material that can be associated with external actions such as displaying a graphical image, providing an audio or video output, or providing a mul... | 07/03/2007 |
| 7235165 | Electroplating solution and method for electroplating An electroplating solution may be formulated as an aqueous solution of oxalic acid, trisodium phosphate and ammonium sulfate. Such solutions may be used for both brush plating and bath plating, and are suitable for use with a variety of plating metals and substrate ... | 06/26/2007 |
| 7182849 | ECP polymer additives and method for reducing overburden and defects Electrochemical plating polymer additives and method which reduces metal overburden in an electroplated metal while optimizing gap fill capability are disclosed. The polymer additives are provided in an electrochemical plating bath solution and may include low catio... | 02/27/2007 |
| 7128822 | Leveler compounds Compounds that function to provide level or uniform metal deposits are provided. These compounds are particularly useful in providing level copper deposits. Copper plating baths and methods of copper plating using these compounds are also provided. These baths and m... | 10/31/2006 |
| 7122108 | Tin-silver electrolyte A tin-silver electrolyte and methods of depositing tin-silver alloys on a substrate. ... | 10/17/2006 |
| 7115197 | Coating process This invention relates to a process for electroplating a selected surface area of a component with a crushable zinc alloy, the method comprising utilizing a relatively low current density in an alkaline solution during the electroplating process to provide a crushab... | 10/03/2006 |
| 7105082 | Composition and method for electrodeposition of metal on a work piece A composition for electrodeposition of a metal on a work piece, which electrodeposition is conducted at an electrodeposition temperature, is provided. The composition comprises a metal salt, a polymer suppressor having a cloud point, an accelerator and an electrolyt... | 09/12/2006 |
| 7087315 | Method for forming plating film A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th... | 08/08/2006 |
| 7081141 | Electrolyte for electrolytic capacitor An electrolytic capacitor comprising an anode, cathode and an electrolyte. The electrolyte comprises an aqueous solution comprising a compound of formula 1: CH3—(OCH2CH2)m—OCH3Formula 1 w... | 07/25/2006 |
| 7070472 | Field emission display and methods of forming a field emission display A field emission device and method of forming a field emission device are provided in accordance with the present invention. The field emission device is comprised of a substrate (12) having a deformation temperature that is less than about six hundred and fi... | 07/04/2006 |
| 7070689 | Acid dip for zinc-manganese alloy electrodeposition The invention relates to a dip comprising an acid aqueous solution having no ammonium ion, fluoroborate ions or citrate ion and containing per liter: between 10 and 60 g of Zn2+ ions and between 20 and 100 g of Mn2+ ions. The invention is chara... | 07/04/2006 |
| 6998035 | Method for forming Re-Cr alloy film through electroplating process using bath containing Cr(VI) Disclosed is a method for forming a Re—Cr alloy film consisting of Re in the range of 60 to 90% by atomic composition. The method comprises performing an electroplating process using an electroplating bath containing an aqueous solution which includes a perrhenate... | 02/14/2006 |
| 6994919 | Brazing product and method of manufacturing a brazing product The invention relates to a brazing sheet product including a core sheet, on at least one side of the core sheet a clad layer of an aluminum alloy including silicon in an amount in the range of 4 to 14% by weight, and further including on at least one outersurface of... | 02/07/2006 |
| 6982030 | Reduction of surface oxidation during electroplating Methods of providing improved metal coatings or metal deposits on a substrate, improvements in plating solutions that are used to provide such metal deposits and articles of the metal-coated substrates. The solderability of the metal coating is enhanced by incorpora... | 01/03/2006 |
| 6979517 | Electrode plate for cell and method for manufacturing the same The battery electrode plate includes a core member (1) which is densely coated with a mixture paste chiefly including an active material (2). The core member (1) is made of a metal sheet (3), which is formed with rows (8) of first ... | 12/27/2005 |
| 6979392 | Method for forming Re—Cr alloy film or Re-based film through electroplating process Disclosed is a method for forming: a Re—Cr alloy film consisting of Re in the range of greater than 0 (zero) to less than 98% by atomic composition, and the remainder being Cr except inevitable impurities; a Re-based film consisting of 98% or more, by atomic compo... | 12/27/2005 |
| 6974636 | Protective coating for turbine engine component A turbine engine component comprising a substrate made of a nickel-base or cobalt-base superalloy and a protective coating overlying the substrate, the coating formed by electroplating at least two platinum group metals selected from the group consisting of platinum... | 12/13/2005 |
| 6974767 | Chemical solution for electroplating a copper-zinc alloy thin film A method of fabricating a semiconductor device, having a Cu—Zn alloy thin film (30) formed on a Cu surface (20) by electroplating the Cu surface (20) in a unique chemical solution containing salts of zinc (Zn) and copper (Cu), their complexing... | 12/13/2005 |
| 6964087 | Method for manufacturing dielectric ceramic layer and internal polar layer of multiple layer ceramic capacitors (MLCC) by vacuum sputtering A method for manufacturing the dielectric ceramic layer and the internal polar layer of the multiple layer ceramic capacitor by the vacuum sputtering process in which the dielectric ceramic layer and the internal polar layer of the MLCC has a finest thinness of 1˜5... | 11/15/2005 |
| 6958247 | Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process In a new method of plating metal onto dielectric layers including small diameter vias and large diameter trenches, a surface roughness is created at least on non-patterned regions of the dielectric layer to enhance the uniformity of material removal in a subsequent ... | 10/25/2005 |
| 6942929 | Process chamber having component with yttrium-aluminum coating A substrate processing chamber component is a structure having an integral surface coating comprising an yttrium-aluminum compound. The component may be fabricated by forming a metal alloy comprising yttrium and aluminum into the component shape and anodizing its su... | 09/13/2005 |
| 6893738 | Electrodeposited copper foil for PCB having barrier layer of Zn-Co-As alloy and surface treatment method of the copper foil An electrodeposited copper foil to be laminated on an insulation substrate for a printed circuit board, comprising a barrier layer of ternary alloy of Zn—Co—As formed on the copper foil, is provided. Further, a surface treatment method of an electrodeposited cop... | 05/17/2005 |
| 6852210 | Plating method and plating bath precursor used therefor To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing ... | 02/08/2005 |
| 6824667 | Metal hydride composite materials A method of producing metal hydride misch-metal composite powders comprising providing to a rotary flow-through electrodeposition apparatus a powder whose particles comprise one or more lanthanide alloy metals selected from the group consisting of titanium lanthanid... | 11/30/2004 |
| 6818116 | Additive-assisted cerium-based electrolytic coating process for corrosion protection of aluminum alloys The corrosion resistance of an aluminum or aluminum alloy component is enhanced by immersing an aluminum alloy to act as a cathode and an oxygen-evolving anode in an electrolyte comprising water, cerium ions, and an additive selected from among animal gelatin, deriv... | 11/16/2004 |
| 6811672 | Method for forming plating film and electronic component having plating film formed theron by same method A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th... | 11/02/2004 |
| 6805975 | Steel sheet for procelain enameling and method for production thereof, and enameled product and method for production thereof Steel sheet for porcelain enameling capable of realizing excellent enamel adhesion with the steel sheet by direct-on enameling once is provided by using a Ti-added steel sheet; there are also a method for producing the same, as well as a porcelain enamel product and... | 10/19/2004 |