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| Number | Title | Issue Date |
| 8012332 | Plating apparatus and method An apparatus forms a plated film in fine trenches and plugs for interconnects and in the openings of a resist formed in the surface of a substrate such as a semiconductor wafer, and forms bumps (protruding electrodes) on the surface of a semiconductor wafer. The app... | 09/06/2011 |
| 7988843 | Method and apparatus for electrochemical plating semiconductor wafers A method of electroplating conductive material on semiconductor wafers controls undesirable surface defects by reducing the electroplating current as the wafer is being initially immersed in a plating bath. Further defect reduction and improved bottom up plating of ... | 08/02/2011 |
| 7909977 | Method of manufacturing a substrate for a microelectronic device, and substrate formed thereby A method of manufacturing a substrate for a microelectronic device comprises providing a dielectric material (120, 220, 920) as a build-up layer of the substrate, applying a primer (140, 240, 940) to a surface (121, 221, 921) of the dielectric m... | 03/22/2011 |
| 7820026 | Method to deposit organic grafted film on barrier layer Generally, the process includes depositing a barrier layer on a feature formed in a dielectric layer, decorating the barrier layer with a metal, performing a grafting process, initiating a copper layer and then filing the feature by use of a bulk copper fill process... | 10/26/2010 |
| 7695605 | Tin plating method A method for plating tin or a tin alloy on a substrate such that whiskers are prevented form forming or the number of whickers is reduced in number as well as size. ... | 04/13/2010 |
| 7370415 | Manufacturing method of ink-jet head A method for manufacturing an inkjet print head with ink channels formed on a member including a piezoelectric body, and where ink is jetted from each of the ink channels by applying a voltage to electrodes provided on the piezoelectric body for each of the ink chan... | 05/13/2008 |
| 7358185 | Device having contact pad with a conductive layer and a conductive passivation layer A method and apparatus is disclosed for sequential processing of integrated circuits, particularly for conductively passivating a contact pad with a material which resists formation of resistive oxides. In particular, a tank is divided into three compartments, each ... | 04/15/2008 |
| 7341633 | Apparatus for electroless deposition Embodiments of the invention generally provide a fluid processing platform. The platform includes a mainframe having a substrate transfer robot, at least one substrate cleaning cell on the mainframe, and at least one processing enclosure. The processing enclosure in... | 03/11/2008 |
| 7273537 | Method of production of metal particles through electrolysis A method of producing metal particles through electrolysis. A cathode having a plurality of active zones on a surface thereof is at least partially immersed in a reaction solution. The cathode is spaced from an anode also at least partially immersed in the reaction ... | 09/25/2007 |
| 7254503 | Light source wavelength correction A wavelength correction function provides corrected reflectance values from actual reflectance values taken in a reflectance-base instrument. The correction is provided as a function of measured reflectance values and a predefined set of high resolution reflectance ... | 08/07/2007 |
| 7240419 | Method of manufacturing a magnetoresistance effect element A method of manufacturing a magnetoresistance effect element includes forming an insulating layer on a first ferromagnetic layer, forming an aperture reaching the first ferromagnetic layer by thrusting a needle from the top surface of the insulating layer, and depos... | 07/10/2007 |
| 7235165 | Electroplating solution and method for electroplating An electroplating solution may be formulated as an aqueous solution of oxalic acid, trisodium phosphate and ammonium sulfate. Such solutions may be used for both brush plating and bath plating, and are suitable for use with a variety of plating metals and substrate ... | 06/26/2007 |
| 7235167 | Method for the manufacture of corrosion resistant and decorative coatings and laminated systems for metal substrates A method for the preparation of corrosion-resistant and decorative coatings and layer systems for substrates of metals, preferably light metals. Also, method for the production of a coating and a layer system for substrates of metal, with which a decorative and corr... | 06/26/2007 |
