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| Number | Title | Issue Date |
| 8029660 | Manufacturing method of semiconductor integrated device with inverting plating cup Manufacture of semiconductor products such as LCD driver requires a bump plating step for forming a gold bump electrode having a size of from about 15 to 20 μm. This bump plating step is performed by electroplating with a predetermined plating solution, but project... | 10/04/2011 |
| 7879217 | Method of forming valve metal anode pellets for capacitors using forced convection of liquid electrolyte during anodization A method and apparatus for anodizing a porous valve metal pellet in a flowing liquid electrolyte is described. The apparatus comprises an insulative container comprised of a lower region, a central region including a cavity for holding the pellet, an upper region, a... | 02/01/2011 |
| 7811440 | Plating apparatus and plating method A plating apparatus performs a plating process while placing a work in a pod disposed in a plating bath storing a plating solution. The pod has a pair of meshes that allow the plating solution to pass but substantially inhibit the work from passing. The plating appa... | 10/12/2010 |
| 7404885 | Plating method and electronic device A plating method includes the steps of (a) forming a roughened area in a predetermined area of a substrate, (b) forming a surface-active agent layer above at least the roughened area, (c) forming, above the roughened area, a catalyst layer above the surface-active a... | 07/29/2008 |
| 7351448 | Anti-reflective coating on patterned metals or metallic surfaces An apparatus and process for coating surfaces of metal or metallic components including providing at least one metal having a patterned outer surface exhibiting an optical reflection greater than about 40%, providing at least one anti-reflective coating material, th... | 04/01/2008 |
| 7342773 | Capacitor containing aluminum anode foil anodized in low water content glycerine-phosphate electrolyte A capacitor comprising an aluminum anode and a dielectric layer comprising phosphate doped aluminum oxide and process for making the capacitor. Furthermore, the capacitor is formed by the process of: forming an aluminum plate; pre-hydrating the aluminum; contacting ... | 03/11/2008 |
| 7338586 | Vibratingly stirring apparatus, and device and method for processing using the stirring apparatus An insulated vibration-stirring apparatus comprising a vibration generating means containing a vibration motor and a vibrating member attached to that motor, and a vibrating rod attached by an installation piece to allow vibration linked with the vibration generatin... | 03/04/2008 |
| 7332066 | Apparatus and method for electrochemically depositing metal on a semiconductor workpiece A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material, or enhance an ultra-th... | 02/19/2008 |
| 7285202 | Method for electroplating a cylindrical inside surface of a work-piece-extending substantially over a semi-circle A method is described for electroplating a cylindrical inside surface (4) of a work-piece (3) extending substantially over a semi-circle, with an electrolyte being conveyed from a bath (8) in a circulation through a gap (9) between the in... | 10/23/2007 |
| 7248462 | Method of anodizing valve metal derived anode bodies and electrolyte therefore An electrolyte solution for anodizing a metal and a capacitor comprising the anodized metal. The electrolyte comprises more than about 5%, by weight, and less than about 30%, by weight, water; about 0.1 to 20%, by weight, ionogen and an aprotic polar solvent. The io... | 07/24/2007 |
| 7238244 | Nitriding of iron and steel parts in salt bath having improved corrosion resistance A new nitriding process by using a salt bath to produce iron and steel parts having excellent abrasion resistance and corrosion resistance includes forming an iron lithium complex oxide layer at the outermost surface of the iron part by immersing the iron and steel ... | 07/03/2007 |
| 7229545 | Process for the coating for metallic implant materials A biomimetically produced bone-analogous coating, comprising organic and inorganic main constituents, is suitable for coating metallic implant materials of any desired surfaces. The coating comprises a collagen matrix mineralized with calcium phosphate. ... | 06/12/2007 |
| 7217327 | Method of producing metal member with enhanced corrosion resistance by salt bath nitriding A metal member is produced with enhanced corrosion resistance by salt bath nitriding. Specifically, in a nitriding salt bath containing Li+, Na+ and K+ ions as cation components and CNO− and CO3−− | 05/15/2007 |
