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Vehicular Impact Signaling Device
An apparatus for the deployment of a visible plume to alert other motorists that a proximate motor vehicle has been involved in a collision.
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| Number | Title | Issue Date |
| 7959782 | Method of manufacturing a Ni-Pt alloy A Ni—Pt alloy and target superior in workability containing 0.1 to 20 wt % Pt and having a Vickers hardness of 40 to 90. A method of manufacturing the Ni—Pt alloy comprises steps of subjecting a raw material Ni having a purity of 3N level to electrochemical diss... | 06/14/2011 |
| 7425257 | Method for the formation of a good contact surface on a cathode support bar and support bar The disclosure relates to a method of obtaining a good current contact on the support bar of a cathode used in electrolysis. In this method a highly electroconductive layer is formed on the contact piece on the end of the support bar of the cathode, especially at th... | 09/16/2008 |
| 7371428 | Duplex gas phase coating Method of forming different diffusion aluminide coatings on different surface regions of the same superalloy substrate involves positioning the substrate in a coating chamber having a aluminum-bearing coating gas flowing therein with a first substrate surface region... | 05/13/2008 |
| 7357958 | Methods for depositing gamma-prime nickel aluminide coatings Methods for depositing an overlay coating on articles intended for use in hostile thermal environments. The coating has a predominantly gamma prime-phase nickel aluminide (Ni3Al) composition suitable for use as an environmental coating and as a bond coat ... | 04/15/2008 |
| 7311615 | Golf club head with ceramic layer A hollow club head having an aluminum alloy base material covered with another material layer of Ni or Ni/P with ceramic granules. The thickness of the material layer on the striking face is thicker than on the rest of the club head. The material layer has a hardnes... | 12/25/2007 |
| 7273538 | Surface mountable laminated circuit protection device and method of making the same A surface mountable laminated circuit protection device comprises a first metal layer including a first unit and a second unit, a first insulating layer disposed on the first metal layer, and a second metal layer disposed on the first insulated layer. There is also ... | 09/25/2007 |
| 7223323 | Multi-chemistry plating system Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainfram... | 05/29/2007 |
| 7208074 | Substrate processing apparatus and substrate plating apparatus A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a s... | 04/24/2007 |
| 7204925 | Structure and method of preventing electrolytic corrosion for magnesium alloy member A structure and a method of preventing electrolytic corrosion for a magnesium alloy member (20), the structure wherein a first coated layer (11) formed by electro deposition and a second coated layer (12) formed by distributing PTFE particles on... | 04/17/2007 |
| 7157114 | Platinum coating process A process for depositing pure platinum on a substrate is disclosed. In accordance with one embodiment, the process comprises applying a solution consisting of Pt(acetylacetonate)2 and ethanol or acetone onto a substrate and wrapping at least a portion of ... | 01/02/2007 |
| 7156904 | Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby An aqueous copper-to-resin bonding layer solution comprising: (a) at least one acid type; (b) tin salt or tin oxide; (c) salt or oxide of at least one type of metal selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cob... | 01/02/2007 |
| 7153590 | Composite copper foil and manufacturing method thereof A composite copper foil (10) comprises a carrier foil (12) formed by electrodeposition onto a cathode, the carrier foil (12) having a cathode side formed in contact with the cathode and an opposite electrolyte side. A very thin release layer ( | 12/26/2006 |
| 7087315 | Method for forming plating film A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th... | 08/08/2006 |
| 7069641 | Method for preparing composite materials of a positive temperature coefficient thermistor The present invention discloses a method for preparing a conductive polymeric composite material having carbon black utilized to a structure for composite materials of a positive temperature coefficient thermistor. The method first provides a metal laminated materia... | 07/04/2006 |
| 7052779 | Copper foil for fine pattern printed circuits and method of production of same Copper foil for fine pattern printed circuits having a sufficient bond strength with a resin substrate, eliminating the problems of residual copper, erosion at the bottom portions of the circuit lines, etc. at the time of formation of fine patterns, and superior in ... | 05/30/2006 |
| 7029761 | Bonding layer for bonding resin on copper surface A bonding layer for bonding resin is provided that is formed on a copper surface, and contains an alloy of: (a) copper; (b) tin; and (c) at least one type of metal (third metal) selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromi... | 04/18/2006 |
| 7011737 | Titania nanotube arrays for use as sensors and method of producing An electrical resistive device, including: an array of titania nanotubes open at an outwardly-directed end formed by anodizing at least a portion of a titanium layer; a plurality of palladium (or other noble metal) clusters having been deposited atop the nanotube ar... | 03/14/2006 |
| 6998151 | Method for applying a NiAl based coating by an electroplating technique The present invention provides a method to coat an article using a plating process, either electroless or electrolytic, whereby nickel is plated on the article using a solution that includes a suspension of powders or containing one or more of the following elements... | 02/14/2006 |
| 6942781 | Method for electroplating a strip of foam A method for electroplating a strip of foam having two opposite sides and an electrically conductive surface, including: (a) continuously applying the strip of foam onto a moving cathode immersed in an electroplating bath so that the strip travels through the... | 09/13/2005 |
| 6932897 | Titanium-containing metals with adherent coatings and methods for producing same A method for plating a titanium-containing metal, comprising the steps of: (a) surface treating the titanium-containing metal in a solution consisting essentially of an aqueous solvent and hydrochloric acid for a period of time sufficient to activate the surface of ... | 08/23/2005 |
