Bizarre Patents
Behavior Modification Wristwatch
A wristwatch including a watch band and a watch body having an octagon shaped perimeter and being red in color and having the word STOP thereon to resemble a stop sign.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8118989 | Methods of bonding pure rhenium to a substrate Methods are provided for bonding pure rhenium to a substrate comprising a material. Non-lubricated components configured to have friction contact with another component are also provided. In an embodiment, by way of example only, a method includes disposing a eutect... | 02/21/2012 |
| 7976692 | Metallization process for making fuser members The presently disclosed embodiments are directed to an improved metallization process for making fuser members which avoids the extra steps of metal seeding or special substrate treatment. In embodiments, a metallized substrate, formed via a polycatecholamine-assist... | 07/12/2011 |
| 7405157 | Methods for the electrochemical deposition of copper onto a barrier layer of a work piece Methods are provided for electrochemically depositing copper on a work piece. One method includes the step of depositing overlying the work piece a barrier layer having a surface and subjecting the barrier layer surface to a surface treatment adapted to facilitate d... | 07/29/2008 |
| 7384532 | Platable coating and plating process A process that can be uniformly employed for electroplating a wide variety of different non-conductive substrates, including those that are non-platable or difficult-to-plate using conventional electroless and electrolytic plating techniques involves application of ... | 06/10/2008 |
| 7297451 | Black matrix, method for the preparation thereof, flat display device and electromagnetic interference filter employing the same A novel black matrix, a method for preparing the same, and a flat display device and an electromagnetic interference filter to which the black matrix is applied. The black matrix is prepared by exposing a photoactive compound to form a latent pattern of nuclei for c... | 11/20/2007 |
| 7255980 | Black matrix, method for preparing the same, and flat panel display and electromagnetic interference filter using the same A black matrix, a method for preparing the black matrix, a flat panel display and an electromagnetic interference filter using the black matrix. The black matrix may comprise a substrate, a titanium oxide layer, a Ni plating layer, and a Ni/Pd alloy layer. The metho... | 08/14/2007 |
| 7255782 | Selective catalytic activation of non-conductive substrates A process of providing a pattern of a metal on a non-conductive substrate to create loop antennae for wireless articles and for creating circuitry for smart cards, such as phone cards is provided. The method comprises the steps of catalyzing the non-conductive subst... | 08/14/2007 |
| 7244033 | Moistureproof optical device An optical device includes a first optical element including an incidence plane on which light from an object is incident, the incidence plane being in contact with the surrounding environment; a main body having an inside and housing the first optical element such ... | 07/17/2007 |
| 7220665 | H plasma treatment Electronic devices are constructed by a method that includes forming a first conductive layer in an opening in a multilayer dielectric structure supported by a substrate, forming a core conductive layer on the first conductive layer, subjecting the core conductive l... | 05/22/2007 |
| 7175920 | Copper foil for high-density ultra-fine printed wiring board The present invention is to provide an ultra-thin copper foil with a carrier which comprises a release layer, a diffusion preventive layer and a copper electroplating layer laminated in this order, or a diffusion preventive layer, a release layer and a copper electr... | 02/13/2007 |
| 7154044 | Flat cable conductor, method of making the same and flat cable using the same A flat cable conductor has: a conductor made of copper or a copper alloy; a first plating film made of tin and/or a tin-copper alloy, the first plating film being formed around the conductor; and a second plating film made of an alloy of tin and a third element sele... | 12/26/2006 |
| 7063779 | Method for manufacturing metal-coated optical fiber The optical fiber manufacturing method according to the present invention is characterized by having the steps of forming, on the peripheral surface of a bare fiber having been exposed by removing a resin cover and on which a metallic coating has not been provided, ... | 06/20/2006 |
| 6951604 | Production method for flexible printed board A flexible printed board production method which ensures higher adhesion of copper, excellent workability, easier continuous production and lower costs. The flexible printed board production method comprises the steps of: treating a surface of a polyimide resin film... | 10/04/2005 |
| 6946065 | Process for electroplating metal into microscopic recessed features Several techniques are described for reducing or mitigating the formation of seams and/or voids in electroplating the interior regions of microscopic recessed features. Cathodic polarization is used to mitigate the deleterious effects of introducing a substrate plat... | 09/20/2005 |
| 6924234 | Method and apparatus for polishing a copper layer and method for forming a wiring structure using copper In a method and apparatus for polishing a Cu metal layer and a method for forming Cu metal wiring, Cu oxide created by a surface oxidation of a Cu metal layer is removed from the wafer. The Cu metal layer, in which Cu oxide is removed, is polished. By polishing the ... | 08/02/2005 |
| 6905622 | Electroless deposition method Methods and apparatus are provided for forming a metal or metal silicide layer by an electroless deposition technique. In one aspect, a method is provided for processing a substrate including depositing an initiation layer on a substrate surface, cleaning the substr... | 06/14/2005 |
| 6902628 | Method of cleaning a coated process chamber component In a method of cleaning and refurbishing a process chamber component having a metal coating having a surface thereon, the surface of the metal coating is immersed in an acidic solution to remove at least a portion of the process deposits from the surface. Thereafter... | 06/07/2005 |
| 6875519 | Two-layer copper polyimide substrate A two-layer copper polyimide substrate includes a modified layer on the surface of a polyimide film having a thickness of not more than 200 Å, and preferably not less than 50 Å, as evaluated by a method by dyeing a section thereof with a silver nitrate aqueous s... | 04/05/2005 |
| 6827834 | Non-cyanide copper plating process for zinc and zinc alloys The invention consists of a method for producing an adherent copper coating on a zinc or zinc alloy article without the use of cyanide as a component of the process. The zinc or zinc alloy article is first immersed in an aqueous nickel pyrophosphate solution and is ... | 12/07/2004 |
