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"I watched his countenance closely, to see if he was not deranged ... and I was assured by other senators after he left the room that they had no confidence in it."
U.S. Senator Smith of Indiana ; After seeing Samuel Morse demonstrate the telegraph.
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| Number | Title | Issue Date |
| 8123927 | Reduced circuit trace roughness for improved signal performance Exemplary techniques for improving the performance of signals transmitted by conductive circuit traces are disclosed. The techniques may be realized as a method comprising the step of reducing a surface roughness of at least one surface of a conductive circuit trace... | 02/28/2012 |
| 8012333 | Aluminium alloy sheet with roughened surface There is disclosed a process for producing an aluminium alloy sheet, which comprises subjecting a surface of the sheet to anodising conditions to form on the surface an aluminium oxide barrier layer of thickness 10 to 50 nm and treating the oxide layer with an aqueo... | 09/06/2011 |
| 8002960 | Method for electrolytic engineering of nano-particulate layers A method for manufacturing a nano-particulate electrode for Dye Solar Cells including the steps of providing an electrically conductive substrate, formation of a nanoparticulate layer on the substrate, application of dye to the nanoparticulate layer and an additiona... | 08/23/2011 |
| 7422696 | Multicomponent nanorods Multicomponent nanorods having segments with differing electronic and/or chemical properties are disclosed. The nanorods can be tailored with high precision to create controlled gaps within the nanorods or to produce diodes or resistors, based upon the identities of... | 09/09/2008 |
| 7368044 | Non-conformable masks and methods and apparatus for forming three-dimensional structures Electrochemical Fabrication techniques are used to modify substrates or to form multilayer structures (e.g. components or devices) from a plurality of overlaying and adhered layers. Masks are used to selectively etch or deposit material. Some masks may be of the con... | 05/06/2008 |
| 7259640 | Miniature RF and microwave components and methods for fabricating such components RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, ant... | 08/21/2007 |
| 7252861 | Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to ... | 08/07/2007 |
| 7250101 | Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In so... | 07/31/2007 |
| 7239219 | Miniature RF and microwave components and methods for fabricating such components RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, ant... | 07/03/2007 |
| 7204916 | Plating apparatus and plating method A plating apparatus for performing a plating process for plating a surface of a substrate. This plating apparatus is provided with a first electrode to be brought into contact with a peripheral edge portion of the substrate; a plating vessel for containing a plating... | 04/17/2007 |
| 7198705 | Plating-rinse-plating process for fabricating copper interconnects An improved copper ECD process. After the copper seed layer (116) is formed, a first portion of copper film (118) is plated onto the surface of the seed layer (116). The surface of the first portion of the copper film (118) is then rinsed... | 04/03/2007 |
| 7195989 | Electrochemical fabrication methods using transfer plating of masks Three-dimensional structures are electrochemically fabricated by depositing a first material onto previously deposited material through voids in a patterned mask where the patterned mask is at least temporarily adhered to a substrate or previously formed layer of ma... | 03/27/2007 |
| 7169269 | Plating apparatus, plating cup and cathode ring A plating apparatus (10) provided with: a plating vessel (61a to 61d) having a cylindrical side wall (361) for containing a plating liquid; a substrate holding mechanism (74a to 74d) for generally... | 01/30/2007 |
| 7168607 | Method and device for cleaning and then bonding substrates The invention relates to a method and to a device for cleaning and then bonding substrates. According to the invention, at least two opposite substrates are obliquely or vertically sprayed with a cleansing liquid by means of at least one nozzle and are preferably dr... | 01/30/2007 |
| 7160429 | Electrochemically fabricated hermetically sealed microstructures and methods of and apparatus for producing such structures In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered struct... | 01/09/2007 |
| 7146712 | Pattern forming method and method of making microdevice A metal film made of a metal material (e.g., NiFe, CoFeNi, or FeCo) including an iron atom is formed on a substrate (S101). Subsequently, the metal film formed on the substrate is plasma-processed in an environment including a gas (e.g., an oxygen gas having ... | 12/12/2006 |
| 7125477 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 10/24/2006 |
| 7122106 | Electrosynthesis of nanofibers and nano-composite films A method for producing an array of oriented nanofibers that involves forming a solution that includes at least one electroactive species. An electrode substrate is brought into contact with the solution. A current density is applied to the electrode substrate that i... | 10/17/2006 |
| 7119008 | Integrating metal layers with ultra low-K dielectrics In forming a layer of a semiconductor wafer, a dielectric layer is deposited on the semiconductor wafer. The dielectric layer includes material having a low dielectric constant. Recessed and non-recessed areas are formed in the dielectric layer. A metal layer is dep... | 10/10/2006 |