| 6923897 | Method for producing electrolytically coated cold rolled strip, preferably for use in the production of battery sheaths, and battery sheath produced according to this method The invention relates to a method for producing an electrolytically coated cold rolled strip, preferably for use in the production of battery sheaths. The cold rolled strip is provided with a cobalt or a cobalt alloy layer by an electrolytic method. The aim of the i... | 08/02/2005 |
| 6913791 | Method of surface treating titanium-containing metals followed by plating in the same electrolyte bath and parts made in accordance therewith A method for surface treating a titanium-containing metal, comprising the steps of: (a) treating at least a portion of a surface of the titanium-containing metal with an anodic activation in an electrolyte bath; and (b) strike plating at least a portion of the surfa... | 07/05/2005 |
| 6866765 | Electrolytic copper-plated R-T-B magnet and plating method thereof An R-T-B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray diffraction peak intensity I(200) from the (200) plane to the X-ray diffraction... | 03/15/2005 |
| 6855376 | Process of direct growth of carbon nanotubes on a substrate at low temperature Carbon nanotubes are directly grown on a substrate surface having three metal layers thereon by a thermal chemical vapor deposition at low-temperature, which can be used as an electron emission source for field emission displays. The three layers include a layer of ... | 02/15/2005 |
| 6824665 | Seed layer deposition Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures. ... | 11/30/2004 |
| 6790481 | Corrosion-resistant heat exchanger A corrosion-resistant, copper-finned heat exchanger for a water heater is provided. The heat exchanger includes a conduit through which water runs, heat-transfer fins extending from the conduit and an anti-corrosive coating containing electroless nickel. The heat-tr... | 09/14/2004 |
| 6783653 | Solar selective absorption coatings A new class of solar selective absorption coatings are disclosed. These coatings comprise a structured metallic overlayer such that the overlayer has a sub-micron structure designed to efficiently absorb solar radiation, while retaining low thermal emissivity for in... | 08/31/2004 |
| 6755958 | Barrier layer for electrical connectors and methods of applying the layer A cooper or copper alloy electrical contact member is treated by electroplating a barrier layer on a contact surface of the member, the barrier layer having a thickness ranging from about 0.00001 inch to about 0.0001 inch, and the barrier layer is selected from the ... | 06/29/2004 |
| 6656339 | Method of forming a nano-supported catalyst on a substrate for nanotube growth Methods of forming a nano-supported catalyst on a substrate and at least one carbon nanotube on the substrate are comprised of configuring a substrate with an electrode (102), immersing the substrate with the electrode into a solvent containing a first me... | 12/02/2003 |
| 6652914 | Method for selective surface protection of a gas turbine blade which has previously been in service A gas turbine blade which has previously been in service is protected by cleaning the gas turbine blade, and then first depositing a platinum first layer on the airfoil and the platform of the gas turbine blade. Thereafter, a platinum second layer is depo... | 11/25/2003 |
| 6645549 | Process for providing bond enhancement and an etch resist in the fabrication of printed circuit boards A process for providing bond enhancement and an etch resist for a printed circuit board is provided. A sheet comprising at least a layer of copper is immerses in a first immersion tin solution comprising a tin metal and a complexing agent in an acidic med... | 11/11/2003 |
| 6632342 | Methods of fabricating a microstructure array In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the ... | 10/14/2003 |
| 6589414 | Nitride layer forming methods Nitride layer formation includes a method wherein a material is electrodeposited on a substrate and converted, at least in part, to a layer comprising nitrogen and the electrodeposited material. The electrodepositing may occur substantially selective on a... | 07/08/2003 |
| 6579568 | Copper foil for printed wiring board having excellent chemical resistance and heat resistance This invention provides a copper foil for a printed wiring board, which comprises a copper foil, an alloy layer (A) comprising copper, zinc, tin and nickel which is formed on a surface of the copper foil, said surface to be brought into contact with a sub... | 06/17/2003 |
| 6565931 | Corrosion protective coating for a metallic article and a method of applying a corrosion protective coating to a metallic article The present invention provides for an etch and mar resistant low VOC clear coating composition most suitable for use as a top clear coat in multi-layered OEM or refinish automotive coatings. The coating composition includes isocyanate, carbonate and melam... | 05/20/2003 |
| 6521113 | Method of improving the oxidation resistance of a platinum modified aluminide diffusion coating An electrolyte for use in electrolytic platinum plating that results in reduced Cl, S, or P contaminant production. The bath comprises 0.01 to 320 g/lit of platinum in the form of the platinum salt dinitrodiammine platinum, Pt(NH3)2 ... | 02/18/2003 |
| 6475644 | Radioactive coating solutions methods, and substrates Radioactive coating solutions and sol-gels, and corresponding methods for making a substrate radioactive by the application of the radioactive coating solutions and sol-gels thereto. The radioactive coating solution comprises at least one carrier metal an... | 11/05/2002 |
| 6436265 | Microstructure array, and apparatus and method for forming the microstructure array, and a mold for fabricating a microstructure array A fabrication method of fabricating an array of microstructures is provided. The method includes the step of preparing a substrate with a surface including a usable region and a dummy region continuously set around the usable region, at least the usable r... | 08/20/2002 |
| 6319190 | Medicinal radioactive ruthenium radiation sources with high dosage rate and method for producing the same The invention relates to radioactive ruthenium sources with a dosage rate of at least 1.5 Gy/min at a distance (water) of 2 mm, consisting of an activity carrier and an encapsulation of the carrier made of a material compatible with the human body. A mult... | 11/20/2001 |
| 6269551 | Method of drying copper foil and copper foil drying apparatus A method employed to dry a copper foil having been subjected to various surface treatments, which method comprises irradiating at least one surface-treated side of the copper foil with near infrared rays to dry the copper foil, and an apparatus suitable t... | 08/07/2001 |