| 6824666 | Electroless deposition method over sub-micron apertures An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble me... | 11/30/2004 |
| 6821324 | Cobalt tungsten phosphorus electroless deposition process and materials Materials and methods are described for electroless deposition of cobalt phosphorus and cobalt tungsten phosphorus, employing tungsten trioxide or tungsten phosphoric acid as a source of tungsten. Electolessly deposited metals produced are substantially devoi... | 11/23/2004 |
| 6805915 | Electroless copper plating solution, electroless copper plating process and production process of circuit board An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating re... | 10/19/2004 |
| 6793796 | Electroplating process for avoiding defects in metal features of integrated circuit devices Electroplating methods using an electroplating bath containing metal ions and a suppressor additive, an accelerator additive, and a leveler additive, together with controlling the current density applied to a substrate, avoid defects in plated films on substrates ha... | 09/21/2004 |
| 6740425 | Method for manufacturing copper-resin composite material A method for forming copper-resin composite materials is disclosed. This method affixes a palladium or palladium-tin catalyst onto resin substrate, and then subjects the catalyst-containing resin to an electroless copper plating bath without performing a catalyst ac... | 05/25/2004 |
| 6740222 | Method of manufacturing a printed wiring board having a discontinuous plating layer The present invention provides a method of plating an electrical contact on an integrated circuit (IC) substrate manufactured from a rigid double-sided or multi-layered printed wiring board core with dielectric layers on both sides of the core. The method may includ... | 05/25/2004 |
| 6709803 | Process for producing printed wiring board After forming first catalyst cores on the surfaces of adhesive layers of an insulating substrate, a plating resist is patterned. The insulating substrate is treated with an aqueous solution containing an anionic surfactant. Then, the insulating substrate is soaked s... | 03/23/2004 |
| 6689268 | Copper foil composite including a release layer A composite material includes a structural carrier layer and a relatively thin metal foil layer separated by a release layer. The release layer, that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel ... | 02/10/2004 |
| 6673227 | Process for producing three-dimensional, selectively metallized parts The parts are produced by two-component injection molding. Those regions that are to be metallized consist of a first plastic and those regions that are not to be metallized consist of a second plastic. After the entire surface of the parts has been seede... | 01/06/2004 |
| 6632342 | Methods of fabricating a microstructure array In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the ... | 10/14/2003 |
| 6627118 | Ni alloy particles and method for producing same, and anisotropic conductive film A crystalline Ni alloy particle for an anisotropic conductive film comprising Ni and a metalloid element such as P, B, etc. and having a structure in which a Ni intermetallic compound phase is precipitated can be produced by preparing substantially amorph... | 09/30/2003 |
| 6569491 | Platable dielectric materials for microvia technology A dielectric coating for a circuit board which is adherent to electroless copper. The coating is an epoxy dielectric including an amount of a solubilized nitrile-free butadiene or isoprene agent for promoting adhesion of an electroless copper coating. A m... | 05/27/2003 |
| 6562715 | Barrier layer structure for copper metallization and method of forming the structure A barrier layer structure and a method of forming the structure. The barrier layer structure comprises a bilayer, with a first layer formed by chemical vapor deposition and a second layer formed by physical vapor deposition. The first barrier layer compri... | 05/13/2003 |
| 6533915 | Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil The invention provides a surface-treated copper foil for producing printed wiring boards whose surface has,,been subjected to nodular treatment and anti-corrosion treatment, wherein the anti-corrosion treatment includes forming a-zinc-copper-tin ternary a... | 03/18/2003 |
| 6475644 | Radioactive coating solutions methods, and substrates Radioactive coating solutions and sol-gels, and corresponding methods for making a substrate radioactive by the application of the radioactive coating solutions and sol-gels thereto. The radioactive coating solution comprises at least one carrier metal an... | 11/05/2002 |
| 6468672 | Decorative chrome electroplate on plastics A process for forming a decorative chromium plating on a plastic substrate includes depositing an electrically conductive coating on the plastic substrate, electrodepositing on the electrically conductive coating a high leveling semi-bright nickel electro... | 10/22/2002 |
| 6395164 | Copper seed layer repair technique using electroless touch-up An electroless touch-up process for repairing copper metallization deposited in dual damascene structures with high aspect ratios. An initial copper strike layer is produced by directional deposition techniques such that discontinuous sidewall coverage oc... | 05/28/2002 |
| 6391181 | Articles having a colored metallic coating and process for their manufacture An article includes a colored electroplated metallic coating comprising both nickel and zinc, on an underplate of copper, brass, bright nickel or matt nickel, supported on a metallic or plastic substrate, various colors in the electroplated coating being ... | 05/21/2002 |
| 6387305 | Forming mold cavities A method for producing a multiplicity of miniature cavities extending from a mold surface for molding a plastic product having features integrally molded with and extending from a product base, and a mold so produced. The mold cavities are formed by depos... | 05/14/2002 |
| 6370768 | Circuit board, a method for manufacturing same, and a method of electroless plating A circuit board is provided, wherein electroless plating to fill via-holes can be controlled uniformly with desirable reproducibility, and via-hole portions can be identified from the surface of the substrate after forming a second conductor thereon. The ... | 04/16/2002 |
| 6365030 | Method of manufacturing R-Fe-B bond magnets of high corrosion resistance A method of manufacturing R--Fe--B bonded magnets, capable of forming various corrosion resisting films on a R--Fe--B bonded magnet uniformly with a very high bonded strength so as to attain such a very high corrosion resistance thereof that prevents the ... | 04/02/2002 |
