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| Number | Title | Issue Date |
| 7731833 | Plating method and apparatus for controlling deposition on predetermined portions of a workpiece The present invention relates to methods and apparatus for plating a conductive material on a workpiece surface in a highly desirable manner. Using a workpiece-surface-influencing device, such as a mask or sweeper, that preferentially contacts the top surface of the... | 06/08/2010 |
| 7588674 | Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that ... | 09/15/2009 |
| 7413771 | Coating solder metal particles with a charge director medium A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and c... | 08/19/2008 |
| 7396448 | Method for roll to be processed before forming cell and method for grinding roll There are provided a plating method for a roll and a grinding method before a cell is formed in which copper sulfate plating having a uniform thickness without any particles or pits can be applied to the roll for a gravure printing, both a middle finish grinding and... | 07/08/2008 |
| 7351321 | Method for electrochemical fabrication An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substra... | 04/01/2008 |
| 7303663 | Multistep release method for electrochemically fabricated structures Multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surro... | 12/04/2007 |
| 7257893 | Efficient wafer processing technology Consistent excess conductive material is provided for plated conductors in integrated circuit metallization, regardless of the size and depth of trenches/vias into which the conductive material is deposited. Accordingly, subsequent processing (e.g., material removal... | 08/21/2007 |
| 7255784 | Polishing method and electropolishing apparatus A polishing method for electropolishing a metal film formed on a wafer surface so as to fill concave portions formed on the wafer surface comprises a step of determining an electropolishing end point of the metal film on the basis of a change of a current waveform r... | 08/14/2007 |
| 7250101 | Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In so... | 07/31/2007 |
| 7232514 | Method and composition for polishing a substrate Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic ... | 06/19/2007 |
| 7232362 | Chemical mechanical polishing process for manufacturing semiconductor devices A chemical-mechanical polishing (CMP) process for the manufacturing of semiconductor devices is disclosed. The process includes removing a first portion of a first layer of interconnect materials using a first platen and a first slurry, removing a second portion of ... | 06/19/2007 |
| 7204743 | Integrated circuit interconnect fabrication systems A system for processing a conductive surface on a front surface of a wafer to form a metallic interconnect structure is disclosed. The system for processing comprises an electrochemical mechanical processing (ECMPR) module configured to form a substantially planariz... | 04/17/2007 |
| 7189313 | Substrate support with fluid retention band An apparatus and method for supporting a substrate is provided. In one embodiment, an apparatus for supporting a substrate includes a body having a band extending therefrom. The band is adapted to retain a fluid on the body thereby forming a shallow processing bath ... | 03/13/2007 |
| 7169283 | Anodization device and anodization method In an anodization apparatus and an anodization method for electrochemically treating a target substrate by irradiating the target substrate with light, treatment of a large target substrate can be made possible with smaller constituent elements. The electrical conta... | 01/30/2007 |
| 7160432 | Method and composition for polishing a substrate Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at... | 01/09/2007 |
| 7147766 | Chip interconnect and packaging deposition methods and structures The present invention relates to a method for fabricating high performance chip interconnects and packages by providing methods for depositing a conductive material in cavities of a substrate in a more efficient and time saving manner. This is accomplished by select... | 12/12/2006 |
| 7138039 | Liquid isolation of contact rings Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface formed thereon, a plurality of electrical contact pins extending fro... | 11/21/2006 |
| 7128825 | Method and composition for polishing a substrate Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic ... | 10/31/2006 |
| 7090939 | Forming a layer on a flow plate of a fuel cell stack A technique includes applying a charge to a flow plate of a fuel cell stack and depositing a material on at least a portion of the flow plate in response to the charge. In some embodiments of the invention, the technique may be applied to a fuel cell stack that incl... | 08/15/2006 |
| 7087144 | Contact ring with embedded flexible contacts A contact assembly for supporting a substrate in an electrochemical plating system, wherein that contact assembly includes a contact ring and a thrust plate assembly. The contact ring includes an annular ring member having an upper surface and a lower surface, an an... | 08/08/2006 |
| 7084059 | CMP system for metal deposition A system for dished metal redevelopment by providing a metal deposition solution at an interface between a moving semiconductor wafer and a moving polishing pad, which deposits metal onto dished metal in trenches in a layer of an interlayer dielectric; and by polish... | 08/01/2006 |
| 7077725 | Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus In advanced electrolytic polish (AEP) method, a metal wafer (10) acts as an anodic electrodes and another metal plate (65) is used as a cathodic electrode. A voltage differential is applied to the anode and cathode under a predetermined anodic dissolut... | 07/18/2006 |