| 7195696 | Electrode assembly for electrochemical processing of workpiece The present invention provides a novel system, apparatus, and method to deposit conductive films on a workpiece. A system for electroplating a surface of a workpiece using a process solution is disclosed. The system comprises a solution housing configured to house a... | 03/27/2007 |
| 7166204 | Plating apparatus and method A plating apparatus and method which smoothly perform contact of a plating liquid with a surface of the substrate and which can prevent air bubbles from remaining on the surface to be plated. The plating apparatus includes a plating bath containing a plating liquid ... | 01/23/2007 |
| 7166205 | Method for producing hard surface, colored, anodized aluminum parts The present invention uses a two-step anodizing process to produce a colored anodized coating on the surface of an aluminum part. In accordance with this invention, a thin hard anodized coating layer is first formed on the surface of the aluminum part and then growi... | 01/23/2007 |
| 7125610 | Capacitor containing aluminum anode foil anodized in low water content glycerine-phosphate electrolyte without a pre-anodizing hydration step A capacitor comprising an aluminum anode and a dielectric layer comprising phosphate doped aluminum oxide and process for making the capacitor. The capacitor has a CV Product of at least 9 μF-V/cm2 at 250 volts. Furthermore, the capacitor is formed by th... | 10/24/2006 |
| 7097755 | Electrochemical mechanical processing with advancible sweeper The present invention provides an apparatus for electrochemical mechanical processing of a surface of a workpiece by utilizing a process solution. The apparatus of the present invention includes an electrode touching the process solution, a belt workpiece surface in... | 08/29/2006 |
| 7090751 | Apparatus and methods for electrochemical processing of microelectronic workpieces A processing chamber comprising a reaction vessel having an electro-reaction cell including a virtual electrode unit, an electrode assembly disposed relative to the electro-reaction cell to be in fluid communication with the virtual electrode unit, and an electrode ... | 08/15/2006 |
| 7087143 | Plating system for semiconductor materials A workpiece processing station is disclosed. The workpiece processing station has particular applicability in an electroplating process for semiconductor wafers. The apparatus includes a work processing bowl having an outer bowl and an inner cup positioned at a loca... | 08/08/2006 |
| 7057294 | Semiconductor device Circuit elements are formed in a semiconductor chip (1) and an electrode pad (11) for connection with outside is formed on the periphery of a surface of the semiconductor chip (1). On the other hand, a wiring (21) is formed on one surface... | 06/06/2006 |
| 7045050 | Method for producing electroconductive particles The purpose of the invention is to provide a method for producing conductive fine particles having a plating layer of extremely uniform thickness and free from scratches without being accompanied with agglomeration of fine particles to be plated during the plating p... | 05/16/2006 |
| 7029597 | Anodized aluminum etching process and related apparatus A process for selectively etching a surface of an anodized aluminum article. A preferred process includes: providing an aluminum sheet or web including first and second sides having anodized finishes; etching the first side to improve the adhesion capabilities of th... | 04/18/2006 |
| 7026581 | Apparatus for positioning an elevator tube A wafer support position control mechanism selectively positions a semiconductor wafer along an axis of excursion within a process chamber. An elevator tube protrudes through an orifice in the chamber surface and is connected at a first distal end to the wafer suppo... | 04/11/2006 |
| 7022419 | Composite plating film and a process for forming the same A composite nickel and copper alloy plating film (3) containing nickel and copper. Nickel is of high wear resistance and a nickel alloy improves the wear resistance of the film. Copper is of high resistance of the film. The film may further contain self-lubri... | 04/04/2006 |
| 6984302 | Electroplating cell based upon rotational plating solution flow The invention discloses a method of electroplating a material onto a semiconductor substrate. A substrate is placed in a cylindrical processing chamber enclosure. A nozzle for spraying a liquid electroplating solution opposes the top surface of the substrate. The el... | 01/10/2006 |
| 6974530 | Method and system for controlling ion distribution during plating of a metal on a workpiece surface The flow of electrolyte and/or of ions is controlled by a diffuser element provided in a plating reactor, wherein, in one embodiment, the diffuser element comprises a mechanical adjustment mechanism to adjust the effective size of passages of the diffuser element. I... | 12/13/2005 |
