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| Number | Title | Issue Date |
| 7270734 | Near neutral pH cleaning/activation process to reduce surface oxides on metal surfaces prior to electroplating The invention relates to a method for electroplating a metal deposit on electroplatable portions of composite articles that have both electroplatable and non-electroplatable portions. In this method, the invention is an improvement which comprises treating the artic... | 09/18/2007 |
| 7144783 | Reducing gate dielectric material to form a metal gate electrode extension In a metal gate replacement process, a cup-shaped gate metal oxide dielectric may have vertical portions that may be exposed to a reduction reaction. As a result of the reduction reaction, the vertical portions may be converted to metal, which adds to the existing g... | 12/05/2006 |
| 7128821 | Electropolishing method for removing particles from wafer surface An electropolishing method for removing potential device-contaminating particles from a wafer, is disclosed. The method includes immersing the wafer in an electropolishing electrolyte solution and removing defects and particles from the wafer by rotational friction ... | 10/31/2006 |
| 7041820 | Process for producing (dioxolenon-4-yl)methyl ester derivative There is provided a method by which various compounds (1) having a carboxyl group in the molecule have the carboxyl group converted to a (dioxolenon-4-yl)methyl ester at low cost, in a simple way and at high yield. The process for producing compounds of formu... | 05/09/2006 |
| 7011738 | Activation of a cathode The present invention relates to a method for activation of a cathode comprising at least a cathode substrate wherein the cathode is cleaned by means of an acid, the cleaned cathode is coated with at least one electrocatalytic coating solution, drying the coated cat... | 03/14/2006 |
| 6986838 | Nanomachined and micromachined electrodes for electrochemical devices A nanomachined and micromachined electrode (10) is disclosed that is produced by providing a layer of aluminum (11) positioned upon a conductive substrate (12), anodizing the layer of aluminum to produce a layer of aluminum oxide (13) hav... | 01/17/2006 |
| 6878261 | Surface treatment method of copper foil with silane coupling agent A surface treatment method for increasing adhesion of a surface of copper foil to an insulating epoxy-impregnated substrate used in printed circuit boards is provided. The method includes nodularizing a surface of an electrolytic copper foil, surface-treating the su... | 04/12/2005 |
| 6777108 | Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil To control peel strength at an organic release interface between a carrier foil and a copper-microparticle layer which constitute an electrodeposited copper foil with carrier. In the present invention, (1) a barrier copper layer is formed on the release interface la... | 08/17/2004 |
| 6758956 | Method for darkening a superficial layer which contains zinc and which is of a material piece The invention relates to a method for darkening a superficial layer of a workpiece which contains zinc by anodic oxidation. The workpiece is oxidized in a soaking bath containing an aqueous solution comprised of a hydroxide and of a nitrate. The anodic oxidation may... | 07/06/2004 |
| 6755958 | Barrier layer for electrical connectors and methods of applying the layer A cooper or copper alloy electrical contact member is treated by electroplating a barrier layer on a contact surface of the member, the barrier layer having a thickness ranging from about 0.00001 inch to about 0.0001 inch, and the barrier layer is selected from the ... | 06/29/2004 |
| 6638411 | Method and apparatus for plating substrate with copper The present invention relates to a method and apparatus for separating out metal copper according to an electroplating of copper using, for example, a solution of copper sulfate to produce copper interconnections on a surface of a substrate. The substrate... | 10/28/2003 |
| 6610417 | Nickel coated copper as electrodes for embedded passive devices The invention relates to the manufacture of metal foil electrodes useful in the manufacture of printed circuit boards having passive circuit components such as capacitors, resistors or inductors configured in a planar orientation. A copper foil is coated ... | 08/26/2003 |
| 6572754 | Method for producing a tin film on the inner surface of hollow copper alloy components A method for producing an inner tin film on the surface of plumbing components, such as those made of red brass or yellow brass, for drinking water supply. The lead content on the inner surface of the hollow component parts is first reduced by treatment w... | 06/03/2003 |