| 7025860 | Method and apparatus for the electrochemical deposition and removal of a material on a workpiece surface An apparatus for performing an electrochemical process on a metallic surface of a workpiece, comprised of a substantially incompressible workpiece support plate. A platen for supporting the workpiece support plate, has at least one opening coupled to a source of ele... | 04/11/2006 |
| 7025861 | Contact plating apparatus Embodiments of the invention generally provide a substrate processing system and method. The substrate processing system generally includes a fluid basin configured to contain a plating solution therein, an anode assembly positioned in a lower portion of the fluid b... | 04/11/2006 |
| 6979248 | Conductive polishing article for electrochemical mechanical polishing An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coat... | 12/27/2005 |
| 6936154 | Planarity detection methods and apparatus for electrochemical mechanical processing systems The methods and systems described provide for an in-situ detection of planarity of a layer that is deposited on or etched off the surface of a substrate. Planarity can be detected using various detection mechanisms, including optical, electrical, mechanical and acou... | 08/30/2005 |
| 6932896 | Method and apparatus for avoiding particle accumulation in electrodeposition Systems and methods to remove or lessen the size of metal particles that have formed on, and to limit the rate at which metal particles form or grow on, workpiece surface influencing devices used during electrodeposition are presented. According to an exemplary meth... | 08/23/2005 |
| 6921551 | Plating method and apparatus for controlling deposition on predetermined portions of a workpiece The present invention relates to methods and apparatus for plating a conductive material on a workpiece surface in a highly desirable manner. Using a workpiece-surface-influencing device, such as a mask or sweeper, that preferentially contacts the top surface of the... | 07/26/2005 |
| 6913685 | Method of modifying the surface of plastic substrate A plastic substrate is processed by a functional water obtained by electrolysis of water or functional water containing active oxygen or active hydrogen for a predetermined time period to selectively remove an alkali and/or halogen component in a surface layer of th... | 07/05/2005 |
| 6911396 | Method of producing metallic film Concentration of electric current due to an additive (particularly, a brightener) remaining or precipitated in a high concentration at grain boundary triple points and wiring groove portions in the surface layer of a copper plating film is obviated, whereby preceden... | 06/28/2005 |
| 6837979 | Method and apparatus for depositing and controlling the texture of a thin film The present invention provides a method and apparatus for plating a conductive material to a substrate and also modifying the physical properties of a conductive film while the substrate is being plated. The present invention further provides a method and apparatus ... | 01/04/2005 |
| 6808617 | Electrolytic polishing method A polishing method and polishing apparatus able to easily flatten an initial unevenness with an excellent efficiency of removal of excess copper film and suppress damage to a lower interlayer insulation film, and a plating method and plating apparatus able to deposi... | 10/26/2004 |
| 6802955 | Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface An electrochemical apparatus is provided which deposits material onto or removes material from the surface of a workpiece. The apparatus comprises a polishing pad and a platen which is in turn comprised of a first conductive layer in contact with the polishing pad a... | 10/12/2004 |
| 6783652 | Process for manufacturing a wiring board A resin plate having wiring pattern recesses and via through holes is made. All of the surfaces of the resin plate including inner walls of the wiring pattern recesses and via through holes are coated with a metal film. An electro-plating is applied using the metal ... | 08/31/2004 |
| 6773570 | Integrated plating and planarization process and apparatus therefor A method and apparatus are described for performing both electroplating of a metal layer and planarization of the layer on a substrate. Electroplating and electroetching of metal (such as copper) are performed in a repeated sequence, followed by chemical-mechanical ... | 08/10/2004 |
| 6749737 | Method of fabricating inter-layer solid conductive rods A method of forming a solid inter-layer conductive rod. A printed circuit board comprising an insulating core layer, a first conductive layer and a second conductive layer is provided. The insulating core layer is sandwiched between the first conductive layer and th... | 06/15/2004 |
| 6736952 | Method and apparatus for electrochemical planarization of a workpiece An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge ... | 05/18/2004 |
| 6701613 | Multilayer circuit board and method of manufacturing the same In a method of manufacturing a multilayer circuit board, cable patterns in a plurality of cable layers can be precisely formed, and the cable layer are formed with higher density, with higher reliability. The multilayer circuit board comprises: a pluralit... | 03/09/2004 |
| 6699593 | Corrosion-resistant metallic member, metallic separator for fuel cell comprising the same, and process for production thereof A highly corrosion-resistant material and a corrosion-resistant member which are improved in corrosion resistance, adhesion, contact electrical resistance, electrical conductivity, airtightness, etc. and are suitable for use as, e.g., a metallic separator... | 03/02/2004 |
| 6607650 | Method of forming a plated layer to a predetermined thickness The object of the present invention is to provide a plating method capable of planarization process of high quality in comparison with the conventional plating method and also provide a plating device and a plating system adopting the plating method of th... | 08/19/2003 |