| 7112270 | Algorithm for real-time process control of electro-polishing Method and apparatus for process control of electro-processes. The method includes electro-processing a wafer by the application of two or more biases and determining an amount of charge removed as a result of each bias, separately. In one embodiment, an endpoint is... | 09/26/2006 |
| 7098505 | Memory device with multiple memory layers of local charge storage A multiple memory layer device has a plurality of stacked memory layers. Each of the memory layers has: a charge generating layer of p-type semiconductor material with a plurality of n-type diffusion regions; an insulating layer disposed over the charge generating l... | 08/29/2006 |
| 7087315 | Method for forming plating film A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th... | 08/08/2006 |
| 7077721 | Pad assembly for electrochemical mechanical processing Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A... | 07/18/2006 |
| 7070687 | Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing Apparatus and method for treating a surface of a substrate for electrolytic or electroless plating of metals in integrated circuit manufacturing. In one embodiment the method includes forming a barrier layer on a substrate. A metal-seed layer is then formed on the b... | 07/04/2006 |
| 7066800 | Conductive polishing article for electrochemical mechanical polishing An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adap... | 06/27/2006 |
| 7045039 | Process for applying protective and decorative coating on an article A method for depositing a multi-layered protective and decorative coating on an article comprising first depositing at least one coating layer on the article by electroplating, removing the electroplated article from the electroplating bath and subjecting it to puls... | 05/16/2006 |
| 7029365 | Pad assembly for electrochemical mechanical processing Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an ... | 04/18/2006 |
| 7029597 | Anodized aluminum etching process and related apparatus A process for selectively etching a surface of an anodized aluminum article. A preferred process includes: providing an aluminum sheet or web including first and second sides having anodized finishes; etching the first side to improve the adhesion capabilities of th... | 04/18/2006 |
| 7025869 | Nitric oxide delivery system Inhalation of low levels of nitric oxide can rapidly and safely decrease pulmonary hypertension in mammals. Precise delivery of nitric oxide at therapeutic levels of 20 to 100 ppm and inhibition of reaction of nitric oxide with oxygen to form toxic impurities such a... | 04/11/2006 |
| 7011737 | Titania nanotube arrays for use as sensors and method of producing An electrical resistive device, including: an array of titania nanotubes open at an outwardly-directed end formed by anodizing at least a portion of a titanium layer; a plurality of palladium (or other noble metal) clusters having been deposited atop the nanotube ar... | 03/14/2006 |
| 7011738 | Activation of a cathode The present invention relates to a method for activation of a cathode comprising at least a cathode substrate wherein the cathode is cleaned by means of an acid, the cleaned cathode is coated with at least one electrocatalytic coating solution, drying the coated cat... | 03/14/2006 |
| 6989087 | Metal finishes A method of forming a surface finish of trivalent chromium on metal or plastics substrates by electrodeposition from an aqueous plating solution of trivalent chromium ions in which the trivalent chromium is deposited on a layer of silver or silver alloy whereby the ... | 01/24/2006 |
| 6979248 | Conductive polishing article for electrochemical mechanical polishing An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coat... | 12/27/2005 |
| 6974767 | Chemical solution for electroplating a copper-zinc alloy thin film A method of fabricating a semiconductor device, having a Cu—Zn alloy thin film (30) formed on a Cu surface (20) by electroplating the Cu surface (20) in a unique chemical solution containing salts of zinc (Zn) and copper (Cu), their complexing... | 12/13/2005 |
| 6962524 | Conductive polishing article for electrochemical mechanical polishing Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupl... | 11/08/2005 |
| 6932896 | Method and apparatus for avoiding particle accumulation in electrodeposition Systems and methods to remove or lessen the size of metal particles that have formed on, and to limit the rate at which metal particles form or grow on, workpiece surface influencing devices used during electrodeposition are presented. According to an exemplary meth... | 08/23/2005 |
| 6930045 | Cross reference to related application The method comprises the step of forming a diffusion preventing film 16 and an insulation film 18 on an insulation film 12 formed on a substrate 10 and having a Cu interconnection layer 14 buried in; the step of forming a contact h... | 08/16/2005 |
| 6905588 | Packaging deposition methods The present invention relates to a method for fabricating high performance chip interconnects and packages by providing methods for depositing a conductive material in cavities of a substrate in a more efficient and time saving manner. This is accomplished by select... | 06/14/2005 |
| 6905587 | Method for enhancing the solderability of a surface A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty a... | 06/14/2005 |
| 6887367 | Process for the coating of passivated metallic surfaces of components and such coated components The invention relates to a process which is suitable for applying a permanently adhering, stable, dirt and water repellent coating to metallic surfaces, specifically chromium surfaces, specifically sanitary and kitchen fixtures, and also to the components coated in ... | 05/03/2005 |