| 6555170 | Pre-plate treating system The invention relates in general to a method of electroplating substrates where at least a portion of the substrate is coated with a solution containing a film forming amine and sufficient acid to produce a pH of less than 6.5. The acid helps to clean the... | 04/29/2003 |
| 6485618 | Integrated copper fill process A target and magnetron for a plasma sputter reactor. The target has an annular vault facing the wafer to be sputter coated. Various types of magnetic means positioned around the vault create a magnetic field supporting a plasma extending over a large volu... | 11/26/2002 |
| 6419811 | Method for surface treatment of copper foil Disclosed is a process of treating the surface of copper foil without using harmful elements such as arsenic, selenium and tellurium unlike in the prior art. It is possible to, in an easy way, obtain a uniform rough condition and low roughness and produce... | 07/16/2002 |
| 6391181 | Articles having a colored metallic coating and process for their manufacture An article includes a colored electroplated metallic coating comprising both nickel and zinc, on an underplate of copper, brass, bright nickel or matt nickel, supported on a metallic or plastic substrate, various colors in the electroplated coating being ... | 05/21/2002 |
| 6274008 | Integrated process for copper via filling A target and magnetron for a plasma sputter reactor. The target has an annular vault facing the wafer to be sputter coated. Various types of magnetic means positioned around the vault create a magnetic field supporting a plasma extending over a large volu... | 08/14/2001 |
| 6218080 | Plated flat metal gap for very narrow recording heads It has been observed that plated structures grown inside molds for small objects, such as a gap structure in a magnetic read head, often have curved rather than planar surfaces. This problem has been overcome as follows. Prior to laying down photoresist f... | 04/17/2001 |
| 6086743 | Adhesion enhancement for metal foil In one embodiment, the present invention relates to a method of treating metal foil including sequentially contacting the metal foil with a metal foil oxidizer solution containing water and at least about 7 ppm dissolved oxygen, contacting the metal foil ... | 07/11/2000 |
| 5885436 | Adhesion enhancement for metal foil In one embodiment, the present invention relates to a method of treating metal foil including sequentially contacting the metal foil with a first solution containing a metal foil oxidizer and less than about 5 g/l of a hydroxide compound, contacting the m... | 03/23/1999 |
| 5858557 | Nickel/gold plating of a copper-refractory metal material A copper-tungsten or copper-molybdenum substrate is plated with a nickel/gold plating by first activating a surface of the substrate. In activating, the surface is contacted to a concentrated alkaline solution at elevated temperature, and then to a concen... | 01/12/1999 |
| 5792333 | Method of surface-roughening treatment of copper foil A method of surface-roughening a copper foil by subjecting at least one side of the copper foil to electro-plating using an alternating current, wherein a sulfuric acid bath or a sulfuric acid-copper sulfate bath is used as an electrolyte.... | 08/11/1998 |
| 5788824 | Process for conditioning the copper or copper-alloy external surface of an element of a mold for the continuous casting of metals, of the type including a nickel plating step and a nickel removal step The subject of the invention is a process for conditioning the copper or copper-alloy external surface of an element of a mold for the continuous casting of metals, of the type including a step of nickel plating of said surface and a step of nickel remova... | 08/04/1998 |
| 5714052 | Method for producing brochantite patina on copper A passthrough method is provided in which the surface of an industrial grade, low-grease precursor made of copper, with a defined surface roughness, is patinated. For this purpose the precursor material, connected as the anode, is passed through an electr... | 02/03/1998 |
| 5637205 | Process for the electrolytical coating of an object of steel on one or both sides The invention describes a process for the electrolytical coating of an object of steel on one or both sides. Preferably, the object is a steel strip with zinc or a zinc iron alloy. Zinc or a zinc iron alloy is deposited on the object when the object is co... | 06/10/1997 |
| 5630933 | Processes involving metal hydrides Metal hydrides are activated by an electrochemical procedure. In this procedure, a bulk sample of the corresponding metal is immersed in an aqueous electrolyte and contacted by a cathode. Current passed through the aqueous electrolyte causes electrolysis ... | 05/20/1997 |