| 6964792 | Methods and apparatus for controlling electrolyte flow for uniform plating The present invention provides apparatus and methods for controlling flow dynamics of a plating fluid during a plating process. The invention achieves this fluid control through use of a diffuser membrane. Plating fluid is pumped through the membrane; the design and... | 11/15/2005 |
| 6958114 | Method and apparatus for forming an electrical contact with a semiconductor substrate The present invention is directed to a method and apparatus for plating a surface of a semiconductor workpiece (wafer, flat panel, magnetic films, etc.) using a liquid conductor that makes contact with the outer surface of the workpiece. The liquid conductor is stor... | 10/25/2005 |
| 6932884 | Substrate processing apparatus A substrate processing apparatus comprises roll chucks for holding and rotating a substrate, a closable chamber housing the roll chucks therein, and a gas introduction pipe for introducing a gas into the chamber. The substrate processing apparatus further comprises ... | 08/23/2005 |
| 6919011 | Complex waveform electroplating A method of electroplating an object includes providing a electroplating bath solution with one or more anodes therein, disposing an object to be electroplated in the bath, and passing a complex current waveform between the anode nodes and the object. The waveform i... | 07/19/2005 |
| 6916413 | Electro-plating apparatus and method Electroplating station S has a head 1 with anode 2, to one side of which there is located an electrically neutral wall 3. The width of anode 2 is provided to accommodate the width of web 6. Serrations 9 are provided on the a... | 07/12/2005 |
| 6899803 | Method and device for the regulation of the concentration of metal ions in an electrolyte and use thereof In order to regulate the metal ion concentration in an electrolyte fluid serving to electrolytically deposit metal and additionally containing substances of an electrochemically reversible redox system, it has been known in the art to conduct at least one portion of... | 05/31/2005 |
| 6896786 | Method and device for producing wear resisting surfaces A process for the production of wear-resistant, coated surfaces includes the use of at least two electrodes connected to a voltages source which are mounted in, or border, a reaction space through which an electrolyte flows in which the surface to be coated is locat... | 05/24/2005 |
| 6896785 | Process and device for forming ceramic coatings on metals and alloys, and coatings produced by this process There is disclosed a process and apparatus for carrying out plasma electrolytic oxidation of metals and alloys, forming ceramic coatings on surfaces thereof at a rate of 2-10 microns per minute. The process comprises the use of high-frequency current pulses of a cer... | 05/24/2005 |
| 6890415 | Reactor vessel having improved cup, anode and conductor assembly An improved anode, cup and conductor assembly for a reactor vessel includes an anode assembly supported within a cup which holds a supply of process fluid. The cup is supported around its perimeter within the reactor vessel. The anode assembly has an anode shield ca... | 05/10/2005 |
| 6878245 | Method and apparatus for reducing organic depletion during non-processing time periods Embodiments of the invention generally provide an apparatus and method for replenishing organic molecules in an electroplating bath. The replenishment process of the present invention may occur on a real-time basis, and therefore, the concentration of organics minim... | 04/12/2005 |
| 6875333 | Plating apparatus for wafer A plating apparatus is provided to allow the whole area of a target plating surface of a wafer to be subjected to more uniform plating treatment and moreover enables a target plating surface of a wider area to be subjected to positive and uniform plating treatment. ... | 04/05/2005 |
| 6869515 | Enhanced electrochemical deposition (ECD) filling of high aspect ratio openings Embodiments of the present invention provide methods for enhancing void-free metallic filling of narrow openings by electrochemical deposition (ECD). The methods provide enhanced replenishment of plating inhibitor at the field, while depleting the inhibitor inside n... | 03/22/2005 |
| 6855239 | Plating method and apparatus using contactless electrode A plating method and apparatus using contactless electrode is described. In one embodiment an inductive element is placed proximally to a substrate and a moving electromagnetic field generates an emf in the substrate to plate the surface. In another embodiment, a co... | 02/15/2005 |