| 7228619 | Method of manufacturing a magnetic head with common seed layer for coil and pedestal A method for fabricating a coil and pedestal for a write head using a common seed layer is described. A nonmetallic gap layer is deposited on a planarized pole piece surface. Openings for the pole piece pedestal and the back gap pole piece are etched through the non... | 06/12/2007 |
| 7226860 | Method and apparatus for fabricating metal layer A method of electrochemical deposition (ECD) provides a barrier and a seed layer on a substrate. The surfaces of the substrate are pre-treated before a metal layer is electrochemically deposited thereon in an electrochemical plating cell with a physical or a chemica... | 06/05/2007 |
| 7217353 | Method and apparatus for plating substrate After bubbles adsorbed to a substrate are removed by rotating the substrate in a plating solution at a higher speed or after the wettability of the surface of the substrate to be plated is improved before the substrate is immersed in the plating solution, the substr... | 05/15/2007 |
| 7214305 | Method of manufacturing electronic device Disclosed is a method of manufacturing an electronic device, comprising forming a concave portion on the surface of a base member, forming an electrically conductive seed layer on that surface of the base member on which a plated film is to be formed, and applying a... | 05/08/2007 |
| 7201830 | Anode for oxygen evolution and relevant substrate The invention concerns an anode for gas evolution in electrochemical applications comprising a titanium or other valve metal substrate characterized by a surface with a low average roughness, having a profile typical of a localized attack on the crystal grain bounda... | 04/10/2007 |
| 7192509 | Process for producing a metal structure in foam form, a metal foam, and an arrangement having a carrier substrate and a metal foam Process for producing a metal structure in foam form, including the steps of providing a nonconductive substrate having a foamed structure, applying conductive particles to the substrate, so that the conductive particles are fixed to the entire surface of the substr... | 03/20/2007 |
| 7175920 | Copper foil for high-density ultra-fine printed wiring board The present invention is to provide an ultra-thin copper foil with a carrier which comprises a release layer, a diffusion preventive layer and a copper electroplating layer laminated in this order, or a diffusion preventive layer, a release layer and a copper electr... | 02/13/2007 |
| 7169286 | Process control methods of electropolishing for metal substrate preparation in producing YBCO coated conductors Disclosed is a reel-to-reel substrate tape polishing and cleaning system including precleaning, electropolishing section and post cleaning sections and which is suitable for polishing and cleaning long lengths of metal substrate tape used in the manufacture of HTS-c... | 01/30/2007 |
| 7166941 | Electroplated stator bar end and fitting The interior of a stator bar clip that is joined to the end of a stator bar is electroplated so that a metallic barrier coating overlies the braze joint between the stator bar and the clip to define a seal at and around the joint that is substantially impermeable to... | 01/23/2007 |
| 7153410 | Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces Methods and apparatuses for electrochemical-mechanical processing of microelectronic workpieces. One embodiment of an electrochemical processing apparatus in accordance with the invention comprises a workpiece holder configured to receive a microelectronic workpiece... | 12/26/2006 |
| 7144492 | Assembly comprised of joined conductive components having cataphoretic paint layer and process for manufacture thereof The application of anti-corrosion base coating by cataphoretic painting (KTL) is well known in manufacturing automobile body parts. However the cataphoretic paint can penetrate only incompletely or possibly not at all into the gap in the contact areas of the compone... | 12/05/2006 |
| 7129603 | Corrosion protective coating for extending the lifetime of water cooled stator bar clips A water-cooled stator bar clip for electrical generators and a method for applying a corrosion-resistant protective coating, preferably Sc, Ti, Cr, Zr, Nb, Mo, Hf, Ta, W, Ni, and Al, and their alloys or oxides to existing stator bar end fittings in order to signific... | 10/31/2006 |
| 7122106 | Electrosynthesis of nanofibers and nano-composite films A method for producing an array of oriented nanofibers that involves forming a solution that includes at least one electroactive species. An electrode substrate is brought into contact with the solution. A current density is applied to the electrode substrate that i... | 10/17/2006 |