| 5578186 | Method for forming an acrylic resist on a substrate and a fabrication process of an electronic apparatus A method for forming an acrylic resist on a surface of a copper layer includes the steps of processing a surface of the copper layer by an ammonia water, and depositing a layer of acrylic resist on the surface of the copper layer after a processing by the... | 11/26/1996 |
| 5336391 | Method for producing a circuit board material employing an improved electroplating bath An improved circuit board material having a support layer, an electrical resistance layer and a conductive layer. The circuit board material has a resistance of at least about 500 ohms/square. The circuit board material is formed by electro-plating the el... | 08/09/1994 |
| 5320737 | Treatment to reduce solder plating whisker formation The formation of whiskers during tin or tin-lead solder electroplating of a copper base alloy substrate in a methane sulfonate solder plating bath is inhibited by passivating the surface of the substrate prior to electroplating. Preferred passivating solu... | 06/14/1994 |
| 5269904 | Single tank de-oxidation and anodization process The invention is a single-bath electrolytic de-oxidation and anodization process in which a workpiece surface such as an aluminum surface is electrolytically de-oxidized and then anodized to form an adhesive oxide layer in the same electrolytic chemical b... | 12/14/1993 |
| 5250363 | Chromium-zinc anti-tarnish coating for copper foil having a dark color A technique for improving the tarnish and oxidation resistance of metallic substrate is disclosed. The substrate is immersed in an aqueous solution containing sodium hydroxide, zinc ions and chromium (VI) ions. Either the temperature of the aqueous soluti... | 10/05/1993 |
| 5167794 | Method for producing lead frame material The present invention relates to a lead frame material for a semiconductor, which comprises a copper or copper alloy matrix having a layer obtained by applying an Ag-plating of a thickness of from 0.005 to 0.5 μm on the surface of the matrix and diffusin... | 12/01/1992 |
| 5108555 | Electrode for electrical discharge machining and process for manufacturing the same Disclosed is an electrode for electrical discharge used for diesinking, comprising an electrode member produced by subjecting a base and binder of gypsum hemihydrate powder and a filler of conductive metal powder to modeling and/or molding and setting int... | 04/28/1992 |
| 5022968 | Method and composition for depositing a chromium-zinc anti-tarnish coating on copper foil A technique for improving the tarnish and oxidation resistance of copper and copper based alloy materials is disclosed. Copper or a copper alloy is immersed in an aqueous solution containing sodium hydroxide, zinc ions and chromium (VI) ions. While the co... | 06/11/1991 |
| 4968392 | Treatment of condenser tubes The treatment of the external surfaces of condenser tubes, such as those used in power station condenser plants, with certain inorganic chemical compounds renders those surfaces or parts thereof sufficiently water-repellent so as to prevent the formation ... | 11/06/1990 |
| 4759829 | Device header and method of making same A device header with a multilayer coating overlying its entire surface, and a method of making said header, are disclosed. The multilayer coating comprises an electrolytic nickel layer and a gold layer in the device mounting area of the header, whereas th... | 07/26/1988 |
| 4654116 | Method for producing high resolution etched circuit patterns from clad laminates A method for producing high resolution etched circuit patterns from a metal clad laminate of a conductive species on a nonconductive substrate is provided. The laminate is etched with an etchant solution for the conductive species to form a circuit patter... | 03/31/1987 |
| 4614568 | High-speed silver plating and baths therefor A high-speed silver plating solution for electroplating silver on a substrate which consists of a less-noble metal, such as copper, copper alloy, copper-plated base metal, iron, ferroalloy, nickel, or nickel alloy, characterized in that a cyclic compound ... | 09/30/1986 |
| 4604167 | Silver plating solution and silver plating process and pretreatment solution therefor A cyclic thion compound is incorporated as an anti-immersion agent into a cyanide-containing silver plating solution for use in silver plating onto a copper or copper alloy surface or into a pre-dipping solution for use in treating the copper or copper al... | 08/05/1986 |