| 7118664 | Plating method and apparatus The present invention provides a plating method and apparatus, which is capable of introducing plating solution into the fine channels and holes formed in a substrate without needing to add a surface active agent to the plating solution, and capable of forming a hig... | 10/10/2006 |
| 7095070 | Method for fabricating Bi thin film and device using the same In a method for fabricating a Bi thin film having a great MR (magnetoresistance) at room temperature and a method for fabricating a spintronics device using the same, the Bi thin film is fabricated by an electrodepostiting method and a sputtering method and has very... | 08/22/2006 |
| 7070687 | Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing Apparatus and method for treating a surface of a substrate for electrolytic or electroless plating of metals in integrated circuit manufacturing. In one embodiment the method includes forming a barrier layer on a substrate. A metal-seed layer is then formed on the b... | 07/04/2006 |
| 7060364 | Film carrier tape for mounting electronic devices thereon A film carrier tape for mounting electronic components or devices that excels in not only migration resistance but also adhesiveness of wiring to insulating film; and a process for producing the same. The film carrier tape for mounting electronic components or devic... | 06/13/2006 |
| 7033466 | Electrochemical stripping using single loop control The present invention relates to a control loop to be used in a system for stripping a coating from a part. The control loop comprises an electrometer for measuring a potential between the part and a reference electrode and generating a voltage output signal, an ope... | 04/25/2006 |
| 7029565 | Method of producing optical element forming die A method of producing a die for forming an optical element including; a positioning step to fix temporarily under the state wherein a plurality of members at least one of which has a die transfer surface are positioned with their connection surfaces being put to fac... | 04/18/2006 |
| 7029529 | Method and apparatus for metallization of large area substrates A system and method for processing large area substrates. In one embodiment, a system for processing large area substrates includes prep station, a stamping station and a stamp that is automatically moved between the stamping station and the prep station. The stampi... | 04/18/2006 |
| 7022210 | Locally-distributed electrode and method of fabrication A locally distributed electrode is made by placing a conducting metallic oxide layer and a counter electrode in contact with a noble metal electroplating solution and applying a negative potential to the metallic oxide layer relative to the counter electrode, such t... | 04/04/2006 |
| 7018482 | Method of manufacturing electronic devices, and apparatus for carrying out such a method A method of manufacturing electronic devices, in particular, but not exclusively, semiconductor devices, and apparatus for carrying out such a method, in which method wafers 1, which are provided at a surface 2 with a material 3 to be removed, a... | 03/28/2006 |
| 7011738 | Activation of a cathode The present invention relates to a method for activation of a cathode comprising at least a cathode substrate wherein the cathode is cleaned by means of an acid, the cleaned cathode is coated with at least one electrocatalytic coating solution, drying the coated cat... | 03/14/2006 |
| 7005192 | Ceramic electronic component and method of producing the same A ceramic electronic component having a ceramic member into which no plating intrudes, and a method of producing the ceramic electronic component by which the ceramic electronic component can be easily produced are provided. The ceramic electronic component contains... | 02/28/2006 |
| 7001641 | Seed layer treatment Seed layer treatment to remove impurities in the seed layer that might lead to the formation of voids in interconnect circuit features. In one embodiment, the seed layer is heated in a reducing environment. In another embodiment, the seed layer is washed with a surf... | 02/21/2006 |
| 6997787 | Process for copper free chrome plating of a vehicle wheel surface A cutting tool having a hard tip is pressed with a uniform pressure against a surface of a vehicle wheel as the wheel is rotated to smooth and seal the surface. The smoothed and sealed wheel surface is then chrome plated with a process that includes applying a nicke... | 02/14/2006 |
| 6994919 | Brazing product and method of manufacturing a brazing product The invention relates to a brazing sheet product including a core sheet, on at least one side of the core sheet a clad layer of an aluminum alloy including silicon in an amount in the range of 4 to 14% by weight, and further including on at least one outersurface of... | 02/07/2006 |
